LTC4225C ................................................ 0°C to 70°C
LTC4225I .............................................–40°C to 85°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
GN Package ...................................................... 300°C
pin conFiguraTion
TOP VIEW
PWRGD1
DGATE1
HGATE1
CPO1
OUT1
CPO1
DGATE1
19
FAULT1
18 ON1
17
EN1
25
16 TMR1
15 TMR2
14
EN2
8
DGATE2
9 10 11 12
CPO2
HGATE2
OUT2
PWRGD2
13
FAULT2
SENSE1
IN1
ON1
INTV
CC
GND
ON2
IN2
1
2
3
4
5
6
7
8
9
TOP VIEW
24 HGATE1
23 OUT1
22
PWRGD1
21
FAULT1
20
EN1
19 TMR1
18 TMR2
17
EN2
16
FAULT2
15
PWRGD2
14 OUT2
13 HGATE2
24 23 22 21 20
SENSE1 1
IN1 2
INTV
CC
3
GND 4
ON2 5
IN2 6
SENSE2 7
SENSE2 10
DGATE2 11
CPO2 12
UFD PACKAGE
24-LEAD (4mm
×
5mm) PLASTIC QFN
T
JMAX
= 125°C,
θ
JA
= 34°C/W
EXPOSED PAD (PIN 25) PCB GND CONNECTION OPTIONAL
GN PACKAGE
24-LEAD PLASTIC SSOP NARROW
T
JMAX
= 125°C,
θ
JA
= 85°C/W
422512f
2
LTC4225-1/LTC4225-2
orDer inForMaTion
LEAD FREE FINISH
LTC4225CUFD-1#PBF
LTC4225CUFD-2#PBF
LTC4225IUFD-1#PBF
LTC4225IUFD-2#PBF
LTC4225CGN-1#PBF
LTC4225CGN-2#PBF
LTC4225IGN-1#PBF
LTC4225IGN-2#PBF
TAPE AND REEL
LTC4225CUFD-1#TRPBF
LTC4225CUFD-2#TRPBF
LTC4225IUFD-1#TRPBF
LTC4225IUFD-2#TRPBF
LTC4225CGN-1#TRPBF
LTC4225CGN-2#TRPBF
LTC4225IGN-1#TRPBF
LTC4225IGN-2#TRPBF
PART MARKING*
42251
42252
42251
42252
LTC4225GN-1
LTC4225GN-2
LTC4225GN-1
LTC4225GN-2
PACKAGE DESCRIPTION
24-Lead (4mm
×
5mm) Plastic QFN
24-Lead (4mm
×
5mm) Plastic QFN
24-Lead (4mm
×
5mm) Plastic QFN
24-Lead (4mm
×
5mm) Plastic QFN
24-Lead Plastic SSOP
24-Lead Plastic SSOP
24-Lead Plastic SSOP
24-Lead Plastic SSOP
TEMPERATURE RANGE
0°C to 70°C
0°C to 70°C
–40°C to 85°C
–40°C to 85°C
0°C to 70°C
0°C to 70°C
–40°C to 85°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
elecTrical characTerisTics
SYMBOL
Supplies
V
IN
I
IN
V
IN(UVL)
∆V
IN(HYST)
V
INTVCC
V
INTVCC(UVL)
Input Supply Range
Input Supply Current
Input Supply Undervoltage Lockout
Input Supply Undervoltage Lockout
Hysteresis
Internal Regulator Voltage
Internal V
CC
Undervoltage Lockout
PARAMETER
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V, unless otherwise noted.
