FEATURES:
•
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
•
Glass passivated chip junction in Molded Plastic
package
•
1500 W surge capability at 1 ms
•
Excellent clamping capability
•
Low zener impedance
•
Fast response time: typically less than 1.0 ps from
0 volts to BV min.
•
Typical I
R
less than 1 uA above 10V
o
•
High temperature soldering guaranteed: 260 C/10
seconds/.375”, [9.5mm] lead length/5lbs., [2.3kg]
tension
MECHANICAL DATA
•
Case: JEDEC DO-201AE Molded plastic
•
Terminals: Axial leads, solderable per
MIL-STD-202, Method 208
•
Polarity Color band denoted cathode except
Bipolar
•
Mounting Position: Any
•
Weight: 0.045 ounce [1.2 grams]
MAXIMUM RATINGS AND CHARACTERISTICS
Rating
(At 25
o
C ambient temperature unless otherwise specified)
Peak Power Dissipation at T
A
=25
o
C, T
P
=1ms
(NOTE 1)
Symbol
Value
P
PK
Minimum 1500
Units
Watts
Watts
Amps
o
PD
5
Steady State Power Dissipation at T
L
=75
o
C
Lead Lengths .375", (9.5mm)
(NOTE 2
)
Peak Forward Surge Current, 8.3ms Single Half Sine Wave
I
FSM
200
Superimposed on Rated Load (JEDEC Method)
(NOTE 3
)
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +175
NOTES:
1. Non-repetitive current pulse, per Fig. 3 and derated above T
A
=25
o
C per Fig. 2
2. Mounted on Copper Leaf Area of 0.79 in
2
(20mm
2
)
3. 8.3ms single half sine-wave, duty cycle=4 pulses per minutes maximum
C