http://blog.eeworld.net/Akron/archive/2008/08/01/2755643.aspx Due to the limitation of internal resources, the software design of MCU has its own particularity. The program generally does not have com...
[i=s]This post was last edited by Study_Stellaris on 2014-8-20 18:45[/i] It was the last day of the event, and I just saw this great event. Anyway, I decided to participate. I happen to be working on ...
I bought a digital tube module online, which is driven by two 74hc595 cascades. The schematic diagram of the module is as follows,The attachment is the project....
I am going to define a global variable with the content "1234567890" and put it at a certain address of FLASH, such as 0x1b00. I hope that after the program is compiled and the generated hex file is c...
[font=微软雅黑][size=3] Since [/size][/font][url=https://bbs.eeworld.com.cn/thread-377423-1-1.html][font=微软雅黑][size=3][b]EEWORLD Forum Idle Items Exchange Chip Coin Rules[/b][/size][/font][/url][font=微软雅黑...
I am designing a board using Protel in a hierarchical circuit way and the following error message appeared: #1 Error Duplicate Sheet Numbers 0 DLB.prj And POWER.sch[/font] [font=Verdana, Helvetica, Ar...
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
ISP devices, such as field programmable devices (FPGAs and CPLDs), do not require a programmer. Using programming kits provided by the device manufacturer, they employ a top-down modular design app...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
Introduction: In digital circuit calculations, there is no concept of decimal points. You know where the decimal is, but the circuit does not know where the decimal point is. Therefore, you need to...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
As the core of electric vehicles, batteries are concerned with vehicle use and maintenance. The operation of vehicles is guaranteed by the electricity generated by batteries. For batteries, battery...[Details]
Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]
Embedded System
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