EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
DD PACKAGE
8-LEAD (3mm
×
3mm) PLASTIC DFN
T
JMAX
= 125°C,
θ
JA
= 43°C/W,
θ
JC
= 3°C/W
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC3632EMS8E#PBF
LTC3632IMS8E#PBF
LTC3632EDD#PBF
LTC3632IDD#PBF
TAPE AND REEL
LTC3632EMS8E#TRPBF
LTC3632IMS8E#TRPBF
LTC3632EDD#TRPBF
LTC3632IDD#TRPBF
PART MARKING*
LTFFZ
LTFFZ
LFGB
LFGB
PACKAGE DESCRIPTION
8-Lead Plastic MSOP
8-Lead Plastic MSOP
8-Lead (3mm
×
3mm) Plastic DFN
8-Lead (3mm
×
3mm) Plastic DFN
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
3632fc
2
LTC3632
ELECTRICAL CHARACTERISTICS
SYMBOL
V
IN
UVLO
PARAMETER
Input Voltage Operating Range
V
IN
Undervoltage Lockout
V
IN
Overvoltage Lockout
DC Supply Current (Note 3)
Active Mode
Sleep Mode
Shutdown Mode
Feedback Comparator Trip Voltage
Feedback Comparator Hysteresis Voltage
Feedback Pin Current
Feedback Voltage Line Regulation
RUN Pin Threshold Voltage
V
FB
= 1V
V
IN
= 4.5V to 50V
RUN Rising
RUN Falling
Hysteresis
RUN = 1.3V
RUN < 1V, I
HYST
= 1mA
V
HYST
= 1.3V
V
SS
< 1.5V
SS Pin Floating
I
SET
Floating
500k Resistor from I
SET
to GND
I
SET
Shorted to GND
I
SW
= –10mA
I
SW
= 10mA
l
The
l
denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are for T
A
= 25°C (Note 2). V
IN
= 10V, unless otherwise noted.
CONDITIONS
MIN
4.5
V
IN
Rising
V
IN
Falling
Hysteresis
V
IN
Rising
V
IN
Falling
Hysteresis
l
l
TYP
MAX
50
UNITS
V
V
V
mV
V
V
V
µA
µA
µA
V
mV
nA
%/V
Input Supply (V
IN
)
3.80
3.75
54
52
4.15
4.00
150
56
54
2
125
12
3
l
l
4.50
4.35
59
57
OVLO
I
Q
V
RUN
= 0V
V
FB
Rising
0.792
3
–10
220
22
6
0.808
7
10
Output Supply (V
FB
)
V
FB
V
HYST
I
FB
∆V
LINEREG
Operation
V
RUN
I
RUN
V
HYSTL
I
HYST
I
SS
t
INTSS
I
PEAK
R
ON
1.17
1.06
–10
–10
4.5
40
8
1.21
1.10
110
0
0.07
0
5.5
0.75
50
25
10
5.0
2.5
60
13
1.25
1.14
10
0.1
10
6.5
V
V
mV
nA
V
nA
µA
ms
mA
mA
mA
Ω
Ω
0.800
5
0
0.001
RUN Pin Leakage Current
Hysteresis Pin Voltage Low
Hysteresis Pin Leakage Current
Soft-Start Pin Pull-Up Current
Internal Soft-Start Time
Peak Current Trip Threshold
Power Switch On-Resistance
Top Switch
Bottom Switch
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC3632 is tested under pulsed load conditions such that T
J
≈ T
A
.
LTC3632E is guaranteed to meet specifications from 0°C to 85°C junction
temperature. Specifications over the –40°C to 125°C operating junction
temperature range are assured by design, characterization and correlation
with statistical process controls. The LTC3632I is guaranteed over the
full –40°C to 125°C operating junction temperature range. Note that the
maximum ambient temperature consistent with these specifications is
determined by specific operating conditions in conjunction with board
layout, the rated package thermal impedance and other environmental
factors. The junction temperature (T
J
, in °C) is calculated from the ambient
temperature (T
A
, in °C) and power dissipation (P
D
, in Watts) according to
the formula:
T
J
= T
A
+ (P
D
•
θ
JA
), where
θ
JA
(in °C/W) is the package thermal
impedance.
Note 3:
Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency. See Applications Information.
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