SI8621EC-B-IS datasheet, PDF - EEWORLD Datasheet

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SI8621EC-B-IS: DescriptionSPECIALTY ANALOG CIRCUIT, PDSO8; Categorysemiconductor Analog mixed-signal IC; File Size416KB，36 Pages; ManufacturerSILABS; Websitehttp://www.silabs.com

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SI8621EC-B-IS Overview

SPECIALTY ANALOG CIRCUIT, PDSO8

SI8621EC-B-IS Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Minimum operating temperature	-40 Cel
Maximum operating temperature	125 Cel
Rated supply voltage	5 V
Minimum supply/operating voltage	2.5 V
Maximum supply/operating voltage	5.5 V
Processing package description	ROHS COMPLIANT, SOIC-8
state	Active
Analog IC other types	ANALOG CIRCUIT
jesd_30_code	R-PDSO-G8
Packaging Materials	PLASTIC/EPOXY
ckage_code	SOP
ckage_equivalence_code	SOP8,.25
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE
wer_supplies__v_	2.5/5
qualification_status	COMMERCIAL
screening_level	AEC-Q100
seated_height_max	1.75 mm
sub_category	Other Analog ICs
surface mount	YES
Craftsmanship	CMOS
Temperature level	AUTOMOTIVE
terminal coating	NOT SPECIFIED
Terminal form	GULL WING
Terminal spacing	1.27 mm
Terminal location	DUAL
length	4.9 mm
width	3.9 mm

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Si8610/20/21/22

O W

- P

O W E R

I N G LE A N D

U A L

-C

H A N N E L

I G I TA L

S O L A T O R S

Features



High-speed operation



DC to 150 Mbps



No start-up initialization required



Wide Operating Supply Voltage



2.5–5.5 V



Up to 5000 V

RMS

isolation



60-year life at rated working voltage



High electromagnetic immunity



Ultra low power (typical)

5 V Operation



1.6 mA per channel at 1 Mbps



5.5 mA per channel at 100 Mbps

2.5 V Operation



1.5 mA per channel at 1 Mbps



3.5 mA per channel at 100 Mbps



Schmitt trigger inputs



Selectable fail-safe mode



Default high or low output

(ordering option)

Precise timing (typical)



10 ns propagation delay



1.5 ns pulse width distortion



0.5 ns channel-channel skew



2 ns propagation delay skew



5 ns minimum pulse width

Transient Immunity 50 kV/µs

AEC-Q100 qualification

Wide temperature range



–40 to 125 °C

RoHS-compliant packages



SOIC-16 wide body



SOIC-8 narrow body

Applications



Industrial automation systems

Medical electronics

Hybrid electric vehicles

Isolated switch mode supplies



Isolated ADC, DAC

Motor control

Power inverters

Communications systems

Ordering Information:

See page 27.

Safety Regulatory Approvals



UL 1577 recognized



Up to 5000 V

RMS

for 1 minute

CSA component notice 5A approval



IEC 60950-1, 61010-1, 60601-1

(reinforced

insulation)



VDE certification conformity



IEC 60747-5-2

(VDE0884 Part 2)



EN60950-1

(reinforced insulation)

Description

Silicon Lab's family of ultra-low-power digital isolators are CMOS devices

offering substantial data rate, propagation delay, power, size, reliability, and

external BOM advantages over legacy isolation technologies. The operating

parameters of these products remain stable across wide temperature ranges

and throughout device service life for ease of design and highly uniform

performance. All device versions have Schmitt trigger inputs for high noise

immunity and only require VDD bypass capacitors.

Data rates up to 150 Mbps are supported, and all devices achieve propagation

delays of less than 10 ns. Ordering options include a choice of isolation ratings

(3.75 and 5 kV) and a selectable fail-safe operating mode to control the default

output state during power loss. All products >1 kV

RMS

are safety certified by

UL, CSA, and VDE, and products in wide-body packages support reinforced

insulation withstanding up to 5 kV

RMS

Rev. 1.3 6/12

Si8610/20/21/22

Si8610/20/21/22

ABLE O F

ONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.2. Eye Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.1. Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

3.2. Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.3. Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.4. Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.5. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4. Pin Descriptions (Wide-Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5. Pin Descriptions (Narrow-Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

8. Land Pattern: 16-Pin Wide-Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

9. Package Outline: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

10. Land Pattern: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

11. Top Marking: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

11.1. 16-Pin Wide Body SOIC Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

12. Top Marking: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

12.1. 8-Pin Narrow Body SOIC Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

12.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Rev. 1.3

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