REVISIONS
LTR
A
B
DESCRIPTION
Drawing updated to reflect current requirements. - ro
Drawing updated as part of 5 year review. -rrp
DATE (YR-MO-DA)
02-09-19
07-08-13
APPROVED
R. MONNIN
ROBERT M. HEBER
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
PREPARED BY
RICK C. OFFICER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, OPERATIONAL
AMPLIFIER, WIDEBAND, HIGH SLEW RATE,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
91-11-22
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-87787
DSCC FORM 2233
APR 97
5962-E532-07
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87787
01
C
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
HA-2539
EL-2039
Circuit function
High slew rate wideband operational amplifier
High slew rate wideband operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
2
Descriptive designator
GDIP1-T14 or CDIP2-T14
CQCC1-N20
Terminals
14
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Voltage between +V
S
and –V
S
terminals ................................ 35 V dc
Differential input voltage (V
ID
) ................................................ 6.0 V dc
Voltage at either input terminal ...............................................
Peak output current (
<
10 % duty cycle) ................................
Power dissipation (P
D
):
Case C ................................................................................
Case 2 .................................................................................
Storage temperature range .....................................................
Lead temperature (soldering, 10 seconds) .............................
Junction temperature (T
J
) .......................................................
+V
S
to –V
S
50 mA
1.03 W 1/
1.06 W 2/
-65°C to +150°C
+275°C
+175°C
Thermal resistance, junction-to-case (
θ
JC
) ............................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (
θ
JA
):
Case C ................................................................................ 98°C/W
Case 2 ................................................................................. 95°C/W
____
1/ Derate linearly above T
A
= +75°C at 10.2 mW/°C.
2/ Derate linearly above T
A
= +75°C at 10.6 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87787
SHEET
B
2
1.4 Recommended operating conditions.
Positive supply voltage range (+V
S
) ....................................... +12 V dc to +15 V dc
Negative supply voltage range (-V
S
) ....................................... -12 V dc to -15 V dc
Common mode input voltage (V
CM
) .......................................
≤
|(+V
S
– (-V
S
)) / 2|
Load resistance (R
L
) ............................................................... 1.0 kΩ
Ambient operating temperature range (T
A
) ............................. -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87787
SHEET
B
3
ADI Reference Circuit
京公网安备 11010802033920号
EEWORLD
