POLYPROPYLENE FILM CAPACITORS
PPL Series: Film Foil
INTRODUCTION
PPL Series are constructed with polypropylene film
dielectric, aluminum foil electrode, inductive
forming, copperply lead, epoxy resin coating.
Compared to other types, the PPL has a lower
dielectric absorption and much lower temperature
variation in the electrostatic capacitance. They have
a much higher insulation resistance and are ideal for
use in circuits where a high demand is placed on the
Q in RF circuits, and electronic computers.
SPECIFICATIONS
Type
Operating Temperature Range
Capacitance Range
Capacitance Tolerance
Rated Voltage
Dissipation Factor
Insulation Resistance
Performance
-40°C ~ +85°C
0.001mF ~ 0.47mF
±
2
%
(G),
±
5
%
(J),
±
10
%
(K),
±
20
%
(M)
50V
DC
, 100V
DC
, 200V
DC
, 250V
DC
0.1% max at 1KHz, 25°C
C<0.1 F, >20 000M
C 0.1 F, >2 000M • F
FEATURES
PART NUMBER EXAMPLE
PPL 333 K 2A
DIMENSIONS
mF
0.0010
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
W.V.
Code
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
50/100VDC
W
H
T P±1
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
5.8 10.5 3.3 3.0
6.0 10.5 3.5 3.0
6.0 10.5 3.5 3.0
6.0 10.5 3.5 3.0
6.0 10.5 3.5 3.0
6.5 10.5 4.0 3.0
6.5 10.5 4.0 3.0
6.5 10.5 4.0 3.0
7.5 10.5 4.0 4.0
7.5 10.5 4.0 4.0
7.8 10.5 4.5 4.0
7.8 12.0 4.5 5.0
8.0 12.0 4.6 5.0
8.0 12.5 5.0 5.0
9.3 12.5 5.0 6.0
9.7 12.5 5.0 6.0
10.0 12.5 5.5 6.0
10.5 12.5 6.0 7.0
11.5 13.0 6.5 7.0
12.0 13.0 7.0 7.0
12.0 15.0 7.0 7.0
12.0 16.0 7.5 8.0
13.5 16.0 8.0 8.0
14.0 16.0 8.5 8.0
15.5 19.0 8.5 10.0
16.0 20.0 9.0 10.0
18.0 21.0 10.0 10.0
200/250VDC
W
H
T P±1
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.0 3.0
7.0 11.0 4.5 3.0
7.0 11.0 4.5 3.0
7.0 11.0 4.5 3.0
9.0 13.0 5.0 4.0
9.0 13.0 5.0 4.0
9.0 13.0 5.0 4.0
9.0 13.0 5.5 5.0
9.0 13.0 5.5 5.0
11.0 14.0 6.0 5.0
11.0 14.0 6.0 6.0
11.0 14.0 7.0 6.0
12.0 14.0 7.0 6.0
13.0 15.0 8.0 7.0
14.0 15.0 8.0 7.0
14.0 15.0 8.0 7.0
15.0 17.0 8.0 7.0
16.0 18.0 9.0 8.0
18.0 18.0 10.0 8.0
•Low dissipation factor (DF)
•High insulation resistance
•High stability and reliability
•Low equivalent series
resistance (ESR)
•Inductive construction
•Enhanced mechanical strength and
moisture resistance epoxy resin
•Heat resistance: 240°C±10 (5 sec)
25mm min H max
P
W max
1.5mm max
d±0.05
T max
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C1DD01
REV 2002.06.13
Microchip MCU
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