BergStik
®
Unshrouded Stacking Headers
2.54 mm
s
Wide variety of stack heights
in 0.5 mm increments
s
High temperature plastic
s
Selective plating
Technical Data
Physical
Housing: High temperature,
black thermoplastic
Flammability rating: UL 94 V-0
Pin: Phosphor-bronze
Plating: Gold or tin-lead over 1.27 µm nickel
Mating Data
Operating Temperature Range
-65°C to +125°C
s
Dubox™ Vertical receptacles
Page
24
s
Dubox™ Low profile vertical receptacles 26, 28
Packaging
Standard: Bags
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Reference Information
File no. E66906
File no. LR46923
Product drawing: By 5-digit base part number
Product specification: BUS-12-114
Specifications subject to change without notice.
Electrical Performance
Current rating: 3 A continuous
Insulation resistance: 5000 MΩ min.
Dielectric withstanding voltage: 1500 V
Mechanical Performance
Pin retention to housing:
9 N min.
Typical Applications
Receptacle
mating side
mating side
Board
Space
OAL
Stack
Height
OAL
Stack
Height
OAL
solder side
solder side
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
12
BergStik
®
Unshrouded Stacking Headers
2.54 mm
Part Number
5
4
Lead
Solder
Side
Option
Row
Option
Plating
Pin Style
Total
Positions
Stack Height
1
= Through Hole (TMT)
2
= Surface Mount (SMT)
1
= Single Row (TMT only)
2
= Double Row
01
to
36
single row (TMT)
04
to
72
double row (TMT)
04
to
50
double row (SMT
1
= 2.41
2
= 3.05
4
= SMT (double row only)
1
= 0.76 µm gold on mating area, tin-lead on solder side
4
= 3.81 µm tin-lead
8
= 0.38 µm gold on mating area, tin-lead on solder side
Pin
Style
01
02
03
04
05
06
07
08
09
10
11
12
OAL (TMT)
mm
OAL (SMT)
mm
12.20
13.50
15.90
16.76
17.65
18.91
20.96
23.50
26.04
28.58
31.12
33.66
10.42
11.72
14.12
14.98
15.87
17.13
19.18
21.72
24.26
26.80
29.34
31.88
XX.XX
= mm
Specify mm
(i.e. 08.50 = 8.50 mm
in 0.50 mm increments
08.00 min. - 25.00 max.)
Step-by-Step Design
1. Determine desired board spacing (0.50 mm increments)
2. Select Dubox™ receptacle and calculate stack height
Stack Height = Board Spacing – Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./ min. OAL
OAL = Stack Height + solder side + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Height
Insertion Depth (max.)
Insertion Depth (min.)
Dubox™ RECEPTACLES
Low Profile
Vertical
7.00
8.50
6.10
6.10
3.86
4.34
Recommended PCB Layout
Example:
1. Application requires a board spacing of 22.50
2. Select the Dubox™ Low Profile Receptacle
with height of 7.00
The Header Stack Height is 22.50 - 7.00 = 15.50
3. For standard board applications, the
3.05 solder side is selected
OAL (max.) = 15.50 + 3.05 + 6.10 = 24.65
OAL (min.) = 15.50 + 3.05 + 3.86 = 22.41
4. Select Pin Style 08 with OAL = 23.50
5. Part Number is 54122-108-72-1550
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
13
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
