LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
No Latency ∆∑ is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S. Patents including 6208279, 6411242,
7088280, 7164378.
Typical applicaTion
2.7V TO 5.5V
0.1µF
0.1µF
10k
10k
0.1µF
IN
+
LTC2462
IN
–
10k
R
REF
–
REFOUT
0.1µF
COMP V
CC
SCK
SDO
CS
GND
24602 TA01a
V
REF
vs Temperature
1.2520
REFERENCE OUTPUT VOLTAGE (V)
1.2515
1.2510
1.2505
1.2500
1.2495
1.2490
1.2485
1.2480
–50
–30
–10 10
30
50
TEMPERATURE (°C)
70
90
0.1µF
10µF
SPI
INTERFACE
24602 TA01b
24602fa
1
LTC2460/LTC2462
absoluTe MaxiMuM raTings
(Notes 1, 2)
Supply Voltage (V
CC
) ................................... –0.3V to 6V
Analog Input Voltage
(IN
+
, IN
–
, IN, REF
–
,
COMP, REFOUT) ...........................–0.3V to (V
CC
+ 0.3V)
Digital Voltage
(V
SDI
, V
SDO
, V
SCK
, V
CS
) ................–0.3V to (V
CC
+ 0.3V)
Storage Temperature Range .................. –65°C to 150°C
Operating Temperature Range
LTC2460C/LTC2462C ............................... 0°C to 70°C
LTC2460I/LTC2462I .............................–40°C to 85°C
pin conFiguraTion
LTC2462
TOP VIEW
REFOUT
COMP
CS
SDI
SCK
SDO
1
2
3
4
5
6
12 V
CC
11 GND
10 IN
–
LTC2462
TOP VIEW
REFOUT
COMP
CS
SDI
SCK
SDO
1
2
3
4
5
6
12
11
10
9
8
7
V
CC
GND
IN
–
IN
+
REF
–
GND
9 IN
+
8 REF
–
7 GND
DD PACKAGE
12-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 125°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL
LTC2460
TOP VIEW
REFOUT
COMP
CS
SDI
SCK
SDO
1
2
3
4
5
6
12 V
CC
11 GND
10 GND
9 IN
8 REF
–
7 GND
LTC2460
MS PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
θ
JA
= 120°C/W
TOP VIEW
REFOUT
COMP
CS
SDI
SCK
SDO
1
2
3
4
5
6
12
11
10
9
8
7
V
CC
GND
GND
IN
REF
–
GND
DD PACKAGE
12-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 125°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL
MS PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
θ
JA
= 120°C/W
orDer inForMaTion
LEAD FREE FINISH
LTC2460CDD#PBF
LTC2460IDD#PBF
LTC2460CMS#PBF
LTC2460IMS#PBF
LTC2462CDD#PBF
LTC2462IDD#PBF
LTC2462CMS#PBF
LTC2462IMS#PBF
TAPE AND REEL
LTC2460CDD#TRPBF
LTC2460IDD#TRPBF
LTC2460CMS#TRPBF
LTC2460IMS#TRPBF
LTC2462CDD#TRPBF
LTC2462IDD#TRPBF
LTC2462CMS#TRPBF
LTC2462IMS#TRPBF
PART MARKING*
LFDQ
LFDQ
2460
2460
LDXM
LDXM
2462
2462
PACKAGE DESCRIPTION
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic MSOP-12
12-Lead Plastic MSOP-12
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic MSOP-12
12-Lead Plastic MSOP-12
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
24602fa
2
LTC2460/LTC2462
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 2)
PARAMETER
Resolution (No Missing Codes)
Integral Nonlinearity
Offset Error
Offset Error Drift
Gain Error
Gain Error Drift
Includes Contributions of ADC and Internal Reference
Includes Contributions of ADC and Internal Reference
C-Grade
I-Grade
l
l
l
elecTrical characTerisTics
CONDITIONS
(Note 3)
(Note 4)
MIN
l
l
l
TYP
1
2
0.02
±0.01
±2
±5
2.2
80
MAX
10
15
±0.25
±10
UNITS
Bits
LSB
LSB
LSB/°C
% of FS
ppm/°C
ppm/°C
µV
RMS
dB
16
Transition Noise
Power Supply Rejection DC
analog inpuTs
specifications are at T
A
= 25°C.
