Approval sheet
Ultra Small Series (0201)
MULTILAYER CERAMIC CAPACITORS
Ultra-small Series (6.3V to 50V)
0201 Size
NP0, X7R, X5R Dielectrics
RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
Page 1 of 9
ASC_ Ultra Small_(0201)_007P_AS
Oct. 2012
Approval sheet
Ultra Small Series (0201)
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
0201 MLCC is performed by high precision technology achieve high capacitance in unit size and ensure the
stability and reliability of products.
2. FEATURES
b.
c.
d.
High capacitance in unit size.
High precision dimensional tolerances.
Suitable used in high-accuracy automatic mounting
machine.
3. APPLICATIONS
a.
b.
c.
Miniature microwave module.
Portable equipments (ex. Mobile phone, PDA).
High frequency circuits.
4. HOW TO ORDER
0201
Size
Inch (mm)
0201
(0603)
B
Dielectric
N=NP0
(C0G)
B=X7R
X=X5R
102
Capacitance
Two significant digits
followed by no. of zeros.
And R is in place of
decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
102=10x10
2
=1000pF
K
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z=-20/+80%
250
Rated voltage
Two significant digits
followed by no. of
zeros. And R is in
place of decimal point.
6R3=6.3
VDC
100=10
VDC
160=16
VDC
250=25
VDC
500=50
VDC
C
Termination
T
Packaging
L=Ag/Ni/Sn
(for NP0
T=7”
reeled
dielectric)
C=Cu/Ni/Sn
(for X7R,
X5R dielectric)
Page 2 of 9
ASC_ Ultra Small_(0201)_007P_AS
Oct. 2012
Approval sheet
Ultra Small Series (0201)
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
0201 (0603)
L (mm)
0.60±0.03
W (mm)
0.30±0.03
T (mm)/Symbol
0.30±0.03
L
M
B
(mm)
0.15±0.05
T
L
* Reflow soldering only.
W
M
B
M
B
Fig. 1 The outline of MLCC
6. GENERAL ELECTRICAL DATA
Size
Dielectric
Capacitance*
NP0
0.3pF to 100pF
Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF),D(±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%),
K (±10%)
16V, 25V, 50V
Cap<30pF, Q≥400+20C
Cap≥30pF, Q≥1000
≥10G
-55 to +125°
C
±30ppm
Ni/Sn (lead-free termination)
±15%
≥10G
0201
X7R
100pF to 10nF
X5R
100pF to 0.47µF
Capacitance tolerance**
J (±5%), K (±10%), M (±20%)
J (±5%),K (±10%), M (±20%)
Rated voltage (WVDC)
Tan
δ
/ Q*
Insulation resistance at Ur
Operating temperature
Capacitance change
Termination
6.3V, 10V, 16V, 25V, 50V
Note 1
6.3V, 10V, 16V, 25V, 50V
or RxC≥500 xF whichever is less
-55 to +85°
C
* Measured at 30~70% related humidity.
NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% at the condition of 25° ambient temperature.
C
X7R, X5R: Apply 1.0±0.2Vrms, 1.0kHz±10%(0201/6.3V,Cap≥224 : 0.5±0.2Vrms, 1.0kHz±10%) at the condition of 25° ambient
C
temperature.
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours
C
before measurement.
Note 1:
X7R/X5R
Rated vol. D.F.
≥50V
25V
16V
10V
6.3V
≤3%
≤3.5%
≤3.5%
≤5%
≤10%
Exception of D.F.
