Range (Notes 3, 6) ................................. –55°C to 150°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSE Only .......................................................... 300°C
PIN CONFIGURATION
TOP VIEW
C
+
V
OUT
FB
SHUNT
PGOOD
1
2
3
4
5
11
GND
10 V
IN
9 C
–
8 GND
7 BIAS
6 EN
TOP VIEW
V
OUT
FB
SHUNT
PGOOD
C
+
1
2
3
4
5
11
GND
10
9
8
7
6
V
IN
C
–
GND
BIAS
EN
DD PACKAGE
10-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
MSE PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 40°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC3255EDD#PBF
LTC3255IDD#PBF
LTC3255HDD#PBF
LTC3255MPDD#PBF
LTC3255EMSE#PBF
LTC3255IMSE#PBF
LTC3255HMSE#PBF
LTC3255MPMSE#PBF
TAPE AND REEL
LTC3255EDD#TRPBF
LTC3255IDD#TRPBF
LTC3255HDD#TRPBF
LTC3255MPDD#TRPBF
LTC3255EMSE#TRPBF
LTC3255IMSE#TRPBF
LTC3255HMSE#TRPBF
LTC3255MPMSE#TRPBF
PART MARKING*
LGHD
LGHD
LGHD
LGHD
LTGHF
LTGHF
LTGHF
LTGHF
PACKAGE DESCRIPTION
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
3255f
2
For more information
www.linear.com/LTC3255
LTC3255
The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V unless otherwise noted. (Notes 2, 3)
SYMBOL
V
IN
V
OUT
V
UVLO_BK
V
UVLO_SH
I
VIN
PARAMETER
Input Voltage Range (Note 7)
Output Voltage Range
V
IN
Undervoltage Lockout Threshold
with Shunt Disabled
V
IN
Undervoltage Lockout Threshold
with Shunt Enabled
V
IN
Quiescent Current
EN Low
EN High, SHUNT = GND
EN High, SHUNT = BIAS
Available Output Current
Shunt Disabled
Shunt Enabled
Regulated Feedback Voltage
FB Pin Leakage
EN High Level Input Voltage
EN Low Level Input Voltage
EN Pin Input Current
V
OUT
Current Limit
Oscillator Frequency
PGOOD Rising Threshold
PGOOD Output Low Voltage
PGOOD High Impedance Leakage
% of Final Regulation Voltage
I
PGOOD
= 200µA
V
PGOOD
= 12V
l
l
ELECTRICAL CHARACTERISTICS
CONDITIONS
l
l
MIN
4
2.4
TYP
MAX
48
12.5
UNITS
V
V
V
mV
V
mV
µA
µA
µA
mA
mA
V
IN
Rising, SHUNT = GND
Hysteresis, SHUNT = GND
V
IN
Rising, SHUNT= BIAS
Hysteresis, SHUNT= BIAS
Shutdown
Enabled, Output in Regulation
Enabled, Output in Regulation
SHUNT = GND
SHUNT = BIAS, I
VIN
= 4mA, V
OUT
= 3.3V
V
FB
= 1.3V
l
l
l
l
l
2.4
50
5
200
3
16
30
50
7.4
1.176
1.4
2.7
5.7
6
35
45
I
VOUT
V
FB
I
FB
V
EN_VIH
V
EN_VIL
I
EN
I
LIM
f
OSC
V
PGTHRESH
V
PG(LOW)
7.8
1.200
1.224
±10
0.4
0
0
120
500
±1
±1
V
nA
V
V
µA
µA
mA
kHz
V
EN
= 12V
V
EN
= 0V
90
94
0.1
98
0.4
1
%
V
µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
All voltages are referenced to GND unless otherwise specified.
Note 3:
The LTC3255E is guaranteed to meet performance specifications
from 0°C to 85°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LTC3255I is guaranteed over the –40°C to 125°C operating junction
temperature range. The LTC3255H is guaranteed over the –40°C to 150°C
operating junction temperature range. The LTC3255MP is guaranteed over
the –55°C to 150°C operating junction temperature range. High junction
temperatures degrade operating lifetimes; operating lifetime is derated
for junction temperatures greater than 125°C. Note that the maximum
ambient temperature consistent with these specifications is determined by
specific operating conditions in conjunction with board layout, the rated
package thermal resistance and other environmental factors.
The junction temperature (T
J
, in °C) is calculated from the ambient
temperature (T
A
, in °C) and power dissipation (P
D
, in Watts) according to
the formula:
T
J
= T
A
+ (P
D
•
θ
JA
)
where
θ
JA
(in °C/W) is the package thermal impedance.
Note 4:
The LTC3255 has an internal diode that conducts whenever V
OUT
is pulled below GND. When so pulled, absolute maximum current out of
V
OUT
is 50mA.
Note 5:
The LTC3255 has an internal diode that conducts whenever
PGOOD is pulled below GND. When so pulled, absolute maximum current
out of PGOOD is 100µA.
Note 6:
This IC has overtemperature protection that is intended to protect
the device during momentary overload conditions. Junction temperatures
will exceed 150°C when overtemperature protection is active. Continuous
operation above the specified maximum operating junction temperature
may impair device reliability.
Note 7:
This IC has input overvoltage protection that shuts down the
device whenever V
IN
exceeds the specified input voltage range. Shutdown
I have graduated from university with a major in electronics for several years. I am very passionate about embedded systems and want to find some embedded system enthusiasts to make progress together....
I just deleted a folder on drive E using shift+delete. It seems that other files were written to drive E. Can I recover the completely deleted files now? Which hard drive recovery software is good? Is...
PCB board dissection is an important part of PCB design. However, since it involves sandpaper grinding (a harmful type of work) and line drawing (a simple repetitive labor), many PCB designers are rel...
The following is the initialization and sending and receiving program of LPC2148's SSP. It cannot communicate normally. Please help me with some advice if you know the answer. In addition, what is the...
I want to know whether the NANDFLASH I collected has been used and how long it lasts (note: not referring to bad blocks). Because I am afraid that the old chips will have problems after using them for...
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]
1. Project Overview
1.1 Introduction
Currently, most music files are saved in MP3 format, a lossy audio compression format that cannot perfectly reproduce the original music. With the exp...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]