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PCA9564

Description
I2C BUS CONTROLLER, PDSO20
Categorysemiconductor    The embedded processor and controller   
File Size229KB,32 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Download user manual Parametric Compare View All

PCA9564 Overview

I2C BUS CONTROLLER, PDSO20

PCA9564 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals20
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.3 V
Rated supply voltage2.5 V
External data bus width8
Processing package description4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingNICKEL PALLADIUM GOLD
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
Address bus width2
bus compatible8049; 8051; 6800; 68000; Z80
Microprocessor typeI2C BUS CONTROLLER
INTEGRATED CIRCUITS
PCA9564
Parallel bus to I
2
C-bus controller
Product data sheet
Supersedes data of 2004 Jun 25
2006 Sep 01
Philips
Semiconductors

PCA9564 Related Products

PCA9564 PCA9564BS PCA9564N PCA9564PW PCA9564U
Description I2C BUS CONTROLLER, PDSO20 I2C BUS CONTROLLER, PDSO20 I2C BUS CONTROLLER, PDSO20 I2C BUS CONTROLLER, PDSO20 I2C BUS CONTROLLER, PDSO20
Number of terminals 20 20 20 20 20
Maximum operating temperature 85 Cel 85 °C 85 °C 85 °C 85 Cel
Minimum operating temperature -40 Cel -40 °C -40 °C -40 °C -40 Cel
External data bus width 8 8 8 8 8
surface mount Yes YES NO YES Yes
Terminal form GULL WING NO LEAD THROUGH-HOLE GULL WING GULL WING
Terminal location DUAL QUAD DUAL DUAL DUAL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Address bus width 2 2 2 2 2
Is it Rohs certified? - conform to conform to conform to -
Maker - NXP NXP NXP -
Parts packaging code - QFN DIP TSSOP -
package instruction - HVQCCN, LCC20,.20SQ,25 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20 TSSOP, TSSOP20,.25 -
Contacts - 20 20 20 -
Reach Compliance Code - compli unknow compli -
Bus compatibility - 8049; 8051; 6800; 68000; Z80 8049; 8051; 6800; 68000; Z80 8049; 8051; 6800; 68000; Z80 -
JESD-30 code - S-PQCC-N20 R-PDIP-T20 R-PDSO-G20 -
JESD-609 code - e4 e3/e4 e4 -
length - 5 mm 26.73 mm 6.5 mm -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code - HVQCCN DIP TSSOP -
Encapsulate equivalent code - LCC20,.20SQ,25 DIP20,.3 TSSOP20,.25 -
Package shape - SQUARE RECTANGULAR RECTANGULAR -
Package form - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
power supply - 3.3 V 2.5/3.3 V 3.3 V -
Certification status - Not Qualified Not Qualified Not Qualified -
Maximum seat height - 1 mm 4.2 mm 1.1 mm -
Maximum supply voltage - 3.6 V 3.6 V 3.6 V -
Minimum supply voltage - 2.3 V 2.3 V 2.3 V -
Nominal supply voltage - 2.5 V 2.5 V 2.5 V -
technology - CMOS CMOS CMOS -
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) TIN/NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) -
Terminal pitch - 0.65 mm 2.54 mm 0.65 mm -
width - 5 mm 7.62 mm 4.4 mm -
uPs/uCs/peripheral integrated circuit type - BUS CONTROLLER, I2C BUS CONTROLLER, I2C BUS CONTROLLER, I2C -
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