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PZU10B2L

Description
Single Zener diodes
CategoryDiscrete semiconductor    diode   
File Size115KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric View All

PZU10B2L Overview

Single Zener diodes

PZU10B2L Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeDFN
package instruction1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN
Contacts2
Reach Compliance Codecompli
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance10 Ω
JESD-30 codeR-PBCC-N2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.25 W
Certification statusNot Qualified
Nominal reference voltage10 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Maximum voltage tolerance2%
Working test current5 mA
PZUxBL series
Single Zener diodes
Rev. 01 — 6 May 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I
Non-repetitive peak reverse power
dissipation: P
ZSM
40 W
I
Total power dissipation: P
tot
250 mW
I
Tolerance series:
B: approximately
±5
%;
B2: approximately
±2
%
I
Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
I
Low reverse current I
R
range
I
Small plastic package suitable for
surface-mounted design
I
AEC-Q101 qualified
1.3 Applications
I
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
V
F
P
ZSM
P
tot
[1]
[2]
[3]
[4]
Quick reference data
Parameter
forward voltage
non-repetitive peak reverse
power dissipation
total power dissipation
T
amb
25
°C
Conditions
I
F
= 100 mA
[1]
[2]
Min
-
-
-
Typ
-
-
-
Max
1.1
40
250
Unit
V
W
mW
[3][4]
Pulse test: t
p
300
µs; δ ≤
0.02.
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
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