OPA836IRUNR datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> OPA836IRUNR

OPA836IRUNR: DescriptionVery Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125; CategoryAnalog mixed-signal IC Amplifier circuit; File Size2MB，59 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

Stay tuned Parametric Compare

OPA836IRUNR Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	OPA836IRUNR	-	-	View	Buy Now

OPA836IRUNR Overview

Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125

OPA836IRUNR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFN
package instruction	QFN-10
Contacts	10
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	6 weeks
Samacsys Description	Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	1.8 µA
Maximum bias current (IIB) at 25C	1 µA
Minimum Common Mode Rejection Ratio	94 dB
Nominal Common Mode Rejection Ratio	114 dB
frequency compensation	YES
Maximum input offset current (IIO)	0.18 µA
Maximum input offset voltage	1060 µV
JESD-30 code	S-PQCC-N10
JESD-609 code	e4
length	2 mm
low-bias	NO
low-dissonance	NO
micropower	NO
Humidity sensitivity level	2
Number of functions	1
Number of terminals	10
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VQCCN
Encapsulate equivalent code	LCC10,.08SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power	NO
power supply	+-1.25/+-2.75/2.5/5.5 V
Programmable power	NO
Certification status	Not Qualified
Maximum seat height	0.8 mm
Nominal slew rate	260 V/us
Maximum slew rate	1.2 mA
Supply voltage upper limit	5.5 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	BIPOLAR
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	110000 kHz
Minimum voltage gain	100000
broadband	YES
width	2 mm
Base Number Matches	1

OPA836IRUNR Related Products

	OPA836IRUNR	OPA2836ID	OPA2836IDGS	OPA2836IDGSR	OPA2836IDR	OPA2836IRUNR	OPA2836IRUNT	OPA836IRUNT
Description	Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 8-SOIC -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-VSSOP -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-VSSOP -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 8-SOIC -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125	Dual, Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125	Very Low Power, Rail to Rail out, Negative Rail in, VFB Op Amp 10-QFN -40 to 125
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	QFN	SOIC	MSOP	MSOP	SOIC	QFN	QFN	QFN
package instruction	QFN-10	SOIC-8	TSSOP, TSSOP10,.19,20	VSSOP-10	SOP, SOP8,.25	VQCCN, LCC10,.08SQ,20	VQCCN, LCC10,.08SQ,20	VQCCN, LCC10,.08SQ,20
Contacts	10	8	10	10	8	10	10	10
Reach Compliance Code	compliant	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	6 weeks	6 weeks	1 week	6 weeks	6 weeks	6 weeks	6 weeks	1 week
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	-
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	-
Maximum average bias current (IIB)	1.8 µA	1.5 µA	1.5 µA	1.5 µA	1.5 µA	1.5 µA	1.5 µA	-
Maximum bias current (IIB) at 25C	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	-
Minimum Common Mode Rejection Ratio	94 dB	94 dB	94 dB	94 dB	94 dB	94 dB	94 dB	-
Nominal Common Mode Rejection Ratio	114 dB	114 dB	114 dB	114 dB	114 dB	114 dB	114 dB	-
frequency compensation	YES	YES	YES	YES	YES	YES	YES	-
Maximum input offset current (IIO)	0.18 µA	0.18 µA	0.18 µA	0.18 µA	0.18 µA	0.18 µA	0.18 µA	-
Maximum input offset voltage	1060 µV	760 µV	760 µV	760 µV	760 µV	760 µV	760 µV	-
JESD-30 code	S-PQCC-N10	R-PDSO-G8	S-PDSO-G10	S-PDSO-G10	R-PDSO-G8	S-PQCC-N10	S-PQCC-N10	-
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	-
length	2 mm	4.9 mm	3 mm	3 mm	4.9 mm	2 mm	2 mm	-
low-bias	NO	NO	NO	NO	NO	NO	NO	-
low-dissonance	NO	NO	NO	NO	NO	NO	NO	-
micropower	NO	NO	NO	NO	NO	NO	NO	-
Humidity sensitivity level	2	2	2	2	2	2	2	-
Number of functions	1	2	2	2	2	2	2	-
Number of terminals	10	8	10	10	8	10	10	-
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	VQCCN	SOP	TSSOP	TSSOP	SOP	VQCCN	VQCCN	-
Encapsulate equivalent code	LCC10,.08SQ,20	SOP8,.25	TSSOP10,.19,20	TSSOP10,.19,20	SOP8,.25	LCC10,.08SQ,20	LCC10,.08SQ,20	-
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	-
Package form	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	-
method of packing	TR	TUBE	TUBE	TR	TR	TR	TR	-
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	-
power	NO	NO	NO	NO	NO	NO	NO	-
power supply	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	+-1.25/+-2.75/2.5/5.5 V	-
Programmable power	NO	NO	NO	NO	NO	NO	NO	-
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	0.8 mm	1.75 mm	1.1 mm	1.1 mm	1.75 mm	0.8 mm	0.8 mm	-
Nominal slew rate	260 V/us	260 V/us	260 V/us	260 V/us	260 V/us	260 V/us	260 V/us	-
Maximum slew rate	1.2 mA	1.2 mA	1.2 mA	1.2 mA	1.2 mA	1.2 mA	1.2 mA	-
Supply voltage upper limit	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-
surface mount	YES	YES	YES	YES	YES	YES	YES	-
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	-
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	-
Terminal pitch	0.5 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	-
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Nominal Uniform Gain Bandwidth	110000 kHz	110000 kHz	110000 kHz	110000 kHz	110000 kHz	110000 kHz	110000 kHz	-
Minimum voltage gain	100000	100000	100000	100000	100000	100000	100000	-
broadband	YES	YES	YES	YES	YES	YES	YES	-
width	2 mm	3.9 mm	3 mm	3 mm	3.9 mm	2 mm	2 mm	-

