TMS320DM8168SCYG2 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TMS320DM8168SCYG2

TMS320DM8168SCYG2: DescriptionDaVinci Digital Media Processor 1031-FCBGA 0 to 95; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，327 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TMS320DM8168SCYG2 Overview

DaVinci Digital Media Processor 1031-FCBGA 0 to 95

TMS320DM8168SCYG2 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	HBGA, BGA1031,37X37,25
Contacts	1031
Reach Compliance Code	compliant
Factory Lead Time	1 week
Base Number Matches	1

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Description	DaVinci Digital Media Processor 1031-FCBGA 0 to 95	DaVinci Digital Media Processor 1031-FCBGA 0 to 95	DaVinci Digital Media Processor 1031-FCBGA 0 to 95	DaVinci Digital Media Processor 1031-FCBGA 0 to 95	Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc	Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc	Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc	DaVinci Digital Media Processor 1031-FCBGA 0 to 95	DaVinci Digital Media Processor 1031-FCBGA 0 to 95
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Contains lead	Contains lead	Contains lead	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	HBGA, BGA1031,37X37,25	HBGA, BGA1031,37X37,25	HBGA, BGA1031,37X37,25	HBGA, BGA1031,37X37,25	FBGA, BGA1031,37X37,25	FBGA, BGA1031,37X37,25	FBGA, BGA1031,37X37,25	HBGA, BGA1031,37X37,25	HBGA, BGA1031,37X37,25
Contacts	1031	1031	1031	1031	1031	1031	1031	1031	1031
Reach Compliance Code	compliant	compli	compli	compli	compli	compli	unknow	compli	compli
Address bus width	-	15	15	15	16	28	28	15	15
barrel shifter	-	NO	NO	NO	NO	NO	NO	NO	NO
bit size	-	32	32	32	32	32	32	32	32
boundary scan	-	YES	YES	YES	YES	YES	YES	YES	YES
External data bus width	-	32	32	32	16	16	16	32	32
Format	-	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	-	YES	YES	YES	-	-	-	YES	YES
Internal bus architecture	-	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	-	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031	S-PBGA-B1031
JESD-609 code	-	e1	e1	e1	e1	e1	e1	e1	e1
length	-	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
low power mode	-	YES	YES	YES	NO	YES	YES	YES	YES
Humidity sensitivity level	-	4	4	4	4	4	4	4	4
Number of DMA channels	-	72	72	72	-	-	-	72	72
Number of terminals	-	1031	1031	1031	1031	1031	1031	1031	1031
Number of timers	-	8	8	8	-	-	-	8	8
Maximum operating temperature	-	95 °C	95 °C	95 °C	-	-	-	95 °C	95 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	HBGA	HBGA	HBGA	FBGA	FBGA	FBGA	HBGA	HBGA
Encapsulate equivalent code	-	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25	BGA1031,37X37,25
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	-	245	245	245	245	245	245	245	245
power supply	-	1 V	1 V	1 V	1 V	1 V	1 V	1 V	1 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	-	16384	16384	16384	16384	16384	16384	16384	16384
Maximum seat height	-	3.31 mm	3.31 mm	3.31 mm	3.31 mm	3.31 mm	3.31 mm	3.31 mm	3.31 mm
Maximum supply voltage	-	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V	1.05 V
Minimum supply voltage	-	0.95 V	0.95 V	0.95 V	0.95 V	0.95 V	0.95 V	0.95 V	0.95 V
Nominal supply voltage	-	1 V	1 V	1 V	1 V	1 V	1 V	1 V	1 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	-	-	OTHER	OTHER
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
uPs/uCs/peripheral integrated circuit type	-	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED

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