IRFR224, IRFU224, SiHFR224, SiHFU224
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
(Ω)
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
14
2.7
7.8
Single
D
FEATURES
250
1.1
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR224/SiHFR224)
• Straight Lead (IRFU224/SiHFU224)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available
Available
RoHS*
COMPLIANT
DPAK
(TO-252)
IPAK
(TO-251)
G
DESCRIPTION
Third generation Power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave solderig techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel
MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
Note
a. See device orientation.
DPAK (TO-252)
IRFR224PbF
SiHFR224-E3
IRFR224
SiHFR224
DPAK (TO-252)
IRFR224TRPbF
a
SiHFR224T-E3
a
IRFR224TR
a
SiHFR224T
a
DPAK (TO-252)
IRFR224TRLPbF
a
SiHFR224TL-E3
a
IRFR224TRL
a
SiHFR224TL
a
IPAK (TO-251)
IRFU224PbF
SiHFU224-E3
IRFU224
SiHFU224
ABSOLUTE MAXIMUM RATINGS
T
C
= 25 °C, unless otherwise noted
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
a
Linear Derating Factor
Linear Derating Factor (PCB Mount)
e
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
Repetitive Avalanche Energy
a
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
T
C
= 25 °C
T
A
= 25 °C
E
AS
I
AR
E
AR
P
D
dV/dt
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
250
± 20
3.8
2.4
15
0.33
0.020
130
3.8
4.2
42
2.5
4.8
W/°C
mJ
A
mJ
W
V/ns
A
UNIT
V
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IRFR224, IRFU224, SiHFR224, SiHFU224
ABSOLUTE MAXIMUM RATINGS
T
C
= 25 °C, unless otherwise noted
PARAMETER
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
for 10 s
SYMBOL
T
J
, T
stg
LIMIT
- 55 to + 150
260
d
UNIT
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V; starting T
J
= 25 °C, L = 14 mH, R
G
= 25
Ω,
I
AS
= 3.8 A (see fig. 12).
c. I
SD
≤
3.8 A, dI/dt
≤
90 A/µs, V
DD
≤
V
DS
, T
J
≤
150 °C.
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 material).
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
(PCB Mount)
a
Maximum Junction-to-Ambient
Maximum Junction-to-Case
SYMBOL
R
thJA
R
thJA
R
thJC
TYP.
-
-
-
MAX.
50
110
3.0
°C/W
UNIT
Note
a. When mounted on 1" square PCB ( FR-4 or G-10 material).
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
Between lead,
6 mm (0.25") from
package and center of
die contact
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
ΔV
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 µA
V
GS
= ± 20 V
V
DS
= 250 V, V
GS
= 0 V
V
DS
= 200 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 2.3 A
b
V
DS
= 50 V, I
D
= 2.3 A
b
250
-
2.0
-
-
-
-
1.5
-
0.36
-
-
-
-
-
-
-
-
4.0
± 100
25
250
1.1
-
V
V/°C
V
nA
µA
Ω
S
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
c
-
-
-
-
260
77
15
-
-
-
7.0
13
20
12
4.5
7.5
-
-
-
14
2.7
7.8
-
-
-
-
-
nH
-
ns
nC
pF
V
GS
= 10 V
I
D
= 4.4 A, V
DS
= 200 V,
see fig. 6 and 13
b, c
-
-
-
V
DD
= 125 V, I
D
= 4.4 A,
R
G
= 18
Ω,
R
D
= 28
Ω,
see fig. 10
b, c
-
-
-
-
-
S
G
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IRFR224, IRFU224, SiHFR224, SiHFU224
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
PARAMETER
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
Current
a
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
-
-
-
-
-
-
-
200
0.93
3.8
A
15
1.8
400
1.9
V
ns
µC
G
S
T
J
= 25 °C, I
S
= 3.8 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 4.4 A, dI/dt = 100 A/µs
b
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width
≤
300 µs; duty cycle
≤
2 %.
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics, T
C
= 25 °C
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics, T
C
= 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
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IRFR224, IRFU224, SiHFR224, SiHFU224
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
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IRFR224, IRFU224, SiHFR224, SiHFU224
V
DS
V
GS
R
G
R
D
D.U.T.
+
-
V
DD
10
V
Pulse
width
≤
1
µs
Duty factor
≤
0.1
%
Fig. 10a - Switching Time Test Circuit
V
DS
90
%
10
%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
L
Vary
t
p
to obtain
required I
AS
R
G
V
DS
t
p
V
DD
D.U.T.
I
AS
10
V
t
p
0.01
Ω
I
AS
Fig. 12b - Unclamped Inductive Waveforms
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5
V
DS
+
-
V
DD
V
DS
Fig. 12a - Unclamped Inductive Test Circuit
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