PARAMETER
SYMBOL
V
IN+
V
IN–
V
IN
V
OR+
, V
UR+
V
OR–
, V
UR–
C
IN
The
l
denotes the specifications which apply over the full operating temperature range, otherwise
CONDITIONS
LTC2462
LTC2462
LTC2460
V
IN–
= 0.625V (See Figure 3)
V
IN+
= 0.625V (See Figure 3)
V
IN
= GND (Note 8)
V
IN
= V
CC
(Note 8)
V
IN
= GND (Note 8)
V
IN
= V
CC
(Note 8)
l
l
l
l
l
l
l
MIN
0
0
0
TYP
MAX
V
REF
V
REF
V
REF
UNITS
V
V
V
LSB
LSB
pF
Positive Input Voltage Range
Negative Input Voltage Range
Input Voltage Range
Overrange/Underrange Voltage, IN
+
Overrange/Underrange Voltage, IN–
IN
+
, IN
–
, IN Sampling Capacitance
8
8
0.35
–10
–10
–10
–10
1.247
1
1
1
1
50
l
I
DC_LEAK(IN+, IN–, IN)
IN
+
, IN
–
DC Leakage Current (LTC2462)
IN DC Leakage Current (LTC2460)
I
DC_LEAK(IN–)
I
CONV
V
REF
IN
–
DC Leakage Current
Input Sampling Current (Note 5)
Reference Output Voltage
Reference Voltage Coefficient
10
10
10
10
1.253
±10
nA
nA
nA
nA
nA
V
ppm/°C
ppm/°C
dB
mA
µA
mV/mA
nV/√Hz
1.25
±2
±5
–90
(Note 11)
C-Grade
I-Grade
2.7V ≤ V
CC
≤ 5.5V
V
CC
= 5.5, Forcing Output to GND
V
CC
= 5.5, Forcing Output to GND
2.7V ≤ V
CC
≤ 5.5V, I
OUT
= 100μA Sourcing
,
,
C
COMP
= 0.1μF C
REFOUT
= 0.1μF At f = 1kHz
l
Reference Line Regulation
Reference Short Circuit Current
COMP Pin Short Circuit Current
Reference Load Regulation
Reference Output Noise Density
l
l
35
200
3.5
30
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C.
SYMBOL
V
CC
I
CC
PARAMETER
Supply Voltage
Supply Current
Conversion
Nap
Sleep
CONDITIONS
l
l
l
l
power requireMenTs
MIN
2.7
TYP
MAX
5.5
UNITS
V
mA
µA
µA
24602fa
1.5
800
0.2
2.5
1500
2
3
LTC2460/LTC2462
operating temperature range,otherwise specifications are at T
A
= 25°C. (Note 2)
SYMBOL
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
PARAMETER
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
Digital Input Capacitance
High Level Output Voltage
Low Level Output Voltage
Hi-Z Output Leakage Current
I
O
= –800µA
I
O
= 1.6mA
l
l
l
DigiTal inpuTs anD DigiTal ouTpuTs
The
l
denotes the specifications which apply over the full
CONDITIONS
l
l
l
MIN
V
CC
– 0.3
TYP
MAX
0.3
UNITS
V
V
µA
pF
V
–10
10
V
CC
– 0.5
10
0.4
–10
10
V
µA
TiMing characTerisTics
The
l
denotes the specifications which apply over the full operating temperature
range,otherwise specifications are at T
A
= 25°C.
