SN74AHC367DRE4 datasheet, PDF - EEWORLD Datasheet

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SN74AHC367DRE4: DescriptionBuffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs; Categorylogic logic; File Size330KB，12 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs

SN74AHC367DRE4 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	SOP, SOP16,.25
Contacts	16
Reach Compliance Code	unknow
Other features	ONE FUNCTION WITH TWO BITS
Control type	ENABLE LOW
series	AHC/VHC/H/U/V
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	9.9 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.008 A
Humidity sensitivity level	1
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	2/5.5 V
propagation delay (tpd)	13.5 ns
Certification status	Not Qualified
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm

SN74AHC367DRE4 Related Products

	SN74AHC367DRE4	SN74AHC367DBR	SN74AHC367DE4	SN74AHC367DGVR	SN74AHC367PWRE4	SN74AHC367DGVRE4
Description	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs	Buffers & Line Drivers Hex Buff & Line Drv w/3-State Outputs
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	SOIC	SOIC	SOIC	SOIC	TSSOP	SOIC
package instruction	SOP, SOP16,.25	SSOP, SSOP16,.3	SOP, SOP16,.25	TSSOP, TSSOP16,.25,16	TSSOP, TSSOP16,.25	TSSOP, TSSOP16,.25,16
Contacts	16	16	16	16	16	16
Reach Compliance Code	unknow	compli	unknow	compli	unknow	compli
Other features	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
length	9.9 mm	6.2 mm	9.9 mm	4.4 mm	5 mm	4.4 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
Number of digits	4	4	4	4	4	4
Number of functions	2	2	2	2	2	2
Number of ports	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SSOP	SOP	TSSOP	TSSOP	TSSOP
Encapsulate equivalent code	SOP16,.25	SSOP16,.3	SOP16,.25	TSSOP16,.25,16	TSSOP16,.25	TSSOP16,.25,16
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	TAPE AND REEL	TUBE	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	260	NOT SPECIFIED	260	NOT SPECIFIED
power supply	2/5.5 V	2/5.5 V	2/5.5 V	2/5.5 V	2/5.5 V	2/5.5 V
propagation delay (tpd)	13.5 ns	13.5 ns	13.5 ns	13.5 ns	13.5 ns	13.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	2 mm	1.75 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.65 mm	1.27 mm	0.4 mm	0.65 mm	0.4 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3.9 mm	5.3 mm	3.9 mm	3.6 mm	4.4 mm	3.6 mm

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