CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air, with “direct attach” features. See
Tech Brief TB379 for details.
2. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Test Conditions: V
CC
= 12V, T
J
= 0°C to +85°C, Unless Otherwise Noted. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
SYMBOL
I
VCC_dis
I
VCC_en
V
POR
TEST CONDITIONS
V
CC
= 12V; disabled
V
CC
= 12V; enabled (but not switching)
6.4
3.8
0.15
f
OSC
ISL6341C, ISL6341CC
ISL6341I, ISL6341CI
ISL6341AC, ISL6341BC
ISL6341AI, ISL6341BI
270
240
540
510
MIN
TYP
7.0
8.9
4.2
0.48
300
300
600
600
1.5
ISL6341C, ISL6341AC, ISL6341BC,
ISL6341CC
ISL6341I, ISL6341AI, ISL6341BI, ISL6341CI
0.7936
0.7920
0.8000
0.8000
96
20
8
2.1
1.6
1.4
1.0
2.4
0.8064
0.8080
10.4
4.47
0.85
330
330
660
660
MAX
UNITS
mA
mA
V
V
kHz
kHz
kHz
kHz
V
P-P
V
V
dB
MHz
V/µs
PARAMETER
V
CC
SUPPLY CURRENT
Input Bias Supply Current
Input Bias Supply Current
POWER-ON RESET
Rising V
CC
POR Threshold
V
CC
POR Threshold Hysteresis
OSCILLATOR
Switching Frequency
Ramp Amplitude (Note 3)
REFERENCE
Reference Voltage Tolerance
V
OSC
V
REF
ERROR AMPLIFIER
DC Gain (Note 3)
Gain-Bandwidth Product (Note 3)
Slew Rate (Note 3)
GATE DRIVERS
Upper Gate Source Impedance
Upper Gate Sink Impedance
Lower Gate Source Impedance
Lower Gate Sink Impedance
Upper Gate Source Impedance
R
UG-SRCh
V
CC
= 12V; I = 50mA
R
UG-SNKh
V
CC
= 12V; I = 50mA
R
LG-SRCh
V
CC
= 12V; I = 50mA
R
LG-SNKh
V
CC
= 12V; I = 50mA
R
UG-SRCl
V
CC
= 5V; I = 50mA
GAIN
GBWP
SR
FN6538 Rev 2.00
Dec 2, 2008
Page 4 of 18
ISL6341, ISL6341A, ISL6341B, ISL6341C
Electrical Specifications
Test Conditions: V
CC
= 12V, T
J
= 0°C to +85°C, Unless Otherwise Noted. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
(Continued)
SYMBOL
R
LG-SRCl
R
LG-SNKl
I
OCSET
V
ENABLE
TEST CONDITIONS
V
CC
= 5V; I = 50mA
V
CC
= 5V; I = 50mA
LGATE/OCSET = 0V
9
0.683
0.868
0.708
0.980
0.580
0.380
VOS = 0.25V
I
PGOOD
= 4mA
-1500
0.10
MIN
TYP
1.7
1.5
1.1
10
0.700
0.880
16
0.720
16
1.000
0.600
0.400
-250
0.18
1.020
0.620
0.410
-100
0.30
0.732
11
0.717
0.888
MAX
UNITS
µA
V
V
mV
V
mV
V
V
V
nA
V
PARAMETER
Upper Gate Sink Impedance
Lower Gate Source Impedance
Lower Gate Sink Impedance
PROTECTION/DISABLE
OCSET Current Source
Enable Threshold (COMP/EN pin)
VOS Rising Trip (PGOOD OV; +10%)
VOS Rising Trip (PGOOD OV) Hysteresis
VOS Falling Trip (PGOOD UV; -10%)
VOS Falling Trip (PGOOD UV) Hysteresis
VOS Rising Threshold (OV; +25%)
VOS Falling Threshold (UV; -25%)
(Note 5)
VOS Threshold (OV; 50% of V
OUT
)
VOS Bias Current
PGOOD
NOTES:
R
UG-SNKl
V
CC
= 5V; I = 50mA
3. Limits should be considered typical and are not production tested.
4. Limits established by characterization and are not production tested.
5. The UVP is disabled on the ISL6341C; no trip point is measured.
Functional Pin Description
VCC (Pin 6)
This pin provides the bias supply for the ISL6341x, as well
as the lower MOSFET’s gate. An internal regulator will
supply bias as VCC rises above 5V, but the LGATE/OCSET
will still be sourced by VCC. Connect a well-decoupled 5V to
12V supply to this pin.
connection available. The metal pad under the package
should also be connected to the GND plane for thermal
conductivity, but does not conduct any current.
PHASE (Pin 2)
Connect this pin to the source of the upper MOSFET, and
the drain of the lower MOSFET. It is used as the sink for the
UGATE driver, and to monitor the voltage drop across the
lower MOSFET for overcurrent protection. This pin is also
monitored by the adaptive shoot-through protection circuitry
to determine when the upper MOSFET has turned off.
