DOCUMENT
REVISION
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: 1 OF 9
SPECIFICATION FOR APPROVAL
1/16W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to1.0mm x 0.5mm size 1/16W, fixed thick film low resistance value
chip resistors rectangular type.
2. Type Designation
RLT0510 - 1 -
□□□□
(1) (2)
(3)
Where
□
(4)
(1) Size No.
(2) Power Rating:
1 = 1/16W
(3) Resistance value:
For example --
R075 = 0.075Ω
R100 = 0.100Ω
The “R” shall be used as a decimal point
(4) Resistance tolerance:
F = ±1.0%, G= ±2%, J= ±5%
3. Outline Dimensions
L
a
a
Code Letter
W
Dimension
1.00 ± 0.10
0.50 ± 0.10
0.35 +0.15/-0.10
0.25 ± 0.10
0.30 ± 0.10
Unit : mm
L
W
t
a
b
t
b
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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Table 1
Power Rating*
Resistance Tolerance
Resistance Range
Temperature Coefficient of
Resistance(ppm/℃)
Operating Temperature Range
Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistor operated at ambient temperature in excess of 70℃,the maximum load
shall be derated in accordance with the following curve.
100
RATED LOAD(%)
1/16W
1%(F), 2%(G), 5%(J)
0.065 ~ <0.60Ω
±300
-55℃ to 125℃
0.60 ~ 1.0Ω
±200
0
-55
70
125
AMBIENT TEMPERATURE(
℃
)
4-2 Rated Voltage
The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression
V
=
P
×
R
Where V
: Rated voltage (V)
P : Rated power (W)
R : Nominal resistance (Ω)
4-3 Operating and Storage Temperature Range
-55 to +125℃
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REVISION
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SPECIFICATION FOR APPROVAL
5. Characteristics
5-1 Electrical
Item
Specification and Requirement
Test Method (JIS 5201)
Temperature Coefficient As follow table 1.
Room temperature
of Resistance (TCR)
Room temperature+100℃
Short Time Overload
(1) Applied voltage: 2.5 x rated
△
R:±1.0%
voltage
Without damage by flashover, spark,
(2) Test time: 5 seconds
arcing, burning or breakdown
Insulation Resistance
(1)
Over 100 MΩ on Overcoat layer
(2)
face up
(3)
Over 1,000 MΩ on Substrate side
face up
Resistance range:±1.0%
(1)
Without damage by flashover, spark, (2)
arcing, burning or breakdown
(3)
Setup as figure 1
Test voltage: 100V
DC
±15V
DC
Test time: 60 + 10 / - 0 seconds
Setup as figure 1
Test voltage: 100V
AC
(rms.)
Test time: 60 + 10 / - 0 seconds
Voltage Proof
Pressure Rod
(Metal)
Measurement Point A
(R=0.5 mm)
Substrate
Over coat Film
Substrate Side
Figure 1 : Measurment Setup
Insulation Plate
Spring
Sample Electrode
Voltage Supply
Metal Block
B
Measurement Point B
A
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REVISION
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SPECIFICATION FOR APPROVAL
5-2 Mechanical
Item
Solderability
Specification and Requirement
The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder
△
R: ± 1.0%
Without distinct deformation in
appearance
Test Method (JIS 5201)
Solder bath:
After immersing in flux, dip in
245
±
5℃ molten solder bath for 2
±
0.5 seconds
Resistance to Solder
Heat
Bending Test
(1) Pre-heat: 100~110℃
for 30 seconds
(2) Immersed at solder bath of
270 ± 5℃ for 10 ± 1
seconds
(3) Measuring resistance 1
hour after test
Bending value: 3 mm for 30 ± 1
△
R: ± 1.0%
Without mechanical damage such as seconds
break
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SPECIFICATION FOR APPROVAL
5-3 Endurance
Item
Rapid Change of
Temperature
Specification and Requirement
△
R:±1.0%
Without distinct damage in
appearance
Test Method (JIS 5201)
(1) Repeat 5 cycle as follow:
(-55 ± 3℃,30minutes)
→(Room
temperature, 2~3
minutes)
→(+125
± 2℃,30minutes)
→(Room
temperature 2~3
minutes)
(2) Measuring resistance
1 hour after test
(1) Environment condition:
40
± 2℃,90~95% RH
(2) Applied Voltage: rated voltage
(3) Test period: (1.5 hour ON)
→(0.5
hour OFF) cycled for
total
1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
(1) Test temperature: 70 ± 3℃
(2) Applied Voltage: rated voltage
(3) Test period: (1.5 hour ON)
→(0.5
hour OFF) cycled for
total
1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
(1) Store temperature:
-55 ± 3℃ for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
(1) Store temperature:
+125 ± 2℃ for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
Moisture with Load
△
R: ±5.0%
Without distinct damage in
appearance
Load Life
△
R: ±5.0%
Without distinct
damage in appearance
Low Temperature Store
△
R: ± 5.0%
Without distinct
damage in appearance
High Temperature Store
△
R: ± 5.0%
Without distinct
damage in appearance
stm32/stm8
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