Operating Temperature Range (Note 4)....–40°C to 85°C
Specified Temperature Range (Note 5) ....–40°C to 85°C
Junction Temperature ........................................... 150°C
Junction Temperature (DD Package).................... 125°C
Storage Temperature Range...................–65°C to 150°C
Storage Temperature Range
(DD Package) ........................................ – 65°C to 125°C
Lead Temperature (Soldering, 10 sec) .................. 300°C
pin conFiguraTion
TOP VIEW
OUT 1
V
–
2
+IN 3
6 V
+
5
SHDN
4 –IN
SHDN
1
–IN 2
+IN 3
V
–
4
–
+
TOP VIEW
8 NC
+
7 V
6 OUT
5 NC
S6 PACKAGE
6-LEAD PLASTIC TSOT-23
T
JMAX
= 150°C,
θ
JA
= 160°C/W (Note 10)
S8 PACKAGE
8-LEAD PLASTIC SO
T
JMAX
= 150°C,
θ
JA
= 100°C/W
TOP VIEW
TOP VIEW
OUT A 1
–IN A 2
+IN A 3
V
–
4
A
B
8
7
6
5
V
+
OUT B
–IN B
+IN B
OUT A 1
–IN A 2
+IN A 3
V
–
4
–
+
–
+
+
8 V
7 OUT B
6 –IN B
5 +IN B
DD PACKAGE
8-LEAD (3mm
×
3mm) PLASTIC DFN
S8 PACKAGE
8-LEAD PLASTIC SO
T
JMAX
= 150°C,
θ
JA
= 160°C/W (NOTE 3)
UNDERSIDE METAL CONNECTED TO V
–
T
JMAX
= 150°C,
θ
JA
= 100°C/W
orDer inForMaTion
LEAD FREE FINISH
LT6200CS6#PBF
LT6200IS6#PBF
LT6200CS6-5#PBF
LT6200IS6-5#PBF
LT6200CS6-10#PBF
LT6200IS6-10#PBF
LT6200CS8#PBF
LT6200IS8#PBF
LT6200CS8-5#PBF
LT6200IS8-5#PBF
TAPE AND REEL
LT6200CS6#TRPBF
LT6200IS6#TRPBF
LT6200CS6-5#TRPBF
LT6200IS6-5#TRPBF
LT6200CS6-10#TRPBF
LT6200IS6-10#TRPBF
LT6200CS8#TRPBF
LT6200IS8#TRPBF
LT6200CS8-5#TRPBF
LT6200IS8-5#TRPBF
PART MARKING*
LTJZ
LTJZ
LTACB
LTACB
LTACC
LTACC
6200
6200I
62005
6200I5
PACKAGE DESCRIPTION
6-Lead Plastic TSOT-23
6-Lead Plastic TSOT-23
6-Lead Plastic TSOT-23
6-Lead Plastic TSOT-23
6-Lead Plastic TSOT-23
6-Lead Plastic TSOT-23
8-Lead Plastic SO
8-Lead Plastic SO
8-Lead Plastic SO
8-Lead Plastic SO
SPECIFIED
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
62001ff
2
LT6200/LT6200-5
LT6200-10/LT6201
orDer inForMaTion
LEAD FREE FINISH
LT6200CS8-10#PBF
LT6200IS8-10#PBF
LT6201CDD#PBF
LT6201CS8#PBF
LT6201IS8 #PBF
TAPE AND REEL
LT6200CS8-10#TRPBF
LT6200IS8-10#TRPBF
LT6201CDD #TRPBF
LT6201CS8 #TRPBF
LT6201IS8 #TRPBF
PART MARKING*
620010
200I10
LADG
6201
6201I
PACKAGE DESCRIPTION
8-Lead Plastic SO
8-Lead Plastic SO
8-Lead (3mm
×
3mm) Plastic DFN
8-Lead Plastic SO
8-Lead Plastic SO
SPECIFIED
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
elecTrical characTerisTics
unless otherwise noted.
