SM Crystal - High Frequency Fundamental Mode
Specifications
2011/65/EU
GSX-328
Product
GSX-328
Option
Codes
Parameters
Frequency range:
16.0 ~ 256MHz
±10ppm
±20ppm
±30ppm
Other values
±10ppm
±20ppm
±30ppm
±50ppm
Other values
Calibration tolerance:
M
N
B
D
F
S
specify
F
3
1
2
3
specify
1
2
3
5
specify
2
4
specify
Temperature stability:
2.50
±0.10
2.00
±0.10
0.70
(max)
SOLDER PAD LAYOUT
0.50
1
4
0.90
2
0.60
3
1
2
1.00
0.30
4
3
1.00
Operating temperature range:
-20 to +70°C
-40 to +85°C
Other values
Storage temperature range:
-40 to +90°C
Circuit condition:
8pF
9pF
12pF
16pF
20pF
Series resonant
Other values
1.20 1.20
TOP VIEW
PAD
1
2
3
4
CONNECTION
Crystal
Ground & lid
Crystal
Ground & lid
Oscillation mode:
Fundamental (16.0 ~ 256MHz)
3rd overtone (60.0 ~ 150MHz)
Static capacitance (C
0
):
7pF max
Features
Fundamental mode up to 256MHz
Plasma etched inverted mesa process
Wide pulling range (fundamental mode)
Small & medium volumes also available
Custom frequencies available on short lead times
Equivalent series resistance (max):
100Ω (16.0 ~ 19.9MHz)
90Ω (16.0 ~ 29.9MHz)
60Ω (30.0 ~ 256MHz, fund)
Ageing:
±3ppm max first year
Test drive level:
10μW typ, 100μW max
Soldering condition:
260°C, 10sec x2 max
Standard.
Optional - Please specify required code(s) when ordering
Ordering Information
Product name + option codes + frequency
eg:
GSX-328/112DF 12.80MHz
10/10/20/16-F
GSX-328/232BF 100MHz
20/30/20/12-F
Option code X (eg GSX-328/X) denotes a custom specification.
Tel:
+44 1460 256 100
08 Jun 2016
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Product Information
Construction
GSX-328
Ceramic body with gold-plated pads
Metal lid, seam sealed
Composition
This product is lead-free, and is fully compliant with
the RoHS 2 directive 2011/65/EC
2011/65/EU
Pb
LeadFree
Packaging & Handling
Production quantities supplied on T&R, 3k pcs per reel.
Small quantities may be supplied on tape (no reel), or in bulk.
Soldering Profile
°C
260°C ±5°C
10s max
Marking
FREQUENCY
DC
Marking type: Laser
DC = Date code in YM, eg
“EB”
= Feb 2015
260
200
5°C/s max
A
B
C
D
E
F
G H
J
K
L M
Y
1
2
3
4
5
6
7
8
9
0
M Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
100
5°C/s max
Tape & Reel Specification
2.0 2.0
0.25
±0.05
1.1Ø 1.5Ø
1.75
0
Preheat
140~160°C
90s max
200s max
Heat
> 200°C
40s max
Slow
cooldown
Time
5°
±0.05
MARK
3.5
±0.05
2.8
8.0
±0.2
Maximum solder resistance: 260
°
C x 10 secs x 2.
1.25
±0.05
2.25
±0.05
FEED
9.0
±1.0
1.5
120°
±0.3
2.50
21Ø
180Ø
+0/-3
13Ø
80Ø
Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated.
Tel:
+44 1460 256 100
08 Jun 2016
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Embedded System
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