mDOC H3
Embedded Flash Drive (EFD) featuring Embedded TrueFFS
®
Flash Management Software
Data Sheet, May 2008
H
IGHLIGHTS
mDOC H3 is an Embedded Flash Drive (EFD)
designed for mobile handsets and consumer
electronics devices. mDOC H3 is the new
generation of SanDisk’s successful mDOC
product family, enabling tens of millions of
handsets and other mobile devices since the
year 2000.
mDOC H3 is a hybrid device combining an
embedded thin flash controller and standard
flash memory.
In addition to the high reliability and high
system performance offered by the current
mDOC family of products, mDOC H3 offers
plug-and-play integration, support for multiple
NAND technologies and more features such as
advanced power management schemes.
mDOC H3 uses advanced Multi-Level Cell
(MLC) and binary (SLC) NAND flash
technologies, enhanced by SanDisk’s
proprietary TrueFFS embedded flash
management software running as firmware on
the flash controller.
The breakthrough in performance, size, cost
and design makes mDOC H3 the ideal solution
for mobile handsets and consumer electronics
manufacturers who require easy integration,
fast time to market, high-capacity, small form
factor, high-performance and most importantly,
highly reliable storage.
mDOC H3 enables multimedia driven
applications such as music, photo, video, TV,
GPS, games, email, office and other
applications.
E
MBEDDED
T
RUE
FFS
SanDisk’s proprietary TrueFFS flash
management software is now embedded within
the mDOC H3 device and runs as firmware
from the flash controller.
Legacy mDOC Architecture
Host
Flash
Controller
+
+
+
Flash
mDOC H3 Architecture
Host
+
+
Flash
Controller
+
Flash
Figure 1: TrueFFS - Legacy mDOC vs.
mDOC H3 Architecture
Embedded TrueFFS enables mDOC H3 to
fully emulate a hard disk to the host processor,
© 2007 SanDisk® Corporation
1
92-DS-1205-10
Rev. 1.3
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
enabling read/write operations that are
identical to a standard, sector-based hard drive.
In addition, Embedded TrueFFS employs
patented methods, such as virtual mapping,
dynamic and static wear-leveling, and
automatic block management to ensure high
data reliability and maximize flash life
expectancy.
Furthermore, it provides performance
enhancements such as multi-plane operations,
DMA support, Burst operation and Dual Data
RAM buffering.
mDOC H3 extended features are enabled by a
small driver that runs on the host side, called
DOC Driver. DOC Driver provides the host
OS with a standard Block Device interface.
The combination of Embedded TrueFFS and
DOC Driver enables a practically Plug & Play
integration in the system.
M
ULTIPLE
F
LASH
S
UPPORT
mDOC H3 with Embedded TrueFFS enables
access to advanced binary SLC NAND and
MLC NAND flash technology, making mDOC
H3 the only multi-sourced and multi-
technology EFD.
Embedded TrueFFS overcomes SLC and MLC
NAND-related error patterns by using a robust
error detection and correction (EDC/ECC)
mechanism.
mDOC H3 optimized architecture with
Embedded TrueFFS offers high reliability and
high system performance for whatever flash
technology or density utilized.
M
DOC H3 P
ROVIDES
:
Flash disk for both code and data storage
Code and data storage protection
Low voltage:
1.8V Core and I/O
3.3V Core and 3.3V/1.8V I/O (auto-detect)
Typical Current Consumption
Turbo mode: 30mA
Power Save mode: 20mA
Standby mode: 5mA
Deep Power-Down mode: 60uA-
110uA
1Gb (128MB) – 64Gb (8GB) data storage
capacity, with device cascading options for
up to 128Gb (16GB).
Enhanced Programmable Boot Block
(32KB) enabling eXecute In Place (XIP)
functionality using 16-bit access.
Small form factors:
mDOC H3 1Gb/2Gb - 115-ball
Fine-Pitch Ball Grid Array
(FBGA) 9x12mm.
mDOC H3 4Gb/8Gb - 115-ball
Fine-Pitch Ball Grid Array
(FBGA) 10x14mm.
P
LUG
-
AND
-P
LAY
I
NTEGRATION
mDOC H3 optimized architecture with
Embedded TrueFFS eliminates the need for
complicated software integration and testing
processes and enables a practically plug-and-
play integration in the system.
The replacement of one mDOC H3 device with
another, of a newer generation, requires
virtually no changes to the host. This makes
mDOC H3 the perfect solution for platforms
and reference designs, as it allows for the
utilization of more advanced NAND Flash
technology with minimal integration or
qualification efforts.
Embedded TrueFFS running from mDOC H3
means there is no need to modify and re-
qualify the flash management software on the
host system, or update mass production tools.
2
92-DS-1205-10
Rev. 1.3
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
mDOC H3 8Gb/16Gb/32Gb/64Gb
- 115-ball Fine-Pitch Ball Grid
Array (FBGA) 12x18mm
Ball to ball compatible with
mDOC G3/G4/H1 families.
Enhanced performance by implementation
of:
Multi-plane operations
DMA support
Burst operation
Dual Data RAM buffering
Read/Write Cache
Fast partition configuration
Powerful data integrity with a robust Error
Detection Code/Error Correction Code
(EDC/ECC) specifically tailored for the most
advanced flash technology.
Strong flash endurance with TrueFFS
advanced flash management software.
Reduced complexity for the host system by
moving flash management functionality to
the device.