SYMBOL
V
OS
PARAMETER
Input Offset Voltage
T
A
= 25°C, V
S
= 5V, 0V; V
S
= 3V, 0V; V
CM
= V
OUT
= half supply, V
SHDN
= OPEN,
CONDITIONS
V
S
= 5V, V
CM
= Half Supply
V
S
= 3V, V
CM
= Half Supply
V
S
= 5V, V
CM
= V
+
to V
–
V
S
= 3V, V
CM
= V
+
to V
–
MIN
TYP
0.1
0.9
0.6
1.8
0.2
0.5
–40
–50
–10
8
–23
31
0.3
0.1
0.02
0.4
600
1.1
1.5
2.2
3.5
0.57
2.1
3.1
4.2
70
11
17
65
85
60
80
60
65
2.5
120
18
70
90
112
85
105
68
100
2.4
MAX
1
2.5
2
4
1.1
2.2
18
68
5
4
4
5
UNITS
mV
mV
mV
mV
mV
mV
µA
µA
µA
µA
µA
µA
µA
µA
nV
P-P
nV/√Hz
nV/√Hz
pA/√Hz
pA/√Hz
MΩ
kΩ
pF
pF
V/mV
V/mV
V/mV
dB
dB
dB
dB
dB
dB
V
62001ff
Input Offset Voltage Match
(Channel-to-Channel) (Note 11)
I
B
∆I
B
I
OS
Input Bias Current
V
CM
= Half Supply
V
CM
= V
–
to V
+
V
CM
= Half Supply
V
CM
= V
+
V
CM
= V
–
V
CM
V
CM
= V
–
to V
+
= V
–
to V
+
I
B
Shift
I
B
Match (Channel-to-Channel) (Note 11)
Input Offset Current
V
CM
= Half Supply
V
CM
= V
+
V
CM
= V
–
0.1Hz to 10Hz
f = 100kHz, V
S
= 5V
f = 10kHz, V
S
= 5V
Input Noise Voltage
e
n
i
n
Input Noise Voltage Density
Input Noise Current Density, Balanced Source
f = 10kHz, V
S
= 5V
Unbalanced Source f = 10kHz, V
S
= 5V
Input Resistance
Common Mode
Differential Mode
Common Mode
Differential Mode
V
S
= 5V, V
O
= 0.5V to 4.5V, R
L
= 1k to V
S
/2
V
S
= 5V, V
O
= 1V to 4V, R
L
= 100Ω to V
S
/2
V
S
= 3V, V
O
= 0.5V to 2.5V, R
L
= 1k to V
S
/2
V
S
= 5V, V
CM
= V
–
to V
+
V
S
= 5V, V
CM
= 1.5V to 3.5V
V
S
= 3V, V
CM
= V
–
to V
+
V
S
= 5V, V
CM
= 1.5V to 3.5V
V
S
= 2.5V to 10V, LT6201DD V
S
= 2.5V to 7V
V
S
= 2.5V to 10V, LT6201DD V
S
= 2.5V to 7V
C
IN
A
VOL
CMRR
Input Capacitance
Large-Signal Gain
Common Mode Rejection Ratio
CMRR Match (Channel-to-Channel) (Note 11)
PSRR
Power Supply Rejection Ratio
PSRR Match (Channel-to-Channel) (Note 11)
Minimum Supply Voltage (Note 6)
3
LT6200/LT6200-5
LT6200-10/LT6201
elecTrical characTerisTics
unless otherwise noted.
