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SN54LS670

Description
4 X 4 STANDARD SRAM, 45 ns, PDIP16
Categorystorage   
File Size109KB,6 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

SN54LS670 Overview

4 X 4 STANDARD SRAM, 45 ns, PDIP16

SN54LS670 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals16
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage5.25 V
Minimum supply/operating voltage4.75 V
Rated supply voltage5 V
maximum access time45 ns
Processing package descriptionROHS COMPLIANT, PLASTIC, MS-001, DIP-16
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
CraftsmanshipTTL
packaging shapeRECTANGULAR
Package SizeIN-LINE
Terminal formTHROUGH-HOLE
Terminal spacing2.54 mm
terminal coatingNICKEL PALLADIUM GOLD
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelCOMMERCIAL
memory width4
organize4 X 4
storage density16 deg
operating modeASYNCHRONOUS
Number of digits4 words
Number of digits4
Memory IC typeSTANDARD SRAM
serial parallelPARALLEL
SN54/74LS670
4 x 4 REGISTER FILE
WITH 3-STATE OUTPUTS
The TTL / MSI SN54 / 74LS670 is a high-speed, low-power 4 x 4 Register
File organized as four words by four bits. Separate read and write inputs, both
address and enable, allow simultaneous read and write operation.
The 3-state outputs make it possible to connect up to 128 outputs to in-
crease the word capacity up to 512 words. Any number of these devices can
be operated in parallel to generate an n-bit length.
The SN54 / 74LS170 provides a similar function to this device but it features
open-collector outputs.
4 x 4 REGISTER FILE
WITH 3-STATE OUTPUTS
LOW POWER SCHOTTKY
Simultaneous Read/ Write Operation
Expandable to 512 Words by n-Bits
Typical Access Time to 20 ns
3-State Outputs for Expansion
Typical Power Dissipation of 125 mW
J SUFFIX
CERAMIC
CASE 620-09
16
1
CONNECTION DIAGRAM DIP
(TOP VIEW)
VCC
16
D1
15
WA
14
WB
13
EW
12
ER
11
Q1
10
Q2
9
NOTE:
The Flatpak version
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
16
1
N SUFFIX
PLASTIC
CASE 648-08
16
1
D SUFFIX
SOIC
CASE 751B-03
1
D2
2
D3
3
D4
4
RB
5
RA
6
Q4
7
Q3
8
GND
ORDERING INFORMATION
PIN NAMES
LOADING (Note a)
HIGH
D1 – D4
WA, WB
EW
RA, RB
ER
Q1 – Q4
Data Inputs
Write Address Inputs
Write Enable (Active LOW) Input
Read Address Inputs
Read Enable (Active LOW) Input
Outputs (Note b)
0.5 U.L.
0.5 U.L.
1.0 U.L.
0.5 U.L.
1.5 U.L.
65 (25) U.L.
LOW
0.25 U.L.
0.25 U.L.
0.5 U.L.
0.25 U.L.
0.75 U.L.
15 (7.5) U.L.
SN54LSXXXJ
SN74LSXXXN
SN74LSXXXD
Ceramic
Plastic
SOIC
LOGIC SYMBOL
12
14
13
5
4
WA EW
WB
RA
RB E
R
11
15 1
2
3
NOTES:
a) 1 TTL Unit Load (U.L.) = 40
µA
HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 7.5 U.L. for Military (54) and 15 U.L. for Commercial
(74) Temperature Ranges. The Output HIGH drive factor is 25 U.L. for Military and
65 U.L. for Commercial Temperature Ranges.
D1 D2 D3 D4
Q1 Q2 Q3 Q4
10 9 7
6
VCC = PIN 16
GND = PIN 8
FAST AND LS TTL DATA
5-597

SN54LS670 Related Products

SN54LS670 74LS670 SN74LS670D
Description 4 X 4 STANDARD SRAM, 45 ns, PDIP16 4 X 4 STANDARD SRAM, 45 ns, PDIP16 4 X 4 STANDARD SRAM, 45 ns, PDIP16
Number of functions 1 1 1
Number of terminals 16 16 16
Maximum operating temperature 70 Cel 70 Cel 70 °C
Minimum operating temperature 0.0 Cel 0.0 Cel -
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal location DUAL DUAL DUAL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
memory width 4 4 4
organize 4 X 4 4 X 4 4X4
Maximum supply/operating voltage 5.25 V 5.25 V -
Minimum supply/operating voltage 4.75 V 4.75 V -
Rated supply voltage 5 V 5 V -
maximum access time 45 ns 45 ns -
Processing package description ROHS COMPLIANT, PLASTIC, MS-001, DIP-16 ROHS COMPLIANT, PLASTIC, MS-001, DIP-16 -
Lead-free Yes Yes -
EU RoHS regulations Yes Yes -
China RoHS regulations Yes Yes -
state ACTIVE ACTIVE -
Craftsmanship TTL TTL -
packaging shape RECTANGULAR RECTANGULAR -
Package Size IN-LINE IN-LINE -
Terminal spacing 2.54 mm 2.54 mm -
terminal coating NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD -
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY -
storage density 16 deg 16 deg -
operating mode ASYNCHRONOUS ASYNCHRONOUS -
Number of digits 4 4 -
Memory IC type STANDARD SRAM STANDARD SRAM -
serial parallel PARALLEL PARALLEL -

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