LT1997I-1 .................................................–40 to 85°C
LT1997H-1 ............................................. –40 to 125°C
Maximum Junction Temperature .......................... 150°C
Storage Temperature Range ......................–65 to 150°C
MSOP Lead Temperature (Soldering, 10 sec)........ 300°C
PIN CONFIGURATION
TOP VIEW
+INA
+INB
NC
+INC
SHDN
REF
1
3
4
5
6
7
15
V–
14 –INA
+INA 1
12 –INB
11 NC
10 –INC
9 V+
8
OUT
+INB 3
+INC
REF1
REF2
V–
5
6
7
8
TOP VIEW
16 –INA
14 –INB
12
11
10
9
–INC
V+
SHDN
OUT
MS PACKAGE
VARIATION: MS16 (12)
16-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 130°C/W
DF PACKAGE
14(12)-LEAD (4mm
×
4mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 45°C/W ,
θ
JC
= 3°C/W
EXPOSED PAD (PIN 15) IS V
–
, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LT1997IDF-1#PBF
LT1997HDF-1#PBF
LT1997IMS-1#PBF
LT1997HMS-1#PBF
TAPE AND REEL
LT1997IDF-1#TRPBF
LT1997HDF-1#TRPBF
LT1997IMS-1#TRPBF
LT1997HMS-1#TRPBF
PART MARKING*
19971
19971
19971
19971
PACKAGE DESCRIPTION
14-Lead (4mm × 4mm) Plastic DFN
14-Lead (4mm × 4mm) Plastic DFN
16-Lead Plastic MSOP
16-Lead Plastic MSOP
SPECIFIED
TEMPERATURE RANGE
–40°C to 85°C
–40°C to 125°C
–40°C to 85°C
–40°C to 125°C
*The temperature grade is identified by a label on the shipping container. Consult ADI Marketing for parts specified with wider operating temperature ranges.
Parts ending with PBF are RoHS and WEEE compliant.
Tape and reel specifications.
Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
Rev 0
For more information
www.analog.com
3
LT1997-1
The
l
denotes the specifications which apply over the full operating
temperature range, –40°C < T
A
< 85°C for I-grade parts, –40°C < T
A
< 125°C for H-grade parts, otherwise specifications are at
T
A
= 25°C. Difference Amplifier Configuration, V
+
= 15V, V
–
= –15V, V
CM
= V
OUT
= V
REF
= V
REF1
= V
REF2
= 0V. V
CMOP
is the common
mode voltage of the internal op amp.
SYMBOL PARAMETER
∆G
Gain Error
MS16 Package
CONDITIONS
V
OUT
= ±10V
G = 10
l
ELECTRICAL CHARACTERISTICS
MIN
TYP
±0.005
±0.01
MAX
±0.012
±0.014
±0.022
±0.028
±0.038
±0.04
±0.017
±0.019
±0.025
±0.03
±0.051
±0.053
±1
±2
±3
±65
±200
±1.5
5
15
3
10
95.7
91.4
88.8
34.8
17.4
7
UNITS
%
%
%
%
%
%
%
%
%
%
%
%
ppm/°C
ppm
ppm
µV
µV
µV/°C
nA
nA
nA
nA
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
G = 20
l
G = 50
l
±0.015
±0.005
l
∆G
Gain Error
DF14 Package
V
OUT
= ±10V
G = 10
G = 20
l
±0.01
±0.015
l
l
l
G = 50
∆G/∆T
GNL
V
OS
∆V
OS
/∆T
I
B
I
OS
R
IN
Gain Drift vs Temperature (Note 6)
Gain Nonlinearity
Op Amp Offset Voltage (Note 9)
Op Amp Offset Voltage Drift (Note 6)
Op Amp Input Bias Current
Op Amp Input Offset Current
Input Impedance (Note 8)
V
OUT
= ±10V
V
OUT
= ±10V
V
–
< V
CMOP
< V
+
– 1.75V
l
±0.2
±1
±20
V
–
< V
V
–
+ 0.25V < V
CMOP
< V
+
– 1.75V
l
CMOP
< V
+
– 1.75V
l
V
–
+ 0.25V < V
CMOP
< V
+
– 1.75V
l
–5
–15
–3
–10
69.3
66.1
64.2
25.2
12.6
5
109
107
84
82
109
107
116
114
107
100
81
78
107
102
111
107
±0.5
±2
±0.5
82.5
78.75
76.5
30
15
6
126
98
128
130
123
96
124
125
CMRR
Common Mode Rejection Ratio
MS16 Package
Common Mode
G = 10
G = 20
G = 50
Differential
G = 10
G = 20
G = 50
G = 10, V
CM
= –15V to +14.575V
G = 10, V
CM
= –15V to +61V, +INC = –INC = 0V
l
l
l
l
l
l
l
l
G = 20, V
CM
= –15V to +13.9125V
l
G = 50, V
CM
= –15V to +13.515V
l
CMRR
Common Mode Rejection Ratio
DF14 Package
G = 10, V
CM
= –15V to +14.575V
l
G = 10, V
CM
= –15V to +61V, +INC = –INC = 0V
l
G = 20, V
CM
= –15V to +13.9125V
l
G = 50, V
CM
= –15V to +13.515V
l
Rev 0
4
For more information
www.analog.com
LT1997-1
The
l
denotes the specifications which apply over the full operating
temperature range, –40°C < T
A
< 85°C for I-grade parts, –40°C < T
A
< 125°C for H-grade parts, otherwise specifications are at
One private network computer (dedicated, cannot install other programs), one external network computer. There is an application on the private network computer. Now we are developing another applicati...
In "Playing with OLED2" https://bbs.eeworld.com.cn/thread-285761-1-1.html , I proudly showed off a full interrupt keyboard I created. In the end, I blamed the Systick for some combo problems (because ...
If the product is suitable, the price is easy to negotiate~~~~ A product of our company needs to integrate a VoIP gateway. Considering the long development cycle, we plan to buy a demo version and int...
At present, more than 95% of China's PLC market is occupied by foreign products. There were research units in China that developed PLC products, but they did not develop due to various reasons. Fortun...
The actual PLC application system is often more complex. Complex systems not only require more PLC input/output points, but also, in order to meet the needs of production, many industrial equipment ne...
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]
In mobile technology, sensors are the primary input for measured signals and form a component of a sensor system. They include sensitive and transducer elements connected to carriers and circuits. ...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]
Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
Linear motor modules have become the "sweet spot" in various fields due to their advantages such as long stroke, fast speed, high precision, smooth operation and long life. Different models of line...[Details]
Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]
introduction
Inverter air conditioners are a trend in the current era and have gradually become commonplace in countless households. Beyond their basic cooling and heating functions, air condi...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