SYMBOL
V
OL
PARAMETER
Output Voltage Swing LOW (Note 7)
T
A
= 25°C, V
S
= 5V, 0V; V
S
= 3V, 0V; V
CM
= V
OUT
= half supply, V
SHDN
= OPEN,
CONDITIONS
No Load
I
SINK
= 5mA
V
S
= 5V, I
SINK
= 20mA
V
S
= 3V, I
SINK
= 20mA
No Load
I
SOURCE
= 5mA
V
S
= 5V, I
SOURCE
= 20mA
V
S
= 3V, I
SOURCE
= 20mA
V
S
= 5V
V
S
= 3V
V
S
= 5V
V
S
= 3V
V
SHDN
= 0.3V
V
SHDN
= 0.3V
V
+
–0.5
V
SHDN
= 0.3V
V
SHDN
= 0.3V to 4.5V, R
L
= 100Ω, V
S
= 5V
V
SHDN
= 4.5V to 0.3V, R
L
= 100Ω, V
S
= 5V
Frequency = 1MHz, V
S
= 5V
LT6200, LT6201
LT6200-5
LT6200-10
V
S
= 5V, A
V
= –1, R
L
= 1k, V
O
= 4V
LT6200, LT6201
V
S
= 5V, A
V
= –10, R
L
= 1k, V
O
= 4V
LT6200-5
LT6200-10
31
0.1
180
180
145
750
1450
44
210
340
3.28
4.66
165
75
±60
±50
MIN
TYP
9
50
150
160
55
95
220
240
±90
±80
16.5
15
1.3
200
20
18
1.8
280
0.3
MAX
50
100
290
300
110
190
400
450
UNITS
mV
mV
mV
mV
mV
mV
mV
mV
mA
mA
mA
mA
mA
µA
V
V
µA
ns
ns
MHz
MHz
MHz
V/µs
V/µs
V/µs
MHz
ns
V
OH
Output Voltage Swing HIGH (Note 7)
I
SC
I
S
I
SHDN
V
L
V
H
t
ON
t
OFF
GBW
Short-Circuit Current
Supply Current per Amplifier
Disabled Supply Current per Amplifier
SHDN
Pin Current
V
SHDN
Pin Input Voltage LOW
V
SHDN
Pin Input Voltage HIGH
Shutdown Output Leakage Current
Turn-On Time
Turn-Off Time
Gain Bandwidth Product
SR
Slew Rate
FPBW
t
S
Full Power Bandwidth (Note 9)
Settling Time (LT6200, LT6201)
V
S
= 5V, V
OUT
= 3V
P-P
(LT6200)
0.1%, V
S
= 5V, V
STEP
= 2V, A
V
= –1, R
L
= 1k
The
●
denotes the specifications which apply over 0°C < T
A
< 70°C temperature range. V
S
= 5V, 0V; V
S
= 3V, 0V; V
CM
= V
OUT
= half supply,
V
SHDN
= OPEN, unless otherwise noted.
SYMBOL
V
OS
PARAMETER
Input Offset Voltage
CONDITIONS
V
S
= 5V, V
CM
= Half Supply
V
S
= 3V, V
CM
= Half Supply
V
S
= 5V, V
CM
= V
+
to V
–
V
S
= 3V, V
CM
= V
+
to V
–
Input Offset Voltage Match
(Channel-to-Channel) (Note 11)
V
OS
TC
I
B
Input Offset Voltage Drift (Note 8)
Input Bias Current
V
CM
= Half Supply
V
CM
= V
–
to V
+
V
CM
= Half Supply
V
CM
= Half Supply
V
CM
= V
+
V
CM
= V
–
V
CM
= V
–
to V
+
V
CM
= V
–
to V
+
V
CM
= Half Supply
V
CM
= V
+
V
CM
= V
–
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
MIN
TYP
0.2
1
0.3
1.5
0.2
0.4
2.5
MAX
1.2
2.7
3
4
1.8
2.8
8
18
6
68
4
4
5
UNITS
mV
mV
mV
mV
mV
mV
µV/ºC
µA
µA
µA
µA
µA
µA
µA
µA
62001ff
–40
–50
–10
8
–23
0.5
31
0.1
0.02
0.4
I
B
Match (Channel-to-Channel) (Note 11)
∆I
B
I
OS
I
B
Shift
Input Offset Current
4
LT6200/LT6200-5
LT6200-10/LT6201
The
●
denotes the specifications which apply over 0°C < T
A
< 70°C
temperature range. V
S
= 5V, 0V; V
S
= 3V, 0V; V
CM
= V
OUT
= half supply, V
SHDN
= OPEN, unless otherwise noted.
