REVISIONS
LTR
D
E
DESCRIPTION
Corrected dimension D2 for case outlines U, X, and 4. Corrected
dimensions D/E and D1/E1 for case outline Y. -sld
Added case outline 9. Added device type 05. Added vendor cage
0EU86 for device types 01 through 03 in the Standard Microcircuit
Drawing Source Approval Bulletin. Figure 1; Made corrections to case
outline M. Added thermal resistance ratings for all case outlines to
paragraph 1.3 . –sld
Added case outline A. Updated drawing to current requirements of
MIL-PRF-38534. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
Table I; For COE capacitance test, changed the maximum limit from
32 pF to 36 pF and for the CWE and CAD tests changed the
maximum limit from 32 pF to 34 pF for the case outline N only.
Updated drawing to the current requirements. -sld
Update drawing to latest requirements of MIL-PRF-38534. -gc
DATE (YR-MO-DA)
98-10-02
APPROVED
K.A. Cottongim
00-05-11
Raymond Monnin
F
G
H
03-02-21
03-10-10
06-02-03
Raymond Monnin
Raymond Monnin
Raymond Monnin
J
17-10-17
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
J
35
J
15
J
36
J
16
J
17
J
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
J
19
J
20
J
21
J
1
J
22
J
2
J
23
J
3
J
24
J
4
J
25
J
5
J
26
J
6
J
27
J
7
J
28
J
8
J
29
J
9
J
30
J
10
J
31
J
11
J
32
J
12
J
33
J
13
J
34
J
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY, FLASH
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 512K x 32-BIT
DRAWING APPROVAL DATE
96-07-31
REVISION LEVEL
J
SIZE
A
SHEET
CAGE CODE
67268
1 OF
36
5962-94612
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
5962-E036-18
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
94612
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
A
Case
outline
(see 1.2.4)
A
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels
and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
F512K32-150
F512K32-120
F512K32-090
F512K32-070
F512K32-060
Circuit function
EPROM FLASH, 512K x 32-bit
EPROM FLASH, 512K x 32-bit
EPROM FLASH, 512K x 32-bit
EPROM FLASH, 512K x 32-bit
EPROM FLASH, 512K x 32-bit
Access time
150 ns
120 ns
90 ns
70 ns
60 ns
1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
J
5962-94612
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
M 1/
N
T
U
X
Y
Z
4
9 1/
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
68
68
68
66
66
68
68
66
68
Package style
Co-fired ceramic, single cavity, quad flatpack
Co-fired ceramic, single cavity, quad flatpack
Co-fired ceramic, single/dual cavity, quad flatpack
Co-fired ceramic, single cavity, quad flatpack, low capacitance
Co-fired ceramic, single cavity, low profile, quad flatpack
Co-fired ceramic, hex-in-line, single cavity, with standoffs
Co-fired ceramic, hex-in-line, single cavity, without standoffs
Co-fired ceramic, single cavity, quad flatpack, with tie bars
Co-fired ceramic, single cavity, ultra low profile, quad flatpack
Co-fired ceramic, 1.075", hex-in-line, single cavity, with standoffs
Co-fired ceramic, single cavity, ultra low profile, quad flatpack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) 3/ ...................................................
Signal voltage range (V
G
)(any pin except A9 ) 3/ ......................
Power dissipation (P
D
) ...............................................................
Thermal resistance, junction-to-case (θ
JC
):
Case outlines A, M and Z...........................................................
Case outlines U and 4................................................................
Case outlines X and Y ...............................................................
Case outline N ...........................................................................
Case outline B and 9..................................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Data retention ............................................................................
Endurance (write/erase cycles) ..................................................
A9 voltage for sector protect (V
ID
) 4/ .........................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ........................................................
Input low voltage range (V
IL
) ......................................................
Input high voltage range (V
IH
) ....................................................
Case operating temperature range (T
C
) .....................................
A9 voltage for sector protect ......................................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.5 V dc
-55°C to +125°C
+11.5 V dc to +12.5 V dc
-2.0 V dc to +7.0 V dc
-2.0 V dc to +7.0 V dc
1.32 W Maximum at 5 MHz
10.2°C/W
10.63°C/W
6.5°C/W
12.36°C/W
4.57°C/W
-65°C to +150°C
+300°C
10 years minimum
10,000 cycles minimum
-2.0 V dc to +14.0 V dc
1/
2/
3/
4/
Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system
application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are
necessary.
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input may overshoot V
SS
to -2.0 V for periods
of up to 20 ns. Maximum DC voltage on output and I/O pins is V
CC
+ 0.5 V. During voltage transitions, outputs may
overshoot to V
CC
+ 2.0 V for periods of up to 20 ns.
Minimum DC input voltage on A9 pin is -0.5 V. During voltage transitions, A9 may overshoot V
SS
to -2.0 V for periods of up
to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot to +14.0 V for periods of up to 20 ns.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
A
REVISION LEVEL
J
5962-94612
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 .
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
J
5962-94612
SHEET
4
DSCC FORM 2234
APR 97
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogram ability test shall be completed as part of the vendor's reliability monitors. This reprogram
ability test shall be done for the initial characterization and after any design process changes which may affect the reprogram
ability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase
cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document
control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
J
5962-94612
SHEET
5
DSCC FORM 2234
APR 97
PCB Design
京公网安备 11010802033920号
EEWORLD
