Maximum Junction Temperature (Note 2)............. 125°C
Operating Temperature Range (Note 3)
LT3475E/LT3475E-1 ............................. –40°C to 85°C
LT3475I/LT3475I-1 ............................. –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature Range (Soldering, 10 sec) ....... 300°C
ORDER INFORMATION
LEAD FREE FINISH
LT3475EFE#PBF
LT3475IFE#PBF
LT3475EFE-1#PBF
LT3475IFE-1#PBF
TAPE AND REEL
LT3475EFE#TRPBF
LT3475IFE#TRPBF
LT3475EFE-1#TRPBF
LT3475IFE-1#TRPBF
PART MARKING*
LT3475EFE
LT3475IFE
LT3475FE-1
LT3475FE-1
PACKAGE DESCRIPTION
20-Lead Plastic TSSOP
20-Lead Plastic TSSOP
20-Lead Plastic TSSOP
20-Lead Plastic TSSOP
TEMPERATURE RANGE
–40°C to 85°C
–40°C to 125°C
–40°C to 85°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
The
●
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V, V
BOOST
= 16V, V
OUT
= 4V unless otherwise noted (Note 3)
PARAMETER
Minimum Input Voltage
Input Quiescent Current
Shutdown Current
Not Switching
SHDN = 0.3V, V
BOOST
= V
OUT
= 0V
CONDITIONS
●
ELECTRICAL CHARACTERISTICS
2
U
W W
W
PIN CONFIGURATION
OUT1
LED1
BOOST1
SW1
V
IN
V
IN
SW2
BOOST2
LED2
1
2
3
4
5
6
7
8
9
21
20 PWM1
19 V
ADJ1
18 V
C1
17 REF
16 SHDN
15 GND
14 R
T
13 V
C2
12 V
ADJ2
11 PWM2
OUT2 10
FE PACKAGE
20-LEAD PLASTIC TSSOP
T
JMAX
= 125°C,
θ
JA
= 30°C/W,
θ
JC
= 8°C/W
EXPOSED PAD (PIN 21) IS GROUND AND MUST
BE ELECTRICALLY CONNECTED TO THE PCB.
MIN
TYP
3.7
6
0.01
MAX
4
8
2
UNITS
V
mA
μA
3475fb
LT3475/LT3475-1
ELECTRICAL CHARACTERISTICS
PARAMETER
LED Pin Current
The
●
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V, V
BOOST
= 16V, V
OUT
= 4V unless otherwise noted (Note 3)
CONDITIONS
V
ADJ
Tied to V
REF
• 2/3
V
ADJ
Tied to V
REF
• 7/30
LT3475E/LT3475E-1 0°C to 85°C
●
●
MIN
0.97
0.94
0.336
0.325
0.31
1.22
TYP
1.00
0.350
MAX
1.03
1.04
0.364
0.375
0.385
1.27
UNITS
A
A
A
A
A
V
%/V
%/μA
REF Voltage
Reference Voltage Line Regulation
Reference Voltage Load Regulation
V
ADJ
Pin Bias Current (Note 4)
Switching Frequency
Maximum Duty Cycle
R
T
= 24.3k
R
T
= 24.3k
R
T
= 4.32k
R
T
= 100k
R
T
= 24.3k
R
T
= 24.3k, V
OUT
= 0V
4V < V
IN
< 40V
0 < I
REF
< 500μA
●
1.25
0.05
0.0002
●
●
●
40
530
90
600
95
80
98
180
80
2.5
2.6
9
0.8
0.8
50
50
500
1
2.6
1.8
400
640
nA
kHz
%
%
%
Switching Phase
Foldback Frequency
SHDN Threshold (to Switch)
SHDN Pin Current (Note 5)
PWM Threshold
V
C
Switching Threshold
V
C
Source Current
V
C
Sink Current
LED to V
C
Transresistance
LED to V
C
Current Gain
V
C
to Switch Current Gain
V
C
Clamp Voltage
V
C
Pin Current in PWM Mode
OUT Pin Clamp Voltage (LT3475)
OUT Pin Current in PWM Mode
Switch Current Limit (Note 6)
Switch V
CESAT
BOOST Pin Current
Switch Leakage Current
Minimum Boost Voltage Above SW
150
210
2.74
11
1.2
Deg
kHz
V
μA
V
V
μA
μA
V/A
mA/μA
A/V
V
V
SHDN
= 2.6V
7
0.3
V
C
= 1V
V
C
= 1V
V
C
= 1V, V
PWM
= 0.3V
V
OUT
= 4V, V
PWM
= 0.3V
I
SW
=1.5A
I
SW
=1.5A
●
10
13.5
14
25
2.3
2.7
350
25
0.1
1.8
400
14.5
50
3.2
500
40
10
2.5
nA
V
μA
A
mV
mA
μA
V
●
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
Note 3:
The LT3475E and LT3475E-1 are guaranteed to meet performance
specifications from 0°C to 85°C. Specifications over the –40°C to 85°C
operating temperature range are assured by design, characterization and
correlation with statistical process controls. The LT3475I and LT3475I-1
are guaranteed to meet performance specifications over the –40°C to
125°C operating temperature range.
