M50959-XXXSP datasheet, PDF - EEWORLD Datasheet

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M50959-XXXSP: DescriptionSINGLE CHIP 8 BIT CMOS MICROCOMPUTER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，39 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M50959-XXXSP Overview

SINGLE CHIP 8 BIT CMOS MICROCOMPUTER

M50959-XXXSP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Mitsubishi
Parts packaging code	DIP
package instruction	PLASTIC, DIP-64
Contacts	64
Reach Compliance Code	unknown
Has ADC	YES
Address bus width	16
bit size	8
CPU series	MELPS740
maximum clock frequency	4.2 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-PDIP-T64
JESD-609 code	e0
length	56.4 mm
Number of I/O lines	54
Number of terminals	64
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP64,.75
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	16384
ROM programmability	MROM
Maximum seat height	5.5 mm
speed	4.2 MHz
Maximum slew rate	10 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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M50959-XXXSP Related Products

	M50959-XXXSP	M50957	M50957-XXXSP	M50958-XXXSP
Description	SINGLE CHIP 8 BIT CMOS MICROCOMPUTER	SINGLE CHIP 8 BIT CMOS MICROCOMPUTER	SINGLE CHIP 8 BIT CMOS MICROCOMPUTER	SINGLE CHIP 8 BIT CMOS MICROCOMPUTER
Is it Rohs certified?	incompatible	-	incompatible	incompatible
Maker	Mitsubishi	-	Mitsubishi	Mitsubishi
Parts packaging code	DIP	-	DIP	DIP
package instruction	PLASTIC, DIP-64	-	PLASTIC, DIP-64	PLASTIC, DIP-64
Contacts	64	-	64	64
Reach Compliance Code	unknown	-	unknown	unknown
Has ADC	YES	-	YES	YES
Address bus width	16	-	16	16
bit size	8	-	8	8
CPU series	MELPS740	-	MELPS740	MELPS740
maximum clock frequency	4.2 MHz	-	4.2 MHz	4.2 MHz
DAC channel	NO	-	NO	NO
DMA channel	NO	-	NO	NO
External data bus width	8	-	8	8
JESD-30 code	R-PDIP-T64	-	R-PDIP-T64	R-PDIP-T64
JESD-609 code	e0	-	e0	e0
length	56.4 mm	-	56.4 mm	56.4 mm
Number of I/O lines	54	-	54	54
Number of terminals	64	-	64	64
Maximum operating temperature	70 °C	-	70 °C	70 °C
Minimum operating temperature	-10 °C	-	-10 °C	-10 °C
PWM channel	YES	-	YES	YES
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	-	SDIP	SDIP
Encapsulate equivalent code	SDIP64,.75	-	SDIP64,.75	SDIP64,.75
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	-	IN-LINE, SHRINK PITCH	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	-	5 V	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
RAM (bytes)	256	-	256	256
rom(word)	16384	-	10240	12288
ROM programmability	MROM	-	MROM	MROM
Maximum seat height	5.5 mm	-	5.5 mm	5.5 mm
speed	4.2 MHz	-	4.2 MHz	4.2 MHz
Maximum slew rate	10 mA	-	10 mA	10 mA
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage	4 V	-	4 V	4 V
Nominal supply voltage	5 V	-	5 V	5 V
surface mount	NO	-	NO	NO
technology	CMOS	-	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.778 mm	-	1.778 mm	1.778 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	19.05 mm	-	19.05 mm	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	-	1	1

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