• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
PowerPAK ChipFET Single
1
2
D
D
D
D
D
D
G
S
S
APPLICATIONS
• Load Switch, PA Switch, and for Portable Applications
• Point-of-Load
3
4
D
8
7
6
5
Marking Code
AG
XXX
Lot Traceability
and Date Code
G
Bottom
View
Part # Code
S
N-Channel
MOSFET
Ordering Information:
Si5486DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
20
±8
12
a
12
a
11.6
b, c
9.3
b, c
40
12
a
2.6
b, c
31
20
3.1
b, c
2
b, c
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
A
Pulsed Drain Current
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Continuous Source-Drain Diode Current
Soldering Recommendations (Peak Temperature)
d, e
P
D
T
J
, T
stg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum
Maximum Junction-to-Case (Drain)
Junction-to-Ambient
b, f
t
5s
Steady State
Symbol
R
thJA
R
thJC
Typical
34
3
Maximum
40
4
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (
www.vishay.com/doc?73257
). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 °C/W.
Document Number: 73783
S13-0194-Rev. C, 28-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si5486DU
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 9.3 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 9.1 A, V
GS
= 0 V
0.8
30
17
12
18
T
C
= 25 °C
12
40
1.2
60
30
A
V
ns
nC
ns
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
V
DS
= 10 V, V
GS
= 8 V, I
D
= 9.3 A
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1.1
I
D
9.3 A, V
GEN
= 10 V, R
g
= 1
V
DD
= 10 V, R
L
= 1.1
I
D
9.3 A, V
GEN
= 4.5 V, R
g
= 1
f = 1 MHz
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 9.3 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 8 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
5
V, V
GS
= 4.5 V
V
GS
½4.5
V, I
D
= 7.7 A
V
GS
½2.5
V, I
D
= 7.3 A
V
GS
½1.8
V, I
D
= 4.8 A
V
DS
= 10 V, I
D
= 7.7 A
40
0.012
0.014
0.017
46
2100
310
180
36
21
3.3
3.1
5
10
15
50
15
7
15
55
10
15
25
75
25
15
25
85
15
ns
54
32
nC
pF
0.015
0.017
0.021
S
0.4
20
21
- 3.4
1
± 100
1
10
V
mV/°C
V
nA
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 73783
S13-0194-Rev. C, 28-Jan-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si5486DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
40
V
GS
= 5 thru 2
V
32
I
D
- Drain C
u
rrent (A)
I
D
- Drain C
u
rrent (A)
16
20
24
12
T
C
= - 55 °C
8
T
C
= 125 °C
16
V
GS
= 1.5
V
8
V
GS
= 1
V
0
0.0
0.4
0.8
1.2
1.6
2.0
4
T
C
= 25 °C
0
0.0
0.3
0.6
0.9
1.2
1.5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.025
3000
Transfer Characteristics
R
DS(on)
- On-Resistance (mΩ)
0.022
C - Capacitance (pF)
2500
C
iss
2000
0.019
V
GS
= 1.8
V
0.016
V
GS
= 2.5
V
0.013
V
GS
= 4.5
V
1500
1000
C
oss
C
rss
0
4
8
12
16
20
500
0.010
0
8
16
24
32
40
0
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
8
R
DS(on)
- On-Resistance (
N
ormalized)
1.6
Capacitance
I
D
= 9.3 A
V
GS
- Gate-to-So
u
rce
V
oltage (
V
)
V
GS
= 4.5, 2.5
V,
1.8
V
I
D
= 7.7 A
1.4
6
V
DS
= 10
V
V
DS
= 16
V
4
1.2
1.0
2
0.8
0
0
8
16
24
32
40
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73783
S13-0194-Rev. C, 28-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si5486DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
R
DS(on)
- Drain-to-So
u
rce On-Resistance (mΩ)
40
0.040
I
D
= 7.7 A
0.035
T
J
= 150 °C
I
S
- So
u
rce C
u
rrent (A)
T
J
= 25 °C
10
0.030
0.025
T
A
= 125 °C
0.020
0.015
T
A
= 25 °C
0.010
0
1
2
3
4
5
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.9
0.8
0.7
0.6
0.5
0.4
0.3
10
40
On-Resistance vs. Gate-to-Source Voltage
50
I
D
= 250
µA
Po
w
er (
W
)
30
V
GS(th)
(
V
)
20
0.2
0.1
- 50
0
0.001
- 25
0
25
50
75
100
125
150
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
100
µs
10
I
D
- Drain C
u
rrent (A)
1 ms
10 ms
1
100 ms
T
A
= 25 °C
Single Pulse
0.1
BVDSS Limited
0.01
0.1
1
10
100
1s
10 s
DC
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
For technical questions, contact:
pmostechsupport@vishay.com
Document Number: 73783
S13-0194-Rev. C, 28-Jan-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si5486DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
40
35
30
32
I
D
- Drain C
u
rrent (A)
Po
w
er Dissipation (
W
)
25
20
15
10
5
24
16
Package Limited
8
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max.)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 73783
S13-0194-Rev. C, 28-Jan-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
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Microchip MCU
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