MOLDING TYPE DIP INDUCTORS
1. PART NO. EXPRESSION :
SDM119N SERIES
SDM119N-R25MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : R25 = 0.25uH
(d) Tolerance code : M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
L
M
B
E
12.5
N
R30
ØW
F
E
F
12.5
C
PCB Pattern
Unit:m/m
D
Part No.
R25/R36/R47
R50/R56/R68
R30
1R2
2R0
2R5
3R0
A
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
B
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
11.5±0.5
C
10.5 Max.
10.5 Max.
10.5 Max.
10.5 Max.
10.5 Max.
10.5 Max.
D
3.4±0.5
3.4±0.5
3.4±0.5
3.4±0.5
3.4±0.5
3.4±0.5
E
5.7±0.5
7.3±0.5
6.6±0.5
6.6±0.5
6.5±0.5
6.4±0.5
F
6.3±0.5
6.0±0.5
6.6±0.5
6.6±0.5
6.9±0.5
6.3±0.5
W
1.5±0.1
1.3±0.1
1.5±0.1
1.0±0.1
0.9±0.1
1.1±0.1
L
8.5±0.5
9.4±0.5
9.3±0.5
9.3±0.5
9.5±0.5
9.0±0.5
M
8.5±0.5
9.4±0.5
9.3±0.5
9.3±0.5
9.5±0.5
9.0±0.5
N
1.8±0.1
1.6±0.1
1.8±0.1
1.2±0.1
1.1±0.1
1.2±0.1
3. SCHEMATIC :
4. MATERIALS :
(a) Core : M-Iron Core
(b) Wire : Enamelled Copper Wire
(c) Adhesive : Epoxy
5. FEATURES :
a) Shielded construction
b) Frequency up to 1MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
MOLDING TYPE DIP INDUCTORS
6. GENERAL SPECIFICATION :
a) Test Frequency : 100KHz/1.0Vdc
b) Operating temp. : -25°C to +125°C
c) Ambient temp. : 25°C
d) Irms (A) : Will cause an approximately temp. rise < 40°C typ.
e) Isat (A) : Will cause L
0
to drop approximately 20% typ.
SDM119N SERIES
f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Part No.
SDM119N-R25MF
SDM119N-R30MF
SDM119N-R36MF
SDM119N-R50MF
SDM119N-R56MF
SDM119N-R68MF
SDM119N-1R1MF
SDM119N-1R2MF
SDM119N-2R0MF
SDM119N-2R5MF
SDM119N-3R0MF
Inductance L
0
( uH )
±20% @ 0Adc
0.25
0.30
0.36
0.50
0.56
0.68
1.1
1.2
2.0
2.5
3.0
Q
Min.
20
15
20
20
15
20
15
10
15
20
15
Irms
(A)
Typ.
38
42
40
35
32
32
20
35
21
15
20
Isat
(A)
Max.
42
45
50
40
40
38
30
35
30
28
25
DCR
(m )
Max.
0.5
0.8±10%
0.6
0.8
0.8
1.0
1.5
1.05±8%
3.7
4.5
4.0
8. CHARACTERISTICS CURVES :
DC Current vs. Inductance & Temperature Rise
SDM119N-R25MF
DMPI119N-R25
0.5
100
90
0.4
80
0.6
SDM119N-R30MF
DMPI119N-R30
100
90
80
INDUCTANCE (uH)
TEMP. RISE(
o
C)
0.4
0.3
60
50
60
50
40
0.2
30
20
10
0
0
0.2
40
30
0.1
20
10
0
0
0
10
20
30
40
50
0
10
20
30
40
50
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
TEMP. RISE(
o
C)
70
INDUCTANCE (uH)
70
MOLDING TYPE DIP INDUCTORS
9. RELIABILITY AND TEST CONDITION :
SDM119N SERIES
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
Saturation Current (Isat)
Mechanical Performance Test
Solderability Test
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP-4192A, HP4284A, CH1320
Agilent 33420A
Irms(A) will cause an temp rise < 40°C typ.
Isat(A) will cause Lo to drop approximately 25%
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
Natural
cooling
150°C
60
seconds
4±1
seconds
After fluxing, component shall be dipped in a melted
solder bath at 245±5°C for 5 seconds
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ±3%
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux : rosin
260°C
Dip Time : 10±0.5sec.
150°C
Preheating
Dipping
Natural
cooling
60
seconds
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 85±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
1. Appearance : No damage
2. Inductance : Within ±3% of initial value.
Thermal Shock
No disconnection or short circuit.
Temperature : -40±5°C
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Conditions of 1 cycle.
Step
1
2
3
4
Temperature (°C)
-25±3
Room Temperature
85±3
Room Temperature
Times (min.)
30±3
Within 3
30±3
Within 3
Low Temperature
Life Test
Total : 5 cycles
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±5% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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EEWORLD
