BG025-78-G-0600-0250-0250-N-D datasheet, PDF

Datasheet> All Categories > The connector> The connector> BG025-78-G-0600-0250-0250-N-D

BG025-78-G-0600-0250-0250-N-D: DescriptionBoard Connector, 78 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, Black Insulator,; CategoryThe connector The connector; File Size138KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BG025-78-G-0600-0250-0250-N-D Overview

Board Connector, 78 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, Black Insulator,

BG025-78-G-0600-0250-0250-N-D Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
body width	0.197 inch
subject depth	0.098 inch
body length	3.9 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (10)
Contact completed and terminated	Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	600VAC V
Durability	100 Cycles
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	NYLON
JESD-609 code	e3
Manufacturer's serial number	BG025
Match contact row spacing	0.1 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.54 mm
Plating thickness	10u inch
Rated current (signal)	3 A
Guideline	UL
reliability	COMMERCIAL
Terminal length	0.098 inch
Termination type	SOLDER
Total number of contacts	78

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BG025: 2.54mm PITCH ELEVATED PIN HEADER, DUAL ROW, THROUGH-HOLE, VERTICAL

5.08

CONTACTS

DIMENSIONS

2.54

5.08

7.62

10.16

12.70

15.24

17.78

20.32

22.86

25.40

27.94

30.48

33.02

35.56

38.10

40.64

43.18

45.72

48.26

50.80

53.34

55.88

58.42

60.96

63.50

66.04

68.58

71.12

73.66

76.20

78.74

81.28

83.82

86.36

88.90

91.44

93.98

96.52

99.06

5.08

7.62

10.16

12.70

15.24

17.78

20.32

22.86

25.40

27.94

30.48

33.02

35.56

38.10

40.64

43.18

45.72

48.26

50.80

53.34

55.88

58.42

60.96

63.50

66.04

68.58

71.12

73.66

76.20

78.74

81.28

83.82

86.36

88.90

91.44

93.98

96.52

99.06

101.60

Ø1.02

(Typ.)

2.54

0.64mm SQ PIN (Typ.)

RECOMMENDED PCB LAYOUT

5.08

C±0.2

E±0.2

2.54

Typ. (Non-Accum)

D±0.2

2.54 Typ.

A±0.25

B±0.38

2.54

SPECIFICATIONS

规格

Ordering Grid

CURRENT RATING

电流额定值

: 3 AMP

INSULATOR RESISTANCE

绝缘电阻值

: 1000 MΩ Min.

CONTACT RESISTANCE

接触电阻值

: 20mΩ Max.

DIELECTRIC WITHSTANDING

耐电压

: AC 600 V

No. of Contacts

OPERATING TEMPERATURE

工½温度

: -40°C TO +105°C

04 to 80

CONTACT MATERIAL

端子物料

: COPPER ALLOY

Contact Plating

INSULATOR MATERIAL

绝缘½物料

A = Gold Flash All Over

(Standard)

STANDARD

标准物料

: POLYAMIDE

聚醯胺

, NYLON 6T, UL 94V-0

B = Selective Gold Flash Contact Area/Tin On Tail

OPTIONS

可选物料

: POLYESTER

聚酯

, LCP, UL 94-V0

C = Tin All Over

OR POLYESTER

聚酯

, PBT, UL94-V0

G = 10µ" Gold Contact Area/Tin On Tail

SOLDERING PROCESS

可焊性

H = 15µ Gold Contact Area/Tin On Tail

NYLON 6T (STANDARD

标准物料

) -

I = 30µ" Gold Contact Area/Tin On Tail

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 230°C for 5-10 sec.

Dimension C (1/100mm) (Post Height)

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

0600 = 6.00mm

(Standard)

PBT (OPTION

可选物料

) - MANUAL SOLDER

人工焊接

: 330°C for 3-5 sec.

Or specify Dimension C

(NOT SUITABLE FOR HI-TEMP PROCESS

不适合高温处理

)

e.g. 0250 = 2.50mm

LCP (OPTION

可选物料

) -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec.

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

)

BG120

BG140

BG150

BG151

BG160

BG165

BG170

BG175

BG180

BG185

BG190

BG195

BG200

BG210

BG025

XXXX

REQUEST SAMPLES

AND QUOTATION

Packing Options

G = Plastic Box

(Standard)

Insulator Material

D = Tube

N = Nylon 6T

(Standard)

E = Tube with Cap

P = PBT

L = LCP

Dimension E (1/100mm) (Stack Height)

1040 = 10.40mm

(Standard)

Or specify Dimension E

e.g. 0250 = 2.50mm

Dimension D (1/100mm) (Tail Length)

0300 = 3.00mm

(Standard)

Or specify Dimension D

e.g. 0250 = 2.50mm

Tolerances

(Except as noted)

Part Number:-

Date:-

Dimensions in mm

X.°±5°

.X°±2°

X.X ± 0.20

X.XX ± 0.15 .XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X. ± 0.30

Third Angle Projection

BG025

Description:-

30 OCT 06

DETAIL

REV

DATE

LYH

PACKING

OPTIONS

27/04/09

SOLDER

TEMP. INFO

05/08/09

PLATING OPTION

'H' ADDED

22/11/10

DRAWING INSULATOR

RELEASE MATERIAL

30/10/06

12/03/09

2.54mm PITCH ELEVATED PIN HEADER, DUAL ROW

THROUGH-HOLE, VERTICAL

Scale

NTS

www.gct.co

Drawn by

LYH

E & OE

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Sheet No.

1/1

Recommended Resources

Phase lag compensation circuit

555 assembled 10W siren

Triangle gas water heater circuit diagram

AD586 superposition circuit diagram

Differential tube preamplifier circuit diagram

Last seven days! If you have any suggestions, feel free to share them!: [font=微软雅黑][size=3]We have conducted a series of suggestion collection activities: Looking forward to 2013, I will give suggestions for EEWORLD! [url]https://bbs.eeworld.com.cn/thread-365179-1-1.html[...; EEWORLD社区 Suggestions & Announcements

Hercules has a connection error when debugging. Has anyone encountered this situation?: As the title says, I bought a TI hercules USB Stick development kit, the chip is TMS570LS3137 ZWT, the debug was fine yesterday, but today it suddenly can't connect, I tried for a long time but couldn...; victor9079 Microcontroller MCU

Modern power supply technology: ...; wzt Power technology

(Extra 7) GD32L233 Review - FLASH Read and Write: ## Introduction Today this is a flash read and write test. ## Flash memory structure The flash memory controller (FMC) provides all the functions required by the on-chip flash memory. Generally speaki...; 韵湖葱白 GD32 MCU

Whose PPP was affected?: When I connect my mobile phone to my PC as a modem and dial a number using the PC's modem, does the modem's PPP protocol stack work? Can anyone who has read the relevant source code determine this?...; jqq850226 Embedded System

ZTE Corporation's Printed Circuit Board Design Specifications Series Standards: [align=left]"Printed Circuit Board Design Specifications" is a series of standards. The currently uploaded materials include the following parts: [/align][align=left]Part 1 (i.e. Q/ZX 04.100.1): Docum...; flyriz PCB Design

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components