Note 4:
Current flows out of pin.
Note 5:
Current flows into pin.
Note 6:
Current limit is guaranteed by design and/or correlation to static
test. Slope compensation reduces current limit at higher duty cycles.
3475fb
3
LT3475/LT3475-1
TYPICAL PERFOR A CE CHARACTERISTICS
LED Current vs V
ADJ
1.50
1.25
LED CURRENT (A)
LED CURRENT (A)
1.00
0.75
0.50
0.25
0
0
0.25
0.5
0.75
V
ADJ
(V)
1
1.25
3475 G01
T
A
= 25°C
SWITCH ON VOLTAGE (mV)
Switch Current Limit
vs Duty Cycle
3.0
2.5
CURRENT LIMIT (A)
2.0
1.5
1.0
0.5
0
0
20
40
60
DUTY CYCLE (%)
T
A
= 25°C
80
100
3475 G04
TYPICAL
CURRENT LIMIT (A)
CURRENT LIMIT (A)
MINIMUM
Oscillator Frequency
vs Temperature
700
OSCILLATOR FREQUENCY (kHz)
650
600
550
500
450
400
–50 –25
R
T
= 24.3kΩ
OSCILLATOR FREQUENCY (kHz)
700
600
500
400
300
200
100
0
50
25
75
0
TEMPERATURE (˚C)
100
125
OSCILLATOR FREQUENCY (kHz)
4
U W
LED Current vs Temperature
1.2
V
ADJ
= V
REF
• 2/3
1.0
0.8
0.6
0.4
0.2
0
–50 –25
V
ADJ
= V
REF
• 7/30
600
500
400
300
200
100
0
50
25
75
0
TEMPERATURE (˚C)
100
125
Switch On Voltage
T
A
= 25°C
0
1.5
0.5
1.0
SWITCH CURRENT (A)
2.0
3475 G03
3475 G02
Switch Current Limit vs
Temperature
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–50 –25
3.0
2.5
2.0
1.5
1.0
0.5
0
Current Limit vs Output Voltage
T
A
= 25°C
50
25
75
0
TEMPERATURE (°C)
100
125
0
0.5
1.0
1.5 2.0 2.5
V
OUT
(V)
3.0
3.5
4.0
3475 G05
3475 G06
Oscillator Frequency Foldback
T
A
= 25°C
R
T
= 24.3kΩ
1000
Oscillator Frequency vs R
T
T
A
= 25°C
10
0
0.5
1.0
1.5
2.0
2.5
3475 G08
1
V
OUT
(V)
3475 G07
10
R
T
(kΩ)
100
3475 G09
3475fb
LT3475/LT3475-1
TYPICAL PERFOR A CE CHARACTERISTICS
Boost Pin Current
35
30
BOOST PIN CURRENT (mA)
INPUT CURRENT (mA)
25
20
15
10
5
0
0
0.5
1.5
SWITCH CURRENT (A)
1.0
2.0
3475 G10
T
A
= 25°C
5
4
3
2
1
0
0
10
20
V
IN
(V)
3475 G11
OUTPUT VOLTAGE (V)
Reference Voltage
1.28
1.27
1.26
V
REF
(V)
1.25
1.24
1.23
1.22
–50 –25
V
IN
(V)
6
5
4
3
2
1
0
V
IN
(V)
50
25
75
0
TEMPERATURE (˚C)
PI FU CTIO S
OUT1, OUT2 (Pins 1, 10):
The OUT pin is the input to the
current sense resistor. Connect this pin to the inductor
and the output capacitor.
LED1, LED2 (Pins 2, 9):
The LED pin is the output of
the current sense resistor. Connect the anode of the LED
here.
V
IN
(Pins 5, 6):
The V
IN
pins supply current to the internal
circuitry and to the internal power switches and must be
locally bypassed.
