D55342K07U93D1M-TR datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> D55342K07U93D1M-TR

D55342K07U93D1M-TR: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.25W, 93.1ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP; CategoryPassive components The resistor; File Size100KB，1 Pages; ManufacturerState of the Art Inc.

Download Datasheet Parametric View All

D55342K07U93D1M-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 93.1ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

D55342K07U93D1M-TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	CHIP
Reach Compliance Code	not_compliant
ECCN code	EAR99
structure	Chip
JESD-609 code	e4
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.46 mm
Package length	3.2 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.55 mm
method of packing	TR
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	93.1 Ω
Resistor type	FIXED RESISTOR
size code	1206
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Platinum/Gold (Pt/Au)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	100 V

Preview

Download Datasheet

View All

State of the Art, Inc.

Thick Film Chip Resistor

D55342/07 RM1206

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

250 mW

100 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

D55342 K 07 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /07* = RM1206

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.

MECHANICAL

INCHES

MILLIMETERS

.156

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.126 (.118 - .134)

.061 (.058 - .068)

.018 (.015 - .033)

.016 (.010 - .025)

.018 (.010 - .025)

.090 (.086 - .094)

.0084 grams

3.20

1.55

0.46

0.41

0.46

2.29

(3.00 - 3.40)

(1.47 - 1.73)

(0.38 - 0.84)

(0.25 - 0.64)

(2.18 - 2.39)

.067

.084

.036

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

Recommended Resources

AC power supply non-stop switching circuit using transistors c

Infrared anti-theft alarm circuit 3a

Electromagnetic current-limiting adjustable voltage-stabilized power supply circuit

Gantry milling machine variable speed starting control circuit diagram circuit

FT-TR optical signal detection circuit

Wound rotor asynchronous motor series resistor step-down starting circuit

[Technical question] How to implement low power (upf) design using FPGA?: How to implement low power (upf) design using FPGA ? Low power design is used in chip design. DC synthesis will read in upf files and generate special units, such as level shift, isolation, retention ...; eeleader FPGA/CPLD

STM Network Academy--Learning Platform Program Collection (Continuously Updated): Support the OP! Good stuff!...; bigsmartboy stm32/stm8

EEWORLD University Hall----Live Replay: TI millimeter wave radar application in industry: Live replay: TI mmWave radar applications in industry : https://training.eeworld.com.cn/course/4692...; hi5 Integrated technical exchanges

EEWORLD DIY-Software Defined Radio Active Learning Platform (1 Introduction): [i=s]This post was last edited by 不足论 on 2017-10-26 11:50[/i] Item Introduction: [url=https://wiki.analog.com/university/tools/pluto]https://wiki.analog.com/university/tools/pluto[/url]I am a pure cod...; 不足论 DIY/Open Source Hardware

T-BOX System Solution In-depth Analysis of Interfaces: [i=s]This post was last edited by alan000345 on 2018-10-17 09:11[/i] [align=center][color=rgb(85, 85, 85)][font="][size=14px][b]Section 3 Interface[/b][/size][/font][/color][/align][align=left][color=...; alan000345 TI Technology Forum

Embedded computers lead the new era of weapons and equipment: Computers are the soul of information-based and intelligent weapon systems. For quite a long time, weapons and their computers were basically self-contained systems. Since the emergence of microcomput...; 程序天使 Industrial Control Electronics

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components