an internal reference and a fully differential sample-and-
hold circuit to reduce common mode noise. The LTC2301/
LTC2305 operate from an internal clock to achieve a fast
1.3μs conversion time.
The LTC2301/LTC2305 operate from a single 5V supply
and draw just 300μA at a throughput rate of 1ksps. The
ADC enters nap mode when not converting, reducing the
power dissipation.
The LTC2301/LTC2305 are available in small 12-pin
4mm
×
3mm DFN and 12-pin MSOP packages. The in-
ternal 2.5V reference further reduces PCB board space
requirements.
The low power consumption and small size make the
LTC2301/LTC2305 ideal for battery operated and portable
applications, while the 2-wire I
2
C compatible serial interface
makes these ADCs a good match for space-constrained
systems.
12-Bit I
2
C ADC Family
Input Channels
Part Number
1
LTC2301
2
LTC2305
8
LTC2309
12-Bit Resolution
Low Power: 1.5mW at 1ksps, 35μW Sleep Mode
14ksps Throughput Rate
Internal Reference
Low Noise: SNR = 73.5dB
Guaranteed No Missing Codes
Single 5V Supply
2-wire I
2
C Compatible Serial Interface with 9
Addresses Plus One Global for Synchronization
Fast Conversion Time: 1.3μs
1-Channel (LTC2301) and 2-Channel (LTC2305)
Versions
Unipolar or Bipolar Input Ranges (Software
Selectable)
Internal Conversion Clock
Guaranteed Operation from –40°C to 125°C
(MSOP Package)
12-Pin 4mm
×
3mm DFN and 12-Pin MSOP
Packages
APPLICATIONS
n
n
n
n
n
n
Industrial Process Control
Motor Control
Accelerometer Measurements
Battery Operated Instruments
Isolated and/or Remote Data Acquisition
Power Supply Monitoring
L,
LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
BLOCK DIAGRAM
10μF
LTC2301
LTC2305
CH0(IN
+
)
ANALOG INPUT
0V TO 4.096V UNIPOLAR CH1(IN
+
)
±2.048V BIPOLAR
ANALOG
INPUT
MUX
+
–
5V
0.1μF
Integral Nonlinearity vs Output Code (LTC2305)
1.00
0.75
V
DD
AD1
AD0
SCL
SDA
V
REF
2.2μF
INL (LSB)
REFCOMP
10μF
0.50
0.25
0.00
–0.25
–0.50
–0.75
12-BIT
SAR ADC
I
2
C
PORT
INTERNAL
2.5V REF
PIN NAMES IN PARENTHESES
REFER TO LTC2301
GND
23015 TA01a
–1.00
0.1μF
0
1024
2048
3072
OUTPUT CODE
4096
23015 TA01b
23015fb
1
LTC2301/LTC2305
ABSOLUTE MAXIMUM RATINGS
(Notes 1, 2)
Supply Voltage (V
DD
) ................................ –0.3V to 6.0V
Analog Input Voltage (Note 3)
CH0(IN
+
), CH1(IN
–
),
REF, REFCOMP .............(GND – 0.3V) to (V
DD
+ 0.3V)
Digital Input Voltage..........(GND – 0.3V) to (V
DD
+ 0.3V)
Digital Output Voltage .......(GND – 0.3V) to (V
DD
+ 0.3V)
Power Dissipation ...............................................500mW
Operating Temperature Range
LTC2301C/LTC2305C ............................... 0°C to 70°C
LTC2301I/LTC2305I.............................. –40°C to 85°C
LTC2301H/LTC2305H (Note 13) ......... –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
PIN CONFIGURATION
LTC2305
TOP VIEW
GND
SDA
SCL
GND
CH0
CH1
1
2
3
4
5
6
13
12 AD0
11 AD1
10 V
DD
9
8
7
GND
REFCOMP
V
REF
GND
SDA
SCL
GND
IN
+
LTC2301
TOP VIEW
1
2
3
4
5
6
13
12 AD0
11 AD1
10 V
DD
9
8
7
GND
REFCOMP
V
REF
IN
–
DE PACKAGE
12-LEAD (4mm
×
3mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
LTC2305
TOP VIEW
GND
SDA
SCL
GND
CH0
CH1
1
2
3
4
5
6
12
11
10
9
8
7
AD0
AD1
V
DD
GND
REFCOMP
V
REF
LTC2301
DE PACKAGE
12-LEAD (4mm
×
3mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
TOP VIEW
GND
SDA
SCL
GND
IN
+
IN
–
1
2
3
4
5
6
12
11
10
9
8
7
AD0
AD1
V
DD
GND
REFCOMP
V
REF
MS PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 130°C/W
MS PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 130°C/W
ORDER INFORMATION
LEAD FREE FINISH
LTC2301CDE#PBF
LTC2301IDE#PBF
LTC2305CDE#PBF
LTC2305IDE#PBF
LTC2301CMS#PBF
LTC2301IMS#PBF
LTC2301HMS#PBF
LTC2305CMS#PBF
TAPE AND REEL
LTC2301CDE#TRPBF
LTC2301IDE#TRPBF
LTC2305CDE#TRPBF
LTC2305IDE#TRPBF
LTC2301CMS#TRPBF
LTC2301IMS#TRPBF
LTC2301HMS#TRPBF
LTC2305CMS#TRPBF
PART MARKING*
2301
2301
2305
2305
2301
2301
2301
2305
PACKAGE DESCRIPTION
12-Lead (3mm
×
4mm) Plastic DFN
12-Lead (3mm
×
4mm) Plastic DFN
12-Lead (3mm
×
4mm) Plastic DFN
12-Lead (3mm
×
4mm) Plastic DFN
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
–40°C to 125°C
0°C to 70°C
23015fb
2
LTC2301/LTC2305
ORDER INFORMATION
LEAD FREE FINISH
LTC2305IMS#PBF
LTC2305HMS#PBF
TAPE AND REEL
LTC2305IMS#TRPBF
LTC2305HMS#TRPBF
PART MARKING*
2305
2305
PACKAGE DESCRIPTION
12-Lead Plastic MSOP
12-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 85°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
CONVERTER AND MULTIPLEXER CHARACTERISTICS
The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
PARAMETER
Resolution (No Missing Codes)
Integral Linearity Error
Differential Linearity Error
Bipolar Zero Error
Bipolar Zero Error Drift
Unipolar Zero Error
Unipolar Zero Error Drift
Unipolar Zero Error Match (LTC2305)
Bipolar Full-Scale Error
Bipolar Full-Scale Error Drift
Unipolar Full-Scale Error
Unipolar Full-Scale Error Drift
Unipolar Full-Scale Error Match (LTC2305)
External Reference (Note 7)
REFCOMP = 4.096V (Note 7)
External Reference
External Reference (Note 7)
REFCOMP = 4.096V (Note 7)
External Reference
l
l
l
l
CONDITIONS
l
MIN
12
l
l
l
l
TYP
±0.4
±0.3
±0.5
0.002
±0.7
0.002
±0.1
±1
±0.9
0.05
±0.5
±0.7
0.05
±0.1
MAX
±1
±1
±8
±6
±1
±10
±9
±10
±6
±2
UNITS
Bits
LSB
LSB
LSB
LSB/°C
LSB
LSB/°C
LSB
LSB
LSB
LSB/°C
LSB
LSB
LSB/°C
LSB
(Note 5)
(Note 6)
(Note 6)
ANALOG INPUT
SYMBOL
V
IN
+
V
IN
–
V
IN
+ – V
IN
–
I
IN
C
IN
CMRR
PARAMETER
The
l
denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
(Note 8)
Unipolar (Note 8)
Bipolar (Note 8)
V
IN
= V
IN
+ – V
IN
– (Unipolar)
V
IN
= V
IN
+ – V
IN
– (Bipolar)
Sample Mode
Hold Mode
l
l
l
l
MIN
–0.05
–0.05
–0.05
TYP
MAX
REFCOMP
0.25 • REFCOMP
0.75 • REFCOMP
UNITS
V
V
V
V
V
Absolute Input Range (CH0, CH1, IN
+
)
Absolute Input Range (CH0, CH1, IN
–
)
Input Differential Voltage Range
Analog Input Leakage Current
Analog Input Capacitance
Input Common Mode Rejection Ratio
0 to REFCOMP
±REFCOMP/2
±1
55
5
70
μA
pF
pF
dB
23015fb
3
LTC2301/LTC2305
DYNAMIC ACCURACY
SYMBOL
SINAD
SNR
THD
SFDR
PARAMETER
Signal-to-(Noise + Distortion) Ratio
Signal-to-Noise Ratio
Total Harmonic Distortion
