EEWORLDEEWORLDEEWORLD

Part Number

Search

3191EB123M035BXR1

Description
CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 35V, 12000uF, STUD MOUNT, CAN, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size362KB,4 Pages
ManufacturerCDE [ CORNELL DUBILIER ELECTRONICS ]
Environmental Compliance  
Download Datasheet Parametric View All

3191EB123M035BXR1 Overview

CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 35V, 12000uF, STUD MOUNT, CAN, ROHS COMPLIANT

3191EB123M035BXR1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance12000 µF
Capacitor typeALUMINUM ELECTROLYTIC CAPACITOR
dielectric materialsALUMINUM (WET)
ESR11.4 mΩ
Manufacturer's serial number3191
Installation featuresSTUD MOUNT
negative tolerance20%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package shapeCYLINDRICAL PACKAGE
polarityPOLARIZED
positive tolerance20%
Rated (DC) voltage (URdc)35 V
ripple current14300 mA
surface mountNO
Terminal shapeBINDING POST
Type 3191
Aluminum Electrolytic, Screw Terminals, Switching and Audio Output
Screw Terminal Capacitors for Power Output Filtering
The low ESR of Type 3191 capacitors makes them
a great choice for output filtering in switching and
audio power supplies. It’s available with the capacitor
element potted in place for lowest cost or secured by
rill, spoon shaped dimples in the side of the can. Rilled
construction offers high vibration and shock with-
standing and excellent heat transfer for higher ripple
current.
Outline Drawing
Highlights
Stud mount available
High current application
Industrial applications
Smoothing and filtering
Audio power supplies
Specifications
Operating Temperature:
Rated Voltage:
Capacitance Range:
Capacitance Tolerance:
Ripple Current Multipliers
–40 to + 85 ºC
7.5 Vdc to 55 Vdc
2700 µF to 150000 µF
–10 to + 30%; –10 to +50%; ±20%
Ambient Temperature
Temperature
I
R
Multiplier
45 ºC
2.24
60 Hz
0.90
55 ºC
2.00
120 Hz
1.00
65 ºC
1.73
300 Hz
1.05
75 ºC
1.41
85 ºC
1.00
Frequency
Frequency
I
R
Multiplier
1000 Hz
≥10
Khz
1.10
1.15
Life Test:
Shelf Life:
Vibration:
Complies with the EU Directive
2002/95/EC requirement restricting
the use of Lead (Pb), Mercury (Hg),
Cadmium (Cd), Hexavalent chromium
(Cr(VI)), PolyBrominated Biphenyls
(PBB) and PolyBrominated Diphenyl
Ethers (PBDE).
Endurance, 1500 h at rated voltage and 85 ºC
Δ Capacitance: ±10%
ESR ≤ 200% of limit
DCL ≤ 100% of limit
Storage, 500 h at 85 ºC
Δ Capacitance: ±10%
ESR ≤ 175% of limit
DCL ≤ 200% of limit
10 to 500 Hz, 0.75 mm or 10 g* if less,
3 directions, 2 h ea
Δ Capacitance: ±5%
no visible damage or leakage
*15 g if rilled construction
CDM Cornell Dubilier • 140 Technology Place. • Liberty, SC • 29657 • Phone: (864)843-2277 • Fax: (864)843-3800 • www.cde.com
Beginner's confusion
I am a sophomore this year and I am working on a project that has a module and an oscilloscope. I use Labview for software. I originally wanted to use a single-chip microcomputer for hardware, but lat...
西域不夜城 FPGA/CPLD
launchpad voice debugging
I adjusted the voice module today, let's share our experience:) #include#include#define uchar unsigned char #define uint unsigned int #define ulong unsigned long #define CPU_F ((double)8000000) #defin...
3204100225 Microcontroller MCU
Will the USB port emulator LSD-FET430UIF provide power to the target board?
I have been using a parallel port emulator and would like to ask, can the USB port emulator LSD-FET430UIF provide power to the target board?...
fgfz2003 Microcontroller MCU
Do the top and bot layers of multilayer boards need to be laid with ground mesh?
I just saw a question from a friend in the group, and I thought we could discuss it: Do the top and bot layers of multilayer boards need to be laid with ground grids? Sunflower: Definitely. Q-99SE: No...
gina PCB Design
LSM6DSM Double-click the code to take a screenshot
In the en.stsw-stlkt01 v1.2.0 DataLog project, LSM6DSM Double Tap is implemented. Let’s take a look at the code used in the demo....
gxt467138 MEMS sensors
Anti-static design of chips
As chip speed increases, in order to shorten the pin length and reduce signal crosstalk, the packaging of ultra-large-scale IC chips such as CPUs and SoCs (System on Chips) increasingly adopts flip ch...
yimeng1988 Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 607  2634  1124  2421  2888  13  54  23  49  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号