CONDITIONS
l
l
MIN
2.9
TYP
MAX
18
UNITS
V
mA
V
mV
V
V
mV
2.8
1.75
10
4.5
2.1
30
1.9
50
5
2.2
60
5
2.05
90
5.6
2.3
90
IN Rising
l
l
l
INTV
CC
Rising
l
l
∆V
INTVCC(HYST)
Internal V
CC
Undervoltage Lockout
Hysteresis
Ideal Diode Control
∆V
FWD(REG)
∆V
DGATE
I
CPO(UP)
I
DGATE(FPU)
I
DGATE(FPD)
t
ON(DGATE)
t
OFF(DGATE)
∆V
SENSE(CB)
∆V
SENSE(ACL)
∆V
HGATE
∆V
HGATE(PG)
Forward Regulation Voltage
(V
INn
– V
OUTn
)
External N-Channel Gate Drive
(V
DGATEn
– V
INn
)
CPOn Pull-Up Current
DGATEn Fast Pull-Up Current
DGATEn Fast Pull-Down Current
DGATEn Turn-On Delay
DGATEn Turn-Off Delay
Circuit Breaker Trip Sense Voltage
(V
INn
– V
SENSEn
)
Active Current Limit Sense Voltage
(V
INn
– V
SENSEn
)
External N-Channel Gate Drive
(V
HGATEn
– V
OUTn
)
Gate-Source Voltage for Power Good
IN < 7V, I = 0, –1µA
IN = 7V to 18V, I = 0, –1µA
IN < 7V,
∆V
FWD
= 0.1V, I = 0, –1µA
IN = 7V to 18V,
∆V
FWD
= 0.1V, I = 0, –1µA
CPO = IN = 2.9V
CPO = IN = 18V
∆V
FWD
= 0.2V,
∆V
DGATE
= 0V, CPO = 17V
∆V
FWD
= –0.2V,
∆V
DGATE
= 5V
∆V
FWD
= 0.2V, C
DGATE
= 10nF
∆V
FWD
= –0.2V, C
DGATE
= 10nF
l
l
l
l
l
10
5
10
–60
–50
25
7
12
–95
–85
–1.5
1.5
40
14
14
–120
–110
mV
V
V
µA
µA
A
A
l
l
0.25
0.2
47.5
55
4.8
10
3.6
50
65
7
12
4.2
0.5
0.5
52.5
75
14
14
4.8
µs
µs
mV
mV
V
V
V
422512f
Hot Swap Control
l
l
l
l
l
3
LTC4225-1/LTC4225-2
elecTrical characTerisTics
SYMBOL
I
HGATE(UP)
I
HGATE(DN)
I
HGATE(FPD)
t
PHL(SENSE)
t
OFF(HGATE)
t
D(HGATE)
t
P(HGATE)
Input/Output Pin
I
SENSE
V
ON(TH)
∆V
ON(HYST)
V
ON(RESET)
I
ON(LEAK)
V
EN(TH)
∆V
EN(HYST)
I
EN(UP)
V
TMR(TH)
I
TMR(UP)
I
TMR(DN)
I
TMR(RATIO)
I
OUT
V
OL
V
OH
I
OH
I
PU
t
RST(ON)
SENSEn Input Current
ONn Threshold Voltage
ONn Hysteresis
ONn Fault Reset Threshold Voltage
ONn Input Leakage Current
ENn
Threshold Voltage
ENn
Hysteresis
ENn
Pull-Up Current
TMRn Threshold Voltage
TMRn Pull-Up Current
TMRn Pull-Down Current
TMRn Current Ratio I
TMR(DN)
/I
TMR(UP)
OUTn Current
Output Low Voltage (FAULTn,
PWRGDn)
Output High Voltage (FAULTn,
PWRGDn)
Output Pull-Up Current
(FAULTn,
PWRGDn)
ONn Low to
FAULTn
High
OUT = 11V, IN = 12V, ON = 2V
OUT = 13V, IN = 12V, ON = 2V
I = 1mA
I = –1µA
V = 1.5V
EN
= 1V
TMR Rising
TMR Falling
TMR = 1V, In Fault Mode
TMR = 2V, No Faults
ON Falling
ON = 5V
EN
Rising
SENSE = 12V
ON Rising
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 12V, unless otherwise noted.
PARAMETER
External N-Channel Gate Pull-Up Current
External N-Channel Gate Pull-Down
Current
External N-Channel Gate Fast
Pull-Down Current
Sense Voltage (INn – SENSEn)
High to HGATEn Low
ENn
High to HGATEn Low
ONn Low to HGATEn Low
INn Low to HGATEn Low
ONn High,
ENn
Low to HGATEn
Turn-On Delay
ONn to HGATEn Propagation Delay
ON = Step 0.8V to 2V
CONDITIONS
Gate Drive On, HGATE = 0V
Gate Drive Off, OUT = 12V,
HGATE = OUT + 5V
Fast Turn-Off, OUT = 12V,
HGATE = OUT + 5V
∆V
SENSE
= 300mV, C
HGATE
= 10nF
l
l
l
l
l
l
l
l
l
MIN
–7
150
100
TYP
–10
300
200
0.5
20
10
10
MAX
–13
500
300
1
40
20
20
150
20
100
1.26
140
0.63
±1
1.284
200
–13
1.272
0.25
–125
2.6
2.7
120
4
0.4
±1
–13
40
UNITS
µA
µA
mA
µs
µs
µs
µs
ms
µs
µA
V
mV
V
µA
V
mV
µA
V
V
µA
µA
%
µA
mA
V
V
µA
µA
µs
50
100
10
10
1.21
40
0.55
1.185
40
–7
1.198
0.15
–75
1.4
1.4
50
1.235
80
0.6
0
1.235
130
–10
1.235
0.2
–100
2
2
50
2.2
0.15
Input Leakage Current (FAULTn,
PWRGDn)
V = 18V
l
INTV
CC
– 1 INTV
CC
– 0.5
l
0
l
l
–7
–10
20
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
All currents into device pins are positive; all currents out of
the device pins are negative. All voltages are referenced to GND unless
otherwise specified.