Spurious Free Dynamic Range
Channel-to-Channel Isolation
Full Linear Bandwidth
–3dB Input Linear Bandwidth
Aperture Delay
Transient Response
Full-Scale Step
The
l
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C and A
IN
= –1dBFS. (Notes 4,9)
CONDITIONS
f
IN
= 1kHz
f
IN
= 1kHz
f
IN
= 1kHz
f
IN
= 1kHz, First 5 Harmonics
f
IN
= 1kHz
f
IN
= 1kHz
(Note 10)
l
l
l
l
MIN
71
71
79
TYP
73.4
73.5
–91
92
–109
700
25
13
240
MAX
UNITS
dB
dB
–77
dB
dB
dB
kHz
MHz
ns
ns
INTERNAL REFERENCE CHARACTERISTICS
The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T
A
= 25°C. (Notes 4)
PARAMETER
V
REF
Output Voltage
V
REF
Output Tempco
V
REF
Output Impedance
V
REFCOMP
Output Voltage
V
REF
Line Regulation
CONDITIONS
I
OUT
= 0
I
OUT
= 0
–0.1mA ≤ I
OUT
≤ 0.1mA
I
OUT
= 0
V
DD
= 4.75V to 5.25V
l
MIN
2.46
TYP
2.50
±25
8
4.096
0.8
MAX
2.54
UNITS
V
ppm/°C
kΩ
V
mV/V
I
2
C INPUTS AND DIGITAL OUTPUTS
The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T
A
= 25°C. (Notes 4)
SYMBOL PARAMETER
V
IH
V
IL
V
IHA
V
ILA
R
INH
R
INL
R
INF
I
I
V
HYS
V
OL
t
OF
t
SP
C
CAX
High Level Input Voltage
Low Level Input Voltage
High Level Input Voltage for Address Pins A1, A0
Low Level Input Voltage for Address Pins A1, A0
Resistance from A1, A0 to V
DD
to Set Chip
Address Bit to 1
Resistance from A1, A0 to GND to Set Chip
Address Bit to 0
Resistance from A1, A0 to GND or V
DD
to Set
Chip Address Bit to Float
Digital Input Current
Hysteresis of Schmitt Trigger Inputs
Low Level Output Voltage (SDA)
Output Fall Time V
IN(MIN)
to V
IL(MAX)
Input Spike Suppression
External Capacitance Load on Chip Address Pins
(A1, A0) for Valid Float
V
IN
= V
DD
(Note 8)
I = 3mA
Bus Load C
B
10pF to 400pF (Note 11)
CONDITIONS
l
l
l
l
l
l
l
l
l
l
l
l
l
MIN
2.85
TYP
MAX
1.5
UNITS
V
V
V
V
kΩ
kΩ
MΩ
4.75
0.25
10
10
2
–10
0.25
0.4
20 + 0.1C
B
250
50
10
10
μA
V
V
ns
ns
pF
23015fb
4
LTC2301/LTC2305
POWER REQUIREMENTS
SYMBOL
V
DD
I
DD
PARAMETER
Supply Voltage
Supply Current
Nap Mode
Sleep Mode
Power Dissipation
Nap Mode
Sleep Mode
14ksps Sample Rate
SLP Bit = 0, Conversion Done
SLP Bit = 1, Conversion Done
14ksps Sample Rate
SLP Bit = 0, Conversion Done
SLP Bit = 1, Conversion Done
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
l
l
l
l
l
l
l
MIN
4.75
TYP
5
2.3
225
7
11.5
1.125
35
MAX
5.25
3.5
400
15
17.5
2
75
UNITS
V
mA
μA
μA
mW
mW
μW
P
D
I
2
C TIMING CHARACTERISTICS
SYMBOL
f
SCL
t
HD(SDA)
t
LOW
t
HIGH
t
SU(STA)
t
HD(DAT)
t
SU(DAT)
t
r
t
f
t
SU(STO)
t
BUF
PARAMETER
SCL Clock Frequency
Hold Time (Repeated) START Condition
LOW Period of the SCL Pin
HIGH Period of the SCL Pin
Set-Up Time for a Repeated START
Condition
Data Hold Time
Data Set-Up Time
Rise Time for SDA/SCL Signals
Fall Time for SDA/SCL Signals
Set-Up Time for STOP Condition
Bus Free Time Between a Second START
Condition
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
l
l
l
l
l
l
l
l
l
l
l
MIN
0.6
1.3
0.6
0.6
0
100
20 + 0.1C
B
20 + 0.1C
B
0.6
1.3
TYP
MAX
400
UNITS
kHz
μs
μs
μs
μs
0.9
300
300
μs
ns
ns
ns
μs
μs
(Note 11)
(Note 11)
ADC TIMING CHARACTERISTICS
