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CX-1S-SM21.0B

Description
CX MINIATURE CRYSTALS
File Size98KB,2 Pages
ManufacturerEuroquartz
Websitehttp://www.euroquartz.co.uk/
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CX-1S-SM21.0B Overview

CX MINIATURE CRYSTALS

CX MINIATURE CRYSTALS
530kHz
to 2.1MHz
MINIATURE SMD CRYSTAL
EUROQUARTZ
Telephone:
+44(0)1460 230000
Fax:
+44(0)1460 230001
Email: sales@euroquartz.co.uk
Web: www.euroquartz.co.uk
CX-1-SM
Page
1 of 2
General Description
The miniature CX-1-SM crystals in leadless ceramic packages have
been designed for surface-mounting on printed circuit boards or
hybrid circuits. Hermitically sealed in a rugged, miniature ceramic
package, the CX-1-SM crystal is manufactured using a photo-
lithographic process.







Extensional mode
Ideal for use with microprocessors
Designed for low-power applications
Compatible with hybrid or PC board packaging
Low ageing
Full military environmental testing available
Ideal for battery operated applications
Specification
D
(TO P)
A
E
D
B
C
E
Outline
CX-1-SM Package Dimensions
Dimension
Typical
(mm)
Maximum
(mm)
530kHz to 2 .1MHz
Extensional
A ±0.05% (±500ppm)
B ±0.1%
C ±1.0%
7pF
Load Capacitance:
3k
W
max.
Motional Resistance (R

):
1.2fF
Motional Capacitance (C

):
150k
Quality Factor (Q):
1.0pF
Shunt Capacitance (C

):
3
m
W max.
Drive Level:
35°C
Turning Point (T

)**:
Note: Frequency (f) deviation from frequency (f
0
) @ turning point
temperature (T
0
):
f-fo k(T-To)
=
fo
Ageing, first year:
Shock, survival:
Vibration, survival:
Operating Temperature:
Storage Temperature:
Process Temperature:
±5ppm max.
750g 0.3ms, ½ sine
10g rms, 20-1,000Hz random
-10°~+70°C (commercial)
-40°~+85°C (industrial)
-55°~+125°C (military)
-55°C~+125°C
260°C for 20 seconds
Frequency Range:
Functional Mode:
Calibration Tolerance*:
A
B
C
D
E
Dimension
“C”
8.00
3.56
-
1.14
1.52
Glass Lid
(mm max.)
8.38
3.94
see below
1.40
1.78
Ceramic Lid
(mm max.)
Specifications are typical at 25°C unless otherwise indicated.
*
**
Tighter frequency calibration available
Other turning point available
SM1
SM2
SM3
1.65
1.70
1.78
1.78
1.83
1.90
Equivalent Circuit
L

R

Solder Pad Layout
C

C

6.86
1
2
1.78
4.06
L

Motional Inductance
C

Motional Capacitance C

Shunt Capacitance
R

Motional Resistance
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