PARAMETER
Conversion Time
SCK Frequency Range
SCK Low Period
SCK High Period
CS
Falling Edge to SDO Low Z
CS
Rising Edge to SDO High Z
CS
Falling Edge to SCK Falling Edge
SCK Falling Edge to SDO Valid
SDI Setup Before SCK↑
SDI Hold After SCK↑
(Note 7)
(Note 3)
(Note 3)
(Notes 7, 8)
(Notes 7, 8)
t
CONV
f
SCK
t
lSCK
t
hSCK
t
1
t
2
t
3
t
KQ
t
4
t
5
SYMBOL
CONDITIONS
l
l
l
l
l
l
l
l
l
l
MIN
13
250
250
0
0
100
0
100
100
TYP
16.6
MAX
23
2
UNITS
ms
MHz
ns
ns
100
100
100
ns
ns
ns
ns
ns
ns
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2.
All voltage values are with respect to GND. V
CC
= 2.7V to 5.5V
unless otherwise specified.
V
REFCM
= V
REF
/2, FS = V
REF
V
IN
= V
IN+
– V
IN–
, –V
REF
≤ V
IN
≤ V
REF
; V
INCM
= (V
IN+
+ V
IN–
)/2.
Note 3.
Guaranteed by design, not subject to test.
Note 4.
Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
Guaranteed by design and test correlation.
Note 5:
CS
= V
CC
. A positive current is flowing into the DUT pin.
Note 6:
SCK = V
CC
or GND. SDO is high impedance.
Note 7:
See Figure 4.
Note 8:
See Figure 5.
Note 9:
Input sampling current is the average input current drawn from the
input sampling network while the LTC2460/LTC2462 is actively sampling
the input.
Note 10:
A positive current is flowing into the DUT pin.
Note 11:
Temperature coefficient is calculated by dividing the maximum
change in output voltage by the specified temperature range.
VxWorks for Pentium, the BSP of P4, runs on a virtual machine. The program needs to operate the serial port. Since the serial port driver in the BSP does not match the actual hardware, write() cannot ...
Dear friends, has anyone done this before? For those who have done this, does WinCE6.0 R2 support XIP mode for the NAND Flash driver architecture Mdd+Pdd? If yes, what needs to be done? Could you give...
Reprinted from:http://zjbintsystem.blog.51cto.com/964211/235094There are many descriptions about YUV4:2:2 to YUV4:2:0 on the Internet, but most of them are explanations of the principle, without pract...
Introducing a magic tool that can connect the power analyzer to the CAN bus network, the WT-CAN communication adapter: iDAQ-WTCAN. It is the small box in the picture below. With it, you can directly c...
1) Single-step operation is possible, but continuous operation always returns to address 0: Watchdog is not turned off, and continuous operation resets the DSP back to address 0. 2) OUT files cannot b...
1. Several nouns
ABI:
The specifications that an executable file must follow in order to run in a specific execution environment;
Separately generated relocatabl...[Details]
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
Whether it is an electric car or an ordinary fuel car, for the vast majority of car buyers, the final cost of use is what they care about most. For fuel cars, how to save fuel is what drivers care ...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
Common Mode Semiconductor has officially released its latest generation of power management ICs—the GM6506 series. This fully integrated high-frequency synchronous rectification step-down p...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
With the rapid development of electric vehicles in my country, people are beginning to pay attention to the issue of radiation from electric vehicles. We all know that mobile phones emit radiation,...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
To improve the lateral active safety of intelligent connected vehicles, the identification and definition of unexpected functional safety scenarios for the EPS (Electronic Steering System) ...[Details]
Previously, Positive Motion Technology shared with you the firmware upgrade of motion controller, ZBasic program development, ZPLC program development, communication with touch screen and input/out...[Details]
introduction
In recent years, multi-touch has emerged as a new alternative to traditional human-computer interaction. It eliminates the need for keyboards and mice, enabling simultaneous inter...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