SYMBOL
A
VOL
CMRR
PARAMETER
Large-Signal Gain
CONDITIONS
V
S
= 5V, V
O
= 0.5V to 4.5V,R
L
= 1k to V
S
/2
V
S
= 5V, V
O
= 1.5V to 3.5V,R
L
= 100Ω to V
S
/2
V
S
= 3V, V
O
= 0.5V to 2.5V,R
L
= 1k to V
S
/2
V
S
= 5V, V
CM
= V
–
to V
+
V
S
= 5V, V
CM
= 1.5V to 3.5V
V
S
= 3V, V
CM
= V
–
to V
+
V
S
= 5V, V
CM
= 1.5V to 3.5V
V
S
= 3V to 10V, LT6201DD V
S
= 3V to 7V
V
S
= 3V to 10V, LT6201DD V
S
= 3V to 7V
No Load
I
SINK
= 5mA
V
S
= 5V, I
SINK
= 20mA
V
S
= 3V, I
SINK
= 20mA
No Load
I
SOURCE
= 5mA
V
S
= 5V, I
SOURCE
= 20mA
V
S
= 3V, I
SOURCE
= 20mA
V
S
= 5V
V
S
= 3V
V
S
= 5V
V
S
= 3V
V
SHDN
= 0.3V
V
SHDN
= 0.3V
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
elecTrical characTerisTics
MIN
46
7.5
13
64
80
60
80
60
60
3
TYP
80
13
22
88
105
83
105
65
100
12
55
170
170
65
115
260
270
MAX
UNITS
V/mV
V/mV
V/mV
dB
dB
dB
dB
dB
dB
V
Common Mode Rejection Ratio
CMRR Match (Channel-to-Channel) (Note 11)
PSRR
Power Supply Rejection Ratio
PSRR Match (Channel-to-Channel) (Note 11)
Minimum Supply Voltage (Note 6)
V
OL
Output Voltage Swing LOW (Note 7)
60
110
310
310
120
210
440
490
mV
mV
mV
mV
mV
mV
mV
mV
mA
mA
V
OH
Output Voltage Swing HIGH (Note 7)
I
SC
I
S
Short-Circuit Current
Supply Current per Amplifier
Disabled Supply Current per Amplifier
±60
±45
±90
±75
20
19
1.35
215
23
22
1.8
295
0.3
mA
mA
mA
µA
V
V
µA
ns
ns
V/µs
V/µs
V/µs
MHz
I
SHDN
V
L
V
H
t
ON
t
OFF
SR
SHDN
Pin Current
V
SHDN
Pin Input Voltage LOW
V
SHDN
Pin Input Voltage HIGH
Shutdown Output Leakage Current
Turn-On Time
Turn-Off Time
Slew Rate
V
+
–0.5
0.1
180
180
29
42
190
310
3.07
4.45
75
V
SHDN
= 0.3V
V
SHDN
= 0.3V to 4.5V, R
L
= 100Ω, V
S
= 5V
V
SHDN
= 4.5V to 0.3V, R
L
= 100Ω, V
S
= 5V
V
S
= 5V, A
V
= –1, R
L
= 1k, V
O
= 4V
LT6200, LT6201
V
S
= 5V, A
V
= –10, R
L
= 1k, V
O
= 4V
LT6200-5
LT6200-10
l
l
l
l
l
l
l
FPBW
Full Power Bandwidth (Note 9)
V
S
= 5V, V
OUT
= 3V
P-P
(LT6200)
The
●
denotes the specifications which apply over –40°C < T
A
< 85°C temperature range. Excludes the LT6201 in the DD package (Note 3).
Company: Shenzhen Artel Nanjing R&D Center (under construction) Address: Room 301, North Building 15, Window of the World Software Park, No. 12 Dinghuaimen, Gulou District, Nanjing TEL: 025-83752651 W...
The concept of Intelligent Transportation System (ITS) was proposed by the Intelligent Transportation Society of the United States in 1990. It integrates advanced information technology, communication...
Ask about the problem of embedding assembly in C in Tornado programming I added the assembly operation of turning on the watchdog in the C program as follows: (referenced from the DX article on the fo...
CPU: OMAP730B ROM: M-Systems DiskOnChip G3 MD4832-d512-V3Q18 RAM: HY25L256160AC-7.5 I already have the bootloader file and this bare board. What specific equipment do I need, how do I connect it, and ...
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]
On August 20, Huawei Device announced that the all-new M7 is the first to feature an in-cabin laser vision solution. This solution offers enhanced active safety capabilities compared to primary vis...[Details]
In camera and display systems, the demand for high-performance and low-power data interfaces is driving continuous technological evolution. The evolution of MIPI D-PHY and MIPI C-PHY clearly ...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]