|
SN74CB3T16212DGGR |
SN74CB3T16212ZQLR |
SN74CB3T16212DGVR |
74CB3T16212DGGRG4 |
| Description |
24-Bit FET Bus-Exchange 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter 56-TSSOP -40 to 85 |
24-Bit FET Bus-Exchange 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter 56-BGA MICROSTAR JUNIOR -40 to 85 |
24-Bit FET Bus-Exchange 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter 56-TVSOP -40 to 85 |
24-Bit FET Bus-Exchange 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter 56-TSSOP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
TSSOP |
BGA |
SSOP |
TSSOP |
| package instruction |
TSSOP-56 |
VFBGA, BGA56,6X10,25 |
TSSOP, TSSOP56,.25,16 |
TSSOP, TSSOP56,.3,20 |
| Contacts |
56 |
56 |
56 |
56 |
| Reach Compliance Code |
compliant |
compli |
compli |
compli |
| series |
CB3T/3VT |
CB3T/3VT |
CB3T/3VT |
CB3T/3VT |
| JESD-30 code |
R-PDSO-G56 |
R-PBGA-B56 |
R-PDSO-G56 |
R-PDSO-G56 |
| JESD-609 code |
e4 |
e1 |
e4 |
e4 |
| length |
14 mm |
7 mm |
11.3 mm |
14 mm |
| Logic integrated circuit type |
BUS EXCHANGER |
BUS EXCHANGER |
BUS EXCHANGER |
BUS EXCHANGER |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Number of digits |
2 |
2 |
2 |
2 |
| Number of functions |
12 |
12 |
12 |
12 |
| Number of ports |
4 |
4 |
4 |
4 |
| Number of terminals |
56 |
56 |
56 |
56 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
VFBGA |
TSSOP |
TSSOP |
| Encapsulate equivalent code |
TSSOP56,.3,20 |
BGA56,6X10,25 |
TSSOP56,.25,16 |
TSSOP56,.3,20 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power supply |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
| propagation delay (tpd) |
0.25 ns |
0.25 ns |
0.25 ns |
0.25 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.2 mm |
1 mm |
1.2 mm |
1.2 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
| Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
BALL |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.65 mm |
0.4 mm |
0.5 mm |
| Terminal location |
DUAL |
BOTTOM |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
6.1 mm |
4.5 mm |
4.4 mm |
6.1 mm |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
| Factory Lead Time |
1 week |
1 week |
1 week |
- |