SW1, SW2 (Pins 4, 7):
The SW pin is the output of the
internal power switch. Connect this pin to the inductor,
switching diode and boost capacitor.
3475fb
U W
100
3475 G13
Quiescent Current
7
6
T
A
= 25°C
50
45
40
35
30
25
20
15
10
5
30
40
0
Open-Circuit Output Voltage and
Input Current
T
A
= 25°C
14
INPUT CURRENT
LT3475-1
12
INPUT CURRENT (mA)
10
LT3475
8
LT3475-1
OUTPUT VOLTAGE
LT3475
6
4
2
0
0
10
20
V
IN
(V)
30
40
3475 G12
Minimum Input Voltage, Single
1.5A White LED
T
A
= 25°C
TO START
9
TO RUN
10
Minimum Input Voltage, Two Series
Connected 1.5A White LEDs
T
A
= 25°C
LED VOLTAGE
8
TO START
LED VOLTAGE
TO RUN
7
6
125
5
0
0.5
1
LED CURRENT (A)
1.5
3475 G14
0
0.5
1
LED CURRENT (A)
1.5
3475 G15
U
U
U
BOOST1, BOOST2 (Pins 3, 8):
The BOOST pin is used to
provide a drive voltage, higher than the input voltage, to
the internal bipolar NPN power switch.
GND (Pins 15, Exposed Pad Pin 21):
Ground. Tie the GND
pin and the exposed pad directly to the ground plane. The
exposed pad metal of the package provides both electrical
contact to ground and good thermal contact to the printed
circuit board. The exposed pad must be soldered to the
circuit board for proper operation. Use a large ground plane
[size=5] I am working on a project recently, using the msp430fr5969 chip. In order to reduce the time consumed in the interrupt, I expanded a for(i=0;i<8;i++) loop statement in the interrupt (the purp...
If you want to buy chips in quantities of 30 to 50 pieces, it is best to find an agent or its distributor to buy them, or find some good trading platforms, such as Hong Kong Electronic Inventory Netwo...
Usually, remote debugging is done in the telnet environment, and the input and output devices are virtual terminals. [font=宋体][root@TR600-Plus ~]# ls -l /proc/: /fd[/font] [font=宋体]total 0[/font] [fon...
I guess most companies have started their holidays, and I noticed that there are fewer cars on the road. This year, our company has a late holiday, but we are still holding on!...
[i=s]This post was last edited by eagler8 on 2022-6-17 12:52[/i]As a quad-core single-board microcomputer, the Xingkong board can run complete Python and also experience a large number of Python libra...
Introduction: This application note describes the ADN2891 evaluation board. The ADN2891 limiting amplifier is used as a data quantizer for SONET, Gigabit Ethernet (GbE), and Fibre Channel optical rece...
The intelligent driving community has its own rhythm. Some are busy pushing new versions and focusing on R&D, others are busy with publicity and promotion, and still others are immersed in mass pro...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
New energy vehicles are increasingly popular with consumers due to policies and energy conservation. Once you've purchased your vehicle, maintenance is essential. However, due to the different powe...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
The digital TV set-top box consists of a tuner, QAM demodulator, TS demultiplexer, MPEG-2 decoder, PAUNTSC video encoder, embedded CPU system and peripheral interfaces, CA module, and uplink data m...[Details]
Based on the commutation technology, thyristor rectifiers are classified into two main types. Line-commutated and force-commutated inverters are commonly used, while other commutated inverters, nam...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
As in-vehicle audio and video entertainment features become increasingly diverse, the demand for digital transmission of audio and video information is urgent. Traditional protocols such as IEEE 13...[Details]
On August 19, Reuters reported that people familiar with the matter said that Nvidia is developing a new AI chip based on its latest Blackwell architecture for the Chinese market. The performance o...[Details]
According to the latest financial report data, thanks to its leading position in advanced technology, TSMC's profit performance in the second quarter of 2025 was extremely impressive, with net prof...[Details]
Mathematical functions are very important and are used in many situations such as analog quantity processing and PID control.
(12) Calculate sine value instruction (SIN)
The "Calculate Si...[Details]
The basic structure of the power grid dispatching automation system includes three parts: control center, master station system, plant terminal (RTU) and information channel. According to the diffe...[Details]
Silicon carbide (SiC) power switching devices are becoming a popular choice for industrial battery applications due to their ability to achieve faster switching speeds and superior low-loss operati...[Details]