Range (Notes 3, 6) ................................. –55°C to 150°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSE Only .......................................................... 300°C
PIN CONFIGURATION
TOP VIEW
C
+
V
OUT
FB
SHUNT
PGOOD
1
2
3
4
5
11
GND
10 V
IN
9 C
–
8 GND
7 BIAS
6 EN
TOP VIEW
V
OUT
FB
SHUNT
PGOOD
C
+
1
2
3
4
5
11
GND
10
9
8
7
6
V
IN
C
–
GND
BIAS
EN
DD PACKAGE
10-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 43°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
MSE PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 40°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC3255EDD#PBF
LTC3255IDD#PBF
LTC3255HDD#PBF
LTC3255MPDD#PBF
LTC3255EMSE#PBF
LTC3255IMSE#PBF
LTC3255HMSE#PBF
LTC3255MPMSE#PBF
TAPE AND REEL
LTC3255EDD#TRPBF
LTC3255IDD#TRPBF
LTC3255HDD#TRPBF
LTC3255MPDD#TRPBF
LTC3255EMSE#TRPBF
LTC3255IMSE#TRPBF
LTC3255HMSE#TRPBF
LTC3255MPMSE#TRPBF
PART MARKING*
LGHD
LGHD
LGHD
LGHD
LTGHF
LTGHF
LTGHF
LTGHF
PACKAGE DESCRIPTION
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead (3mm
×
3mm) Plastic DFN
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
3255f
2
For more information
www.linear.com/LTC3255
LTC3255
The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V unless otherwise noted. (Notes 2, 3)
SYMBOL
V
IN
V
OUT
V
UVLO_BK
V
UVLO_SH
I
VIN
PARAMETER
Input Voltage Range (Note 7)
Output Voltage Range
V
IN
Undervoltage Lockout Threshold
with Shunt Disabled
V
IN
Undervoltage Lockout Threshold
with Shunt Enabled
V
IN
Quiescent Current
EN Low
EN High, SHUNT = GND
EN High, SHUNT = BIAS
Available Output Current
Shunt Disabled
Shunt Enabled
Regulated Feedback Voltage
FB Pin Leakage
EN High Level Input Voltage
EN Low Level Input Voltage
EN Pin Input Current
V
OUT
Current Limit
Oscillator Frequency
PGOOD Rising Threshold
PGOOD Output Low Voltage
PGOOD High Impedance Leakage
% of Final Regulation Voltage
I
PGOOD
= 200µA
V
PGOOD
= 12V
l
l
ELECTRICAL CHARACTERISTICS
CONDITIONS
l
l
MIN
4
2.4
TYP
MAX
48
12.5
UNITS
V
V
V
mV
V
mV
µA
µA
µA
mA
mA
V
IN
Rising, SHUNT = GND
Hysteresis, SHUNT = GND
V
IN
Rising, SHUNT= BIAS
Hysteresis, SHUNT= BIAS
Shutdown
Enabled, Output in Regulation
Enabled, Output in Regulation
SHUNT = GND
SHUNT = BIAS, I
VIN
= 4mA, V
OUT
= 3.3V
V
FB
= 1.3V
l
l
l
l
l
2.4
50
5
200
3
16
30
50
7.4
1.176
1.4
2.7
5.7
6
35
45
I
VOUT
V
FB
I
FB
V
EN_VIH
V
EN_VIL
I
EN
I
LIM
f
OSC
V
PGTHRESH
V
PG(LOW)
7.8
1.200
1.224
±10
0.4
0
0
120
500
±1
±1
V
nA
V
V
µA
µA
mA
kHz
V
EN
= 12V
V
EN
= 0V
90
94
0.1
98
0.4
1
%
V
µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
All voltages are referenced to GND unless otherwise specified.
Note 3:
The LTC3255E is guaranteed to meet performance specifications
from 0°C to 85°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LTC3255I is guaranteed over the –40°C to 125°C operating junction
temperature range. The LTC3255H is guaranteed over the –40°C to 150°C
operating junction temperature range. The LTC3255MP is guaranteed over
the –55°C to 150°C operating junction temperature range. High junction
temperatures degrade operating lifetimes; operating lifetime is derated
for junction temperatures greater than 125°C. Note that the maximum
ambient temperature consistent with these specifications is determined by
specific operating conditions in conjunction with board layout, the rated
package thermal resistance and other environmental factors.
The junction temperature (T
J
, in °C) is calculated from the ambient
temperature (T
A
, in °C) and power dissipation (P
D
, in Watts) according to
the formula:
T
J
= T
A
+ (P
D
•
θ
JA
)
where
θ
JA
(in °C/W) is the package thermal impedance.
Note 4:
The LTC3255 has an internal diode that conducts whenever V
OUT
is pulled below GND. When so pulled, absolute maximum current out of
V
OUT
is 50mA.
Note 5:
The LTC3255 has an internal diode that conducts whenever
PGOOD is pulled below GND. When so pulled, absolute maximum current
out of PGOOD is 100µA.
Note 6:
This IC has overtemperature protection that is intended to protect
the device during momentary overload conditions. Junction temperatures
will exceed 150°C when overtemperature protection is active. Continuous
operation above the specified maximum operating junction temperature
may impair device reliability.
Note 7:
This IC has input overvoltage protection that shuts down the
device whenever V
IN
exceeds the specified input voltage range. Shutdown
During the SPI initialization of LPC1768, SPI can choose to transmit 8-16 bits of data, and the SPI data register S0SPDR can only write 16 bits of data at most.
However, when communicating with the po...
First of all, I would like to thank GigaDevice and EEWORLD Forum for providing this evaluation opportunity. My evaluation plan is to display the ADC converted data dynamically in a graphical manner on...
First of all, this is an advanced circuit knowledge question, not a brain teaser.
For small signals in the frequency range of 100Hz--100kHz, what basic component does the op amp correspond to?...
I would like to ask you, what is the problem that generates such warning when building the target file of the microcontroller? Thank you very much! WARNING L1: UNRESOLVED EXTERNAL SYMBOL SYMBOL: VALUE...
This afternoon and evening, create a new project file in MounRiver Studio integrated development environment, compile and pass the WCH_Link online debugging function. First, create a program to cycle ...
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
As the main model among new energy vehicles, pure electric vehicles have received strong support and encouragement from the country in recent years, and their development is changing with each pass...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]
Nascent Micro is launching devices covering a wide range of power applications, including gallium nitride (GaN) drivers, dual-channel automotive drivers, and battery protection MOSFETs.
...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
Batteries are a core component of new energy vehicles, accounting for over 40% of the total cost. This is also the area where automakers are most willing to tamper with costs. Since 2021, domestic ...[Details]
Lithium-ion batteries are a key component of electric vehicles. Their high energy density enables them to store a large amount of energy in a relatively compact and lightweight package, which is cr...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
Driven by business opportunities such as access to new markets and government initiatives like the Belt and Road Initiative, global expansion has become a significant trend for Chinese companies. C...[Details]
ARM Technology
京公网安备 11010802033920号
EEWORLD