FB (Pin 8)
This pin is the inverting input of the internal error amplifier. Use
FB, in combination with the COMP/EN pin, to compensate the
voltage-control feedback loop of the converter. A resistor divider
from V
OUT
to FB to GND is used to set the regulation voltage.
UGATE (Pin 3)
Connect this pin to the gate of upper MOSFET; it provides
the PWM-controlled gate drive. It is also monitored by the
adaptive shoot-through protection circuitry to determine
when the upper MOSFET has turned off.
VOS (Pin 9)
This input pin monitors the regulator output for OV and UV
protection, and PGOOD (OV and UV). Connect a resistor
divider from V
OUT
to VOS to GND, with the same ratio as
the FB resistor divider. It is not recommended to share one
divider for both FB and VOS; the response to a fault may not
be as quick or robust. There is a small pull-up bias current
on the pin; if the VOS pin is not connected, the OV protection
would be tripped to protect the load.
BOOT (Pin 1)
This pin provides ground referenced bias voltage to the upper
MOSFET driver. A bootstrap circuit is used to create a voltage
suitable to drive an N-Channel MOSFET (equal to V
GD
minus
the BOOT diode voltage drop), with respect to PHASE.
COMP/EN (Pin 7)
This is a multiplexed pin. During soft-start and normal converter
operation, this pin represents the output of the error amplifier.
Use COMP/EN, in combination with the FB pin, to compensate
the voltage-control feedback loop of the converter.
GND (Pin 5)
This pin represents the signal and power ground for the IC.
This pin is the high current connection, and should be tied to
the ground island/plane through the lowest impedance
[i=s]This post was last edited by qwqwqw2088 on 2018-9-5 09:13[/i] [size=4]What is MFi? MFi originally meant "Made For iPod", and MFi has evolved into today's "Made For iPhone/iPod/iPad". Apple MFi ce...
May I ask the experts: Create two events that return different handles and associate them with the same USB plug and unplug event? hEventUsb = CreateEvent(0,FALSE,FALSE,L"_USB_CableEvent_"); hEventIdl...
Activity details: [Allwinner heterogeneous multi-core AI intelligent vision V853 development board]Updated to 2022-12-30Evaluation report summary:@IC CrawlerAllwinner heterogeneous multi-core AI intel...
/*----------------------------------------------------------------------- STM32 Novice "Zero Time Keyboard" and "Mad Dog" C++ Demonstration Package The main experimental purpose of this program (teste...
There are always problems with CCS grace configuration UART-A. I have been thinking about it for a long time and still don't know the problem. Can you help me? I would be grateful...
I know that in assembly files, you can use INFO 0."this is a message!", and in C, you can use #pragma message("this is a message!"), but the compiler in ADS doesn't seem to support this? How do you de...
Today's computer peripherals are pursuing high speed and high versatility. In order to meet user needs, seven companies led by Intel launched the USB (Universal Serial Bus) bus protocol in 1994, wh...[Details]
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
0. Introduction
In daily life, we often see some special-purpose vehicles. When these vehicles pass through intersections, they often obtain the right of way at intersections by temporarily op...[Details]
The Portable Digital Data Acquisition System (PDDAS) uses LabVIEW Real-Time and PXI to control the wind tunnel test and record air pressure data from 128 different channels.
"The LabVIEW Real-...[Details]
When choosing a laptop battery, you should consider several factors, such as power, appearance, and quality.
Regarding power, we often see that a manufacturer uses values such as the number ...[Details]
The solidification and modularization of intelligent video analysis algorithms are the current trends in the application of intelligent video analysis technology. It perfectly combines intelligent ...[Details]
1. Introduction
With the gradual automation and modernization of industrial control systems, fieldbus control systems have received more and more attention and application. CAN bus is currentl...[Details]
1. What is temperature?
Heat is a type of molecular motion. The hotter an object is, the faster its molecules move. Absolute zero is defined as the temperature at which all molecular motion ...[Details]
1 Introduction
The Third Steel Plant of Jigang Group is a key investment project of Jigang Group during the "15th Five-Year Plan". It has introduced first-class domestic and foreign advanced eq...[Details]
Smart lighting control systems provide high controllability for various buildings and further enhance the level of green energy. They are the core products of energy conservation and digital techn...[Details]
With the continuous consumption of earth's energy and the scarcity of resources, the harm of greenhouse effect to human beings, and the serious pollution of the atmosphere to the earth, the intern...[Details]
The traditional display screen using 51 single-chip microcomputer to control LED dot matrix has relatively simple functions. If it is to achieve diversified functions, it often takes a lot of time ...[Details]
FPGAs are used in 81% of electronic systems, including many commercial and defense products, and most FPGAs use BGA packaging. The BGA packaging is characterized by small solder balls and small sol...[Details]
Capacitors
are basic components in various electronic devices and are widely used for bypassing, coupling,
filtering
, tuning, etc. in electronic circuits. However, to use capacitors,...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
