Table S3. Electrical Characteristics for Surface-mount Devices
continued
Part Number
miniSMD
continued
Size 4532 mm/1812 mils
miniSMDM200F*
†
miniSMDC260
miniSMDM260
†
miniSMDM260F*
†
miniSMDE
Size 11550 mm/4420 mils
miniSMDE190
midSMD
Size 5050 mm/2018 mils
SMD030-2018
SMD050-2018
SMD100-2018
SMD150-2018
SMD200-2018
SMD
Size 7555 mm/2920 mils
SMD030
SMD050
SMD075
SMD075F*
SMD100
SMD100/33
SMD125
SMD260
SMD260-RB
SMD300
SMD2
Size 8763 mm/3425 mils
SMD150
SMD150/33
SMDH160
SMD185
SMD200
SMD250
Telecom Surface-mount**
TSL250-080
TS250-130
TSV250-130
TS600-170
TS600-200-RA
TSM600-250
TSM600-250-RA
I
H
(A)
I
T
(A)
V
MAX
(V
DC
)
I
MAX
(A)
P
D TYP
(W)
Max. Time-to-Trip
(A)
(s)
R
MIN
(Ω)
R
TYP
(Ω)
R
1 MAX
(Ω)
Figures for
Dimensions
2.00
2.60
2.60
2.60
3.50
5.00
4.55
4.55
8
6
6
6
40
40
40
40
0.6
0.6
0.6
0.6
8.0
8.0
8.0
8.0
3.00
7.00
6.00
6.00
0.020
0.015
0.010
0.010
0.040
0.035
0.030
0.030
0.060
0.047
0.043
0.043
S5
S3
S5
S5
1.90
3.80
16
100
1.4
10
2.0
0.024
0.065
0.080
S3
0.30
0.55
1.10
1.50
2.00
0.80
1.20
2.20
3.00
4.20
60
57
15
15
6
20
10
40
40
40
0.7
1.0
1.2
1.4
1.4
1.5
2.5
8.0
8.0
8.0
1.5
5.0
0.5
1.0
3.0
0.500
0.200
0.100
0.070
0.048
1.40
—
0.25
0.13
0.07
2.300
1.000
0.400
0.180
0.100
S6
S6
S6
S6
S6
4
0.30
0.50
0.75
0.75
1.10
1.10
1.25
2.60
2.60
3.00
0.60
1.00
1.50
1.50
2.20
2.20
2.50
5.20
5.00
6.00
60
60
30
30
30
33
15
6
6
6
10
10
40
40
40
40
40
40
40
40
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.3
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
5.0
8.0
3.0
4.0
0.3
0.3
0.5
0.5
2.0
20.0
60.0
35.0
1.200
0.350
0.350
0.350
0.120
0.120
0.070
0.025
0.030
0.015
3.00
0.87
0.67
0.67
0.30
0.27
0.16
0.05
0.055
0.033
4.800
1.400
1.000
1.000
0.480
0.410
0.250
0.075
0.075
0.048
S7
S7
S7
S7
S7
S7
S7
S7
S7
S7
1.50
1.50
1.60
1.80
2.00
2.50
0.08
0.13
0.13
0.17
0.20
0.25
0.25
3.00
3.00
3.20
3.60
4.00
5.00
0.16
0.26
0.26
0.40
0.40
0.86
0.86
15
33
16
33
15
15
250***
250***
650
250***
600***
600***
600***
600***
40
40
70
40
40
40
3.0
3.0
1.1
3.0
3.0
3.0
3.0
3.0
1.7
1.7
2.1
1.2
1.7
1.7
1.2
1.1
1.5
2.5
2.5
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
1.0
1.0
1.0
1.0
1.0
3.0
3.0
5.0
5.0
15.0
5.0
12.0
25.0
1.8
2.5
3.0
21.0
21.0
6.0
6.0
0.060
0.080
0.050
0.065
0.050
0.035
5.0
6.5
4.0
4.0
4.0
1.0
1.0
0.16
0.15
0.10
0.12
0.09
0.06
11.0
12.0
7.0
9.0
7.5
3.5
3.0
0.250
0.230
0.150
0.165****
0.125
0.085
20.0****
20.0
12.0****
18.0
13.5
7.0
5.0
S7
S7
S7
S7
S7
S7
S7
S8
S10
S9
S9
—
—
*F: lead-free device
†
Electrical characteristics determined at 25°C.
**These products are intended for telecom applications. Time-to-trip is typical, please see Telecom and Networking section for details.
***RMS max. voltage.
****R
1 MAX
is measured one hour post-trip or 24 hours post-reflow at 20°C.
I
H
= Hold current: maximum current device will pass without interruption in 20°C still air.
I
T
= Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.
V
MAX
= Maximum voltage device can withstand without damage at rated current.
I
MAX
= Maximum fault current device can withstand without damage at rated voltage.
P
D
= Power dissipated from device when in the tripped state in 20°C still air.
R
1 MAX
is measured one hour post reflow.
R
TYP
= Typical resistance of device as supplied at 20°C unless otherwise specified.
192
PolySwitch Surface-mount Resettable Devices
Raychem Circuit Protection
Embedded System
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