---
≤5%
≤5%
0201≥0.01uF
0201≥0.01uF
≤10%
0201≥0.012uF
≤15%
0201≥0.1uF
≤15%
0201≥0.1uF
Page 3 of 9
ASC_ Ultra Small_(0201)_007P_AS
Oct. 2012
Approval sheet
Ultra Small Series (0201)
7. CAPACITANCE RANGE
SIZE
DIELECTRIC
RATED VOLTAGE (VDC)
0.3pF (0R3)
0.4pF (0R4)
0.5pF (0R5)
1.0pF (1R0)
1.2pF (1R2)
1.5pF (1R5)
1.8pF (1R8)
2.2pF (2R2)
2.7pF (2R7)
3.0pF (3R0)
3.3pF (3R3)
3.9pF (3R9)
4.0pF(4R0)
4.7pF (4R7)
5.6pF (5R6)
6.8pF (6R8)
8.2pF (8R2)
10pF (100)
12pF (120)
15pF (150)
18pF (180)
22pF (220)
27pF (270)
33pF (330)
39pF (390)
47pF (470)
56pF (560)
68pF (680)
82pF (820)
100pF (101)
Capacitance
0201
NP0
25
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
SIZE
DIELECTRIC
RATED VOLTAGE
6.3
100pF (101)
120pF (121)
150pF (151)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
820pF (821)
1,000pF (102)
L
1,500pF (152)
L
2,200pF (222)
L
3,300pF (332)
L
4,700pF (472)
L
6,800pF (682)
L
8,200pF (822)
L
0.010µF (103)
L
0.015µF (153)
0.022µF (223)
0.033µF (333)
0.047µF (473)
0.068µF (683)
0.082µF (823)
0.10µF (104)
0.22µF (224)
0.47µF (474)
0201
10
X7R
16
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
25
L
L
L
L
L
L
L
L
L
L
L
L
L
50
L
L
L
L
L
L
L
L
L
L
L
L
L
6.3
10
X5R
16
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
25
L
L
L
L
L
L
L
L
L
L
L
L
L
50
L
L
L
L
L
L
L
L
L
L
L
L
L
16
50
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L^
L
L
L
L
L
L
L
L
L
L^
L^
L^
L^
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
8. PACKAGING DIMENSION AND QUANTITY
Size
0201 (0603)
Thickness (mm)/Symbol
0.30±0.03
L
Paper tape
7” reel
15K
13” reel
70k
Unit: pieces
Page 4 of 9
ASC_ Ultra Small_(0201)_007P_AS
Capacitance
Oct. 2012
Approval sheet
Ultra Small Series (0201)
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
1.
2.
3.
Item
Visual and
Mechanical
Capacitance
Q/ D.F.
(Dissipation
Factor)
---
Test Condition
Requirements
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
* Shall not exceed the limits given in the detailed spec.
NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
X7R, X5R:
Rated vol. D.F.
≥50V
25V
16V
10V
6.3V
≤3%
≤3.5%
≤3.5%
≤5%
≤10%
Exception of D.F.
---
≤5%
≤5%
0201≥0.01uF
0201≥0.01uF
Class I: NP0
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: X7R, X5R
1.0±0.2Vrms, 1kHz±10%**
**0.5±0.2Vrms, 1.0kHz±10% : 0201
≥0.22
uF(6.3V)
≤10%
0201≥0.012uF
≤15%
0201≥0.1uF
≤15%
0201≥0.1uF
4a.
Dielectric
Strength
* To apply voltage (≤100V) 250%.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
To apply rated voltage for max. 120 sec.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
≥10G
or RxC≥500 -F whichever is smaller.
Class II (X5R, X6S, X7R, Y5V)
Rated voltage
Insulation resistance
6.3V; 10V:0201≥47nF
≥100
-F
6.
Temperature
Coefficient
With no electrical load.
T.C.
NP0 (C0G)
X7R
X5R
Operating Temp
-55~125° at 25°C
C
-55~125° at 25°C
C
-55~85° at 25°
C
C
T.C.
NP0 (C0G)
X7R
X5R
Capacitance Change
Within ±30ppm/°
C
Within ±15%
Within ±15%
7.
Adhesive
Strength of
Termination
Vibration
Resistance
* Pressurizing force：2N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* Solder temperature: 235±5°
C
* Dipping time: 2±0.5 sec.
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
10.
Solderability
Bending Test
95% min. coverage of all metalized area.
* No remarkable damage.
* Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R, X5R: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
Page 5 of 9
ASC_ Ultra Small_(0201)_007P_AS
Oct. 2012
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