Plug & Play integration with the host
system, due to embedding TrueFFS within
the device itself.
Support for major mobile operating
systems (OSs), including Symbian OS,
Windows Mobile, Windows CE, Linux and
more.
Compatibility with major mobile CPUs
Performance:
Sustained write: 4-8 MB/sec.
Sustained read: 15-25 MB/sec
Protection key and LOCK# signal
Sticky Lock (SLOCK) to lock boot
partition
Protected Bad Block Table.
R
ELIABILITY AND
D
ATA
I
NTEGRITY
Hardware on-the-fly Error Detection
Code/Error Correction Code (EDC/ECC),
based on a BCH algorithm, tailored for the
most advanced flash technology.
Data integrity after power failure.
Transparent bad-block management.
Dynamic and static wear-leveling.
B
OOT
C
APABILITY
32KB Programmable Boot Block with XIP
capability to replace boot ROM or NOR.
254KB Paged RAM IPL
Boot Agent for automatic download of
boot code to the Programmable Boot
Block.
Asynchronous Boot mode to enable ARM-
based CPUs, e.g. TI OMAP, Intel PXAxxx,
to boot without the need for external glue
logic.
Exceptional boot performance with Burst
operation and DMA support enhanced by
external clock.
H
ARDWARE
C
OMPATIBILITY
Configurable interface: simple SRAM-like
or multiplexed address/data interface.
CPU compatibility, including:
ARM-based CPUs
Texas Instruments OMAP, DBB
Marvell PXAxxx family
Infineon xGold family
Analog Devices (ADI) digital
Baseband devices
Freescale i.MXxx Application
processors and i.xx digital
Baseband devices
P
ROTECTION
& S
ECURITY
-
E
NABLING
16-byte Unique Identification (UID)
number.
14 configurable protected partitions for
data and code:
Write protected
Read and Write protected
One Time Programmable (OTP)
3
92-DS-1205-10
Rev. 1.3
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
Zoran ER4525
Renesas SH mobile
EMP platforms
Qualcomm MSMxxxx
Hitachi SuperH™ SH-x
Supports 16 and 32-bit architectures
Ball-out compatible with mDOC G3, G4
and H1 products: Refer to
Migration Guide
mDOC G3-P3 G3P3-LP G4 H1 to mDOC
H3
for further details.
O
PERATING
E
NVIRONMENT
Wide OS support, including:
Symbian OS
Windows Mobile
Windows CE
Linux
Nucleus
OSE
PalmOS
DOC Driver Software Development Kit
(SDK) for quick and easy support of
proprietary OSs or OS-less environments.
E
MBEDDED
T
RUE
FFS S
OFTWARE
TrueFFS (True Flash File System) is
SanDisk’s field proven patented flash
management software. TrueFFS is embedded
within the mDOC H3 device, providing full
Block Device functionality to the Operating
System (OS) file system via either TrueFFS
7.1 (for supporting both earlier mDOC
products and mDOC H3) or the DOC Driver.
TrueFFS allows for mDOC H3 to appear to the
OS as a regular hard drive, while at the same
time transparently providing robust flash media
management.
DOC Driver provides full block device
emulation for transparent file system
management
Disk-like interface
Dynamic virtual mapping
Automatic bad block management
Dynamic and static wear-leveling
Programming, duplicating and testing tools
available in source code
C
APACITY AND
P
ACKAGING
1Gb (128MB) – 64Gb (8GB) capacity,
with device cascading option for up to two
devices (128Gb).
FBGA package: 115 balls, 9x12x1.2 mm
(width x length x height)
FBGA package: 115 balls, 10x14x1.2 mm
(width x length x height)
FBGA package: 115 balls, 12x18x1.4 mm
and 12x18x1.2 mm (width x length x
height)
4
92-DS-1205-10
Rev. 1.3
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
R
EVISION
H
ISTORY
Doc. No
92-DS-1205-10
Revision
0.1
0.2
Date
January 2006
June 2006
Description
Preliminary version
RSRVD balls left floating changed
from a recommendation to a
requirement
Demux (Standard) I/F Ball H9
changed from RSRVD to VSS
Ballout change – Some NC balls
removed, resulting in 115 balls for
all products
Ball H2 changed from DPD to A0
Details on internal pull up and pull
down resistors added
DPD signal removed (replaced with
A0, which should be connected to
CPU A0 or to VSS)
Balls G1,H1,J1,K1 marked as
reserved
Ball G4 changed from RSRVD to
VCCQ
Ball D9 changed from NC to
RSRVD
Modes of operation diagram
updated
“Normal mode” name changed to
“Turbo mode”
8KB address space settings added
Added register addresses for 8KB
address space
Burst mode can only be used in
conjunction with mDOC H3 DMA
functionality
Operating Conditions updated
Asynchronous boot mode timing
diagram added
Multiplexed timing updated
Power up timing updated
Mechanical drawing updated
(removed balls from 12x18mm
drawing)
Reference
Section 2
Section 2.2
Section 2.2
Sections 2.2 and 2.3
Sections 2.2.2 and 2.3.2
Sections 2, 2.2.2 and
2.3.2
Sections 2.2.2 and 2.3.2
Section 2.3.2
Section 5
Section 5
Section 6.5
Section 7
Section 9.8.2
Section 10.3
Section 10.3.1
Section 10.3.4
Section 10.3.5
Section 10.3.11
Section 10.4.3
5
92-DS-1205-10
京公网安备 11010802033920号
EEWORLD
