EXPOSED PAD (PIN 17) IS PGND, MUST BE SOLDERED TO PCB
UD PACKAGE
16-LEAD (3mm
×
3mm) PLASTIC QFN
T
JMAX
= 125°C,
θ
JA
= 68°C/W,
θ
JC
= 7.5°C/W
EXPOSED PAD (PIN 17) IS PGND, MUST BE SOLDERED TO PCB
orDer inForMaTion
LEAD FREE FINISH
LTC3607EUD#PBF
LTC3607IUD#PBF
LTC3607EMSE#PBF
LTC3607IMSE#PBF
TAPE AND REEL
LTC3607EUD#TRPBF
LTC3607IUD#TRPBF
LTC3607EMSE#TRPBF
LTC3607IMSE#TRPBF
PART MARKING*
LFNB
LFNB
3607
3607
PACKAGE DESCRIPTION
16-Lead (3mm × 3mm) Plastic QFN
16-Lead (3mm × 3mm) Plastic QFN
16-Lead Plastic MSOP
16-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C (Note 2)
–40°C to 125°C (Note 2)
–40°C to 125°C (Note 2)
–40°C to 125°C (Note 2)
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
3607fb
2
For more information
www.linear.com/LTC3607
LTC3607
elecTrical characTerisTics
SYMBOL
SV
IN
PV
IN
V
OUT
V
FB
I
FB
ΔV
LINE REG
ΔV
LOAD REG
I
S
PARAMETER
Operating Voltage Range
Operating Voltage Range
Output Voltage Range
Feedback Voltage (Note 3)
l
The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V, unless otherwise specified. (Note 2)
CONDITIONS
l
l
MIN
4.5
4.5
0.6
0.591
0.588
TYP
MAX
15
15
PV
IN
UNITS
V
V
V
V
V
nA
%/V
%
0.6
0.6
0.1
0.5
3.2
55
35
0.1
0.609
0.612
30
0.15
Feedback Pin Input Current
Reference Voltage Line Regulation
Output Voltage Load Regulation
Input DC Supply Current
Active Mode
Sleep Mode (Both Channels)
Sleep Mode (Single Channel)
Shutdown
Oscillator Frequency
Synchronization Frequency
Peak Switch Current Limit
Top Switch On-Resistance
Bottom Switch On-Resistance
SV
IN
Undervoltage Lockout Threshold
PGOOD1/2 Overvoltage Threshold
PGOOD1/2 Undervoltage Threshold
PGOOD1/2 On-Resistance
V
FB1, 2
= 0.5V, Duty Cycle < 35%
(Note 6)
(Note 6)
SV
IN
Rising
V
FB1, 2
Rising
V
FB1, 2
Hysteresis
V
FB1, 2
Ramping Down
V
FB1, 2
Hysteresis
Channel 1 or Channel 2 Active
RUN1 = RUN2 = 0V
–11
V
IN
= 4.5V to 15V (Note 3)
MODE/SYNC = 0V (Note 3)
(Note 4)
V
FB1
= V
FB2
= 0.5V
V
FB1
= V
FB2
= 0.64V
V
FB(1 or 2)
= 0.64V
RUN1 = RUN2 = 0V
V
FB1, 2
= 0.6V
l
90
60
1
2.7
4.0
1.25
mA
µA
µA
µA
MHz
MHz
A
Ω
Ω
f
OSC
f
SYNC
I
LIM
R
DS(ON)
UVLO
PGOOD
1.8
1.0
0.75
2.25
1
0.6
0.25
3.4
8.5
–3
–8.5
3
70
700
64
4.3
11
V
%
%
%
%
Ω
Ω
Cycles
t
PGOOD
I
PGOOD
V
RUN
I
RUN
V
MODE/SYNC
t
SOFTSTART
Power Good Blanking Time
PGOOD Leakage
RUN1/2 V
IL
RUN1/2 V
IH
RUN1/2 Leakage Current
MODE/SYNC V
IL
MODE/SYNC V
IH
Internal Soft-Start Time
V
FB
from 10% to 90% Full Scale
PV
IN1
= PV
IN2
= SV
IN
= 4.5V
l
l
l
l
l
1
0.55
0.01
0.3
0.35
3.0
1
1.0
µA
V
V
µA
V
V
ms
Note 1.
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2.
The LTC3607 is tested under pulsed load conditions such that
T
J
≈ T
A
. The LTC3607E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3607I is guaranteed over the full –40°C to 125°C operating junction
temperature range.
The junction temperature (T
J
) is calculated from the ambient temperature
(T
A
) and power dissipation (P
D
) according to the formula:
T
J
= T
A
+ (P
D
•
θ
JA
°C/W)
where
θ
JA
is the package thermal impedance. Note that the maximum
ambient temperature is consistent with these specifications determined by
specific operating conditions in conjunction with board layout, the rated
package thermal resistance and other environmental factors.
Note 3.
The LTC3607 is tested in a proprietary test mode that connects
V
FB
to the output of the error amplifier to an external servo loop.
Note 4.
Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 5.
T
J
is calculated from the ambient T
A
and power dissipation P
D
according to the following formula: T
J
= T
A
+ (PD •
θ
JA
).
Note 6.
The QFN switch on-resistance is guaranteed by correlation to
wafer level measurements.
Note 7.
This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active
Continuous operation above the specified maximum operating junction
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