Recommended Resources

Transistor leakage release protection circuit

Mingdan 2A3 and its applications 01

High performance wireless microphone

TV UV channel converter

Dry battery charger circuit(2)

NE5565 electronic ballast controller

What does GPIO mean?: Does this number represent the number of digits?...; niuxiaofeng Embedded System

How to enumerate all driver device addresses of the same level?: How to enumerate all driver device addresses of the same level? For example: Driver\Kbdclass \Device\keyboardclass0 \Device\keyboardclass1 \Device\keyboardclass2 \Device\keyboardclass3 in DEVICETREE. ...; keye200 Embedded System

Regarding the issue of i2c bus, please help me find out where the problem is: The slave device I use is e2prom, 24c08, but I can't get the expected result. I think there is something wrong with the read() function. How should I change it? Please help. #include #define uchar uns...; 天天ok Electronics Design Contest

I2C cannot transmit data to 24C02 normally: Please help me! Where is the error in this program? Can't store it in 24C02 and can't read it out?...; 农逸 Microchip MCU

[TI's First Low Power Design Competition] Wireless Energy Harvesting (Part 2) FR Development Library Function Version: Yesterday morning, my first post for this low-power design competition came out. Here, I would like to thank all my comrades for their encouragement: sacq[/url][/size][/backcolor][/color], lonerzf[/ur...; shannon2014 Energy Infrastructure?

Texas Instruments (TI) Multi-String High-Power LED Reference Design: [flash]http://player.youku.com/player.php/sid/XMjY1NzQ4NDE2/v.swf[/flash]This design uses a three stage approach with a universal input boost PFC stage and a low side buck stage, providing a controlle...; 德州仪器 LED Zone

State Grid, China Southern Grid and China Tower promote "one tower for multiple uses"

China Energy Storage Network News: On April 24, State Grid Corporation of China (hereinafter referred to as "SGCC") and China Southern Power Grid Co., Ltd. (hereinafter referred to as "CSGC")...[Details]
ZTE was “banned”: How to “regenerate chips” after the pain

For 80,000 ZTE (000063.SZ) employees and more Chinese ICT (information and communication technology) industry practitioners, the news from across the ocean on the evening of April 16 kept t...[Details]
Putting AI in the driver’s seat: What can intelligent collaboration do?

When artificial intelligence can help humans take on some work, we always divide the responsibilities of both parties very clearly. When humans work, we rarely see artificial intelligen...[Details]
STM32F4 (Using SysTick to accurately measure the program running time)

In the actual project development process, we often need to get the running time of a section of code. The usual method is to use an oscilloscope to measure it. This blog post will use SysTick to acc...[Details]
STM32F4(BUZZ)

In the actual project development process, it is common to encounter modifications to the hardware circuit, and then the modified part requires the modification of the driver. Thinking about the comi...[Details]
stm32f4 uses Systick to achieve delay

Using Systick timer to achieve delay 1. SysTick timer characteristics The SysTick timer is a 24-bit down counter, that is, when vlue is decremented to 0, an interrupt is triggered and the load va...[Details]
STM32 FSMC driver TFT notes

1. Initial understanding of FSMC: FSMC consists of 4 modules: (1) AHB interface (including FSMC configuration register) (2) NOR flash memory and PSRAM controller (when driving LCD, LCD is like a PSRA...[Details]
How to use logic analyzer to analyze digital signals?

Timing and protocol are two key points in digital system debugging, and they are also where logic analyzers can play their most valuable role. How can we use a logic analyzer to quickly complete wiri...[Details]
MSP430 Learning Notes 10-ADC Collection 1602 Display

This is also a routine in the development board, with explanations of the key points. The program is as follows: /********************************************************* Program notes: First...[Details]
How to start stm32 boot0 boot1

The storage media corresponding to the three boot modes of STM32 are built-in to the chip, they are: 1. User Flash = Flash built into the chip 2.SRAM = RAM area built into the chip, which is the m...[Details]
The difference between STM32's internal oscillator and its external crystal oscillator

If you do not use an external crystal on the STM32, the connection method of OSC_IN and OSC_OUT If you use the internal RC oscillator instead of an external crystal, please follow the following metho...[Details]
Use 51 single chip microcomputer to write a program to generate 38K square wave

/* Unfortunately, it cannot generate a standard 38kHz frequency square wave, there is a little error*/ #include reg51.h #define uchar unsigned char #define uint unsigned int sbit Waveout=P1^0; //P...[Details]
PWM and serial communication based on 51 single chip microcomputer

This example sets up a button to adjust the square wave of different frequencies (multiples of 100) from 100-1000hz. In addition, serial port communication is added, and the corresponding frequency c...[Details]
51 MCU timer interrupt program

When the program starts running, light A turns on for 5 seconds, then turns off, light B turns on for 5 seconds, light B turns off, light C turns on for 5 seconds, light C turns off, the program ends...[Details]
Single chip dual color dot matrix display specific graphics

/*----------------------------------------------- Name: Two-color dot matrix Forum: www.doflye.net Written by: shifang Modification: None Content: Using hc595 to drive two-color d...[Details]

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components