EEWORLDEEWORLDEEWORLD

Part Number

Search

3-FIS160-01TG

Description
IC Socket, PGA160, 160 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size146KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

3-FIS160-01TG Overview

IC Socket, PGA160, 160 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

3-FIS160-01TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
ECCN codeEAR99
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.4 inch
subject depth0.165 inch
body length1.4 inch
Contact structure14X14
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA160
Shell materialGLASS FILLED EPOXY
JESD-609 codee0
Manufacturer's serial numberFIS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts160
Maximum operating temperature140 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Aren't the corresponding times of overcharge protection delay and overcharge protection release delay as short as possible?
Aren't the corresponding times of overcharge protection delay and overcharge protection release delay as short as possible?...
QWE4562009 Discrete Device
Recommended books on embedded development (Part 22) --- Detailed examples of embedded hardware system design and development
[align=center][size=5]Recommendations for high-quality books on embedded development (Twenty-two) ---[color=rgb(0, 0, 0)][backcolor=rgb(237, 235, 235)][font=微软雅黑][b]Detailed explanation of embedded ha...
tiankai001 Download Centre
Regarding the macro definition problem.
The example code is as follows:#define TestDefine Test1#ifdef TestDefine == Test2for(i = 0; i{...}#elsefor(i = 0; i{...}#endifThe original intention is to enter the second for statement. However, the ...
ma_jerry stm32/stm8
Wi-Fi will be the major winner in the next 10 years
Recently, Tianfeng Securities analyst Ming-Chi Kuo released an analysis report. According to him, with the advent of the "Metaverse", Wi-Fi technology including Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 and its s...
石榴姐 RF/Wirelessly
Electronic design competition related information (very complete)
[i=s]This post was last edited by paulhyde on 2014-9-15 09:42[/i] Electronic Design Competition Related Materials...
wonderto Electronics Design Contest
EEWORLD University Hall----Wide Voltage DC/DC Conversion Solutions
Wide voltage DC/DC conversion solution : https://training.eeworld.com.cn/course/134...
zhangjianee Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1737  1723  1753  2749  175  35  36  56  4  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号