SPST, 4 Func, CDFP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | General Electric Solid State |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknow |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| normal position | NO |
| Number of functions | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| surface mount | YES |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| G127AL | G127AP | G127MFD | G127BL | G127MFD/883C | G127AP/883C | G127AP/C | G127AK/883C | |
|---|---|---|---|---|---|---|---|---|
| Description | SPST, 4 Func, CDFP14 | SPST, 4 Func, CDIP14 | SPST, 4 Func, CDFP14 | SPST, 4 Func, CDFP14 | SPST, 4 Func, CDFP14 | SPST, 4 Func, CDIP14 | SPST, 4 Func, CDIP14 | SPST, 4 Func, CDIP14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State |
| package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| normal position | NO | NO | NO | NO | NO | NO | NO | NO |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -20 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DFP | DFP | DFP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | YES | YES | YES | NO | NO | NO |
| Temperature level | MILITARY | MILITARY | MILITARY | OTHER | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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