Note 3:
An internal clamp limits the DGATE and CPO pins to a minimum of
10V above and a diode below IN. Driving these pins to voltages beyond the
clamp may damage the device.
Note 4:
An internal clamp limits the HGATE pin to a minimum of 10V
above and a diode below OUT. Driving this pin to voltages beyond the
I have been using PROTEL 99 before, and recently I have been using ALTIUM DESIGNER6.6. When I was laying out the PCB today, when I used the mouse to move the components, why did the mouse jump far awa...
[align=left][color=#000000] It was a long time ago that I came into contact with [font=Calibri]DSP[/font], probably last year. [/color][/align][align=left][color=#000000][font=Calibri] [/font]It was a...
Welding of electronic componentsSoldering components with an electric soldering iron is a basic assembly process, which plays a key role in ensuring the quality of electronic products. Here are some k...
Is there anyone who is good at LED power supply? ? This is my first time to use LED lamps. Can anyone tell me about the isolated dimming signal and non-isolated dimming signal in 1-10V dimming signal?...
I used the ks8695 board as a router and appweb as a web server. I found that when I used Thunder to download at 200kb/s, the network would be interrupted when accessing the management page of appweb, ...
TD-SCDMA terminal conformance test includes three types of tests: RF index test (reference standard: 3GPPTS34.122), protocol signaling test (reference standard: 3GPPTS34.123) and other tests (refer...[Details]
Today, as network technology becomes more and more popular, industrial field instruments, data acquisition and control equipment are becoming more and more networked, and the combination of industr...[Details]
To help improve DC/DC conversion efficiency at lighter loads and higher frequencies, Schottky diodes can be integrated into MOSFET chips to form a single package to reduce power dissipation in the ...[Details]
introduction
Controller Area Network (CAN) is a bus standard proposed by Bosch of Germany to solve the information communication between automotive electronic control units. With its excel...[Details]
Multi-parameter monitor is an important device in clinical nursing. It can monitor the patient's ECG, blood pressure, blood oxygen saturation, respiratory rate, pulse rate and temperature. At present,...[Details]
introduction
The data detected by various
measuring instruments
often need to be transferred to a PC for data processing and archiving, so as to make full use of the rich hardware an...[Details]
In the issue of ensuring the safety of drivers and pedestrians, the proportion of electronic technology has increased. According to the survey, 80% to 90% of traffic accidents are caused by driver...[Details]
Combined with Samsung's ARM9 series embedded processor S3C2410, this paper explains how to perform modular programming of LCD driver and how to statically load the driver into the system kernel.
...[Details]
Industrial control
often requires multi-channel fault detection and multi-channel command control (this multi-task setting is very common). A single CPU chip is difficult to directly complete ...[Details]
Abstract: By controlling the supply voltage of the radio frequency (RF) power amplifier (PA) in a CDMA/WCDMA cellular phone, the PA efficiency can be improved, heat generation can be reduced, and t...[Details]
1 Introduction
Economic development has prompted people to continuously improve their security awareness. When traditional local analog monitoring methods gradually fail to meet the needs of l...[Details]
Novaled, a German company, has successfully developed p-type and n-type field effect transistors based on a single-layer pentacene semiconductor layer by using its own p-type and n-type dopants. This ...[Details]
Plasma processing in the semiconductor industry is a challenging environment for fluororubber vacuum seals. The ability to seal under high temperature and plasma conditions is critical to maximizin...[Details]
0 Introduction
In the mixed analog and digital circuit system, multiple power supplies are required. In order to reduce the number of external power supplies and realize the miniaturizatio...[Details]
0 Introduction
High-frequency switching power supplies have been widely used in the communication and low-voltage industries, and have gradually been used in power systems, due to their ad...[Details]