BF055-72A-B-0250-0250-0500-L-G datasheet, PDF

Datasheet> All Categories > The connector> The connector> BF055-72A-B-0250-0250-0500-L-G

BF055-72A-B-0250-0250-0500-L-G: DescriptionBoard Connector, 72 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator,; CategoryThe connector The connector; File Size86KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BF055-72A-B-0250-0250-0500-L-G Overview

Board Connector, 72 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator,

BF055-72A-B-0250-0250-0500-L-G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.157 inch
subject depth	0.197 inch
body length	2.835 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU ON NI
Contact completed and terminated	GOLD OVER NICKEL
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	500VAC V
Durability	100 Cycles
maximum insertion force	2.0016 N
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
Manufacturer's serial number	BF055
Plug contact pitch	0.079 inch
Match contact row spacing	0.079 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	2.0066 mm
Plating thickness	FLASH inch
Rated current (signal)	2 A
Guideline	UL
reliability	COMMERCIAL
Terminal length	0.098 inch
Terminal pitch	2.0066 mm
Termination type	SOLDER
Total number of contacts	72
Evacuation force-minimum value	.199882 N

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BF055: 2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL

Ordering Grid

SPECIFICATIONS

规格

CURRENT RATING

电流额定值：

2 AMP

INSULATOR RESISTANCE

绝缘额定值：

1000 MEGOHMS MIN.

CONTACT RESISTANCE

接触电阻值：

20 mOHMS MAX

No. of Contacts

DIELECTRIC WITHSTANDING

耐电压：AC

500 V

04 to 80

OPERATING TEMPERATURE

工½温度：-40°C

TO +105°C

CONTACT MATERIAL

端子物料：COPPER

ALLOY

Contact Plating

INSULATOR MATERIAL

绝缘½物料:

A = Gold Flash All Over

STANDARD

标准物料:

POLYAMIDE

聚醯胺,

NYLON 6T, UL 94-V0

B = Selective Gold Flash Contact Area/

OPTIONS

可选物料:

POLYESTER

聚酯,

LCP, UL 94-V0

Tin On Tail

OR POLYESTER

聚酯,

PBT, UL94-V0

C = Tin All Over

SOLDERING PROCESS

可焊性:

G = 10µ" Gold Contact Area/Tin On Tail

NYLON 6T (STANDARD标准物料) -

IR REFLOW

回流焊:

260°C for 10 sec.

I = 30µ" Gold Contact Area/Tin On Tail

WAVE

波峰焊:230°C

for 5-10 sec.

Standard = Gold Flash All Over

MANUAL SOLDER

人工焊接:

350°C for 3-5 sec

PBT (OPTION

可选物料)

- MANUAL SOLDER人工焊接: 330°C for 3-5 sec.

(NOT SUITABLE FOR HI-TEMP PROCESS

不适合高温处理

)

LCP (OPTION

可选物料)

IR REFLOW

回流焊:

260°C for 10 sec.

WAVE

波峰焊:250°C

for 5-10 sec.

MANUAL SOLDER

人工焊接:

350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BF065

BF075

BF080

BF095

BF100

BF105

BF115

BF120

BF055

XX X

XXXX

Packing Options

G = Plastic Box (Standard)

D = Tube

E = Tube with Cap

Insulator

Height 'H'

A = 1.50mm

B = 2.00mm

Standard = 2.00mm

Dimension C (1/100mm)

(Post Height)

Standard - 4.00mm = 0400

Or specify Dimension C

e.g. 2.50mm = 0250

TOL +/- 0.2mm

Insulator Material

N = Nylon 6T (Standard)

L = LCP

P = PBT

Dimension D (1/100mm)

(Tail Length)

Standard - 2.80mm = 0280

Or specify Dimension D

e.g. 2.50mm = 0250

TOL +/- 0.2mm

Dimension E (1/100mm)

(Stack Height)

Standard - 12.00mm = 1200

Minimum - 3.00mm = 0300

Or specify Dimension E

e.g. 5.00mm = 0500

TOL +/- 0.2mm

Tolerances

(Except as noted)

Part Number:-

Date:-

Dimensions in mm

X.°±5°

.X°±2°

.XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X.X ± 0.20

X.XX ± 0.15

Third Angle Projection

X. ± 0.30

BF055

Description:-

31 OCT 07

DETAIL

REV

DATE

LYH

DRAWING

RELEASE

31/10/07

CHANGE TO SOLDER

TEMP. INFORMATION

30/07/09

PACKING OPTIONS

CORRECTION TO

ORDERING GRID

CHANGED

27/04/09

10/06/09

RoHS

2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW,

THROUGH HOLE, VERTICAL

Global

Connector

Technology

www.globalconnectortechnology.com

Scale

NTS

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Drawn by

LYH

E & OE

Sheet No.

1/1

Recommended Resources

Infrared remote control circuit

Regeneration receiving circuit diagram

Micropower reference power supply

555 negative dual output circuit

Snoring and sleep talking therapy device circuit

Computer motherboard circuit diagram 810 4_30

Long-term supply of comprehensive tester 8960 (E5515B/E5515C)/CMU200/CMD55: 1. Comprehensive tester R&S CMU200 (can test GSM900/1800); Agilent8960 E5515B (can test GSM900/1800/1900/GPRS); Agilnet8960 E5515C (OPT: 002, 003, can test GSM, CDMA); R&S CMD55 (can test 900/1800); R...; sean4444 Test/Measurement

【GD32450I-EVAL】+ 01 Unboxing and onboard resource evaluation: [i=s]This post was last edited by DDZZ669 on 2020-9-13 16:53[/i]I received the board from the forum two days ago. Thanks to EEWorld Forum and GigaDevice for providing the board. This article will firs...; DDZZ669 Domestic Chip Exchange

Urgent! I just got a wince5.0 device. How to use it?: I have a WinCE 5.0 device. It already has a system. If I want to use vs2005 to do C# development on it, I see that the CPU is INTEL ARM920T-PX in the system information. How can I develop on it? What ...; ruiqing2007 Embedded System

How do I calculate the capacity of the supercapacitor I need?: Today, with the flourishing of energy storage products, supercapacitors (farad-level capacitors) with energy storage characteristics such as ultra-high power, ultra-large current, ultra-wide operating...; BIGCAP Energy Infrastructure?

Summary for students who are going to participate in the electronic design competition: [i=s]This post was last edited by paulhyde on 2014-9-15 09:33[/i] [align=center][align=center][font=宋体][size=3]Summary for students who want to participate in electronic design competitions[/size][/fo...; asasd1 Electronics Design Contest

[Explore TI's good lessons] + C2000 New Energy Vehicle Solutions_2016 TI Embedded Products Seminar Record: [i=s]This post was last edited by cquwuqiang on 2017-1-9 13:25[/i] Course title: [color=rgb(94, 103, 98)][font=微软雅黑][size=14px][url=https://training.eeworld.com.cn/TI/show/course/3745]C2000 New Energy...; cquwuqiang Energy Infrastructure?

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components