SYMBOL
f
SMPL
t
CONV
t
ACQ
t
REFWAKE
PARAMETER
Throughput Rate (Successive Reads)
Conversion Time
Acquisition Time
REFCOMP Wakeup Time (Note 12)
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
Temperature is one of the most commonly measured variables in industrial, consumer, and computer applications, and thermistors are one of the primary means of monitoring this physical condition. Howev...
I was planning to write something down for myself, but I had to choose the category given by the system and the section to publish. It didn't feel right....
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
1 Introduction
In the mid-1960s, American scientist Maas conducted extensive experimental research on the charging process of open-cell batteries and proposed an acceptable charging curve for ...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
Magna's integrated in-cabin perception system fuses vision and millimeter-wave radar data to detect the presence of passengers, identify stranded children, monitor driver fatigue and vital signs, a...[Details]
Shenzhen Baowei Power Supply high frequency pure sine wave power, communication inverter power supply has two communication interfaces, RS232 and R485 interfaces, their functions and characteristic...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
Definitions of VR
, AR, and MR:
What is Virtual Reality?
Virtual Reality (VR), also known as "spiritual realm" or "illusion," is a high-tech technology that has emerged in recent ye...[Details]
Industrial equipment plays a significant role in improving industrial automation and accelerating production efficiency. Industrial HMIs (Human-Machine Interfaces) serve as a communication platform...[Details]
introduction
By the end of 2014, people aged 60 and above in China accounted for 15.5% of the total population, reaching 212 million; those aged 65 and above accounted for 10.1% of the total, ...[Details]
HEVO, a developer of wireless charging infrastructure for electric vehicles, and STEER Tech, a company specializing in high-precision autonomous vehicle technology for fleet garage operations, anno...[Details]
Security Use Cases and Implementation: Ensuring Future Security
By Manoj Rajashekarah, Chief
summary
In our previous article, "Securing the Future of Robotics: The Role of Cy...[Details]
On August 8th, the World Robotics Conference 2025 (WRC 2025) grandly opened at the Beijing Beiren Yichuang International Exhibition Center. Co-hosted by the China Electronics Society and the World ...[Details]
The automotive industry is undergoing rapid change with the rapid development of innovative technologies such as vehicle-to-everything (V2X), advanced infotainment systems, and autonomous dr...[Details]
To address the challenges of traditional discrete solutions in the automotive intelligent actuator market, such as high complexity, high cost, and insufficient reliability,
Naxin Microelectroni...[Details]
Test/Measurement
京公网安备 11010802033920号
EEWORLD
