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The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
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A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
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Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]
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New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
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1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]
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On August 20, Huawei Device announced that the all-new M7 is the first to feature an in-cabin laser vision solution. This solution offers enhanced active safety capabilities compared to primary vis...[Details]
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Cadence and NVIDIA Collaborate to Revolutionize Power Analysis Technology, Accelerating Development of Billion-Gate AI Designs
Cadence's new Palladium Dynamic Power Analysis applicat...[Details]
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Today, the voltage of electronic products continues to rise to 400V, 600V and even 1000V, so there are few electronic load models that can handle such high voltages. Many people consider connecting...[Details]
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With rapid economic development, the types of pollution sources are increasing, especially in chemical and industrial zones and their surroundings. The patterns of pollution and the types of ecolog...[Details]
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Anyone who has driven a pure electric vehicle will find that it starts much faster than a fuel vehicle. So why do pure electric vehicles start so quickly?
We all know that an engine's to...[Details]
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August 18, 2025—
Advantech, a global leader in IoT intelligent systems and embedded platforms, today announced a collaboration with LitePoint, a global provider of wireless test solutions, to d...[Details]
Power technology
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