PROTECTION PRODUCTS
Description
Low Capacitance TVS for High-Speed
Data Interfaces
Features
2000 watts peak pulse power (t
p
= 8/20µs)
Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10µs)
ITU K.20 I
PP
=40A (5/310µs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 100A (8/20µs)
Protects two lines in common and differential mode
Low capacitance for high-speed interfaces
Low clamping and operating voltage
Integrated structure saves board space and
increases reliability
Solid-state silicon avalanche technology
LC03-6
The LC03-6 transient voltage suppressor is designed to
protect components which are connected to high
speed telecommunication lines from voltage surges
caused by
lightning,
electrostatic discharge
(ESD),
cable discharge events
(CDE),
and electrical fast
transients
(EFT).
TVS diodes are ideal for use as board level protection
of sensitive semiconductor components. The LC03-6
combines a TVS diode with a rectifier bridge to provide
transient protection in both common and differential
mode with a single device. The capacitance of the
device is minimized (< 25pF) to ensure correct signal
transmission on high speed lines . The LC03-6 meets
the short-haul (intra-building) transient immunity
requirements of Bellcore 1089 for telecommunications
applications.
The SO-8 surface mount package allows flexibility in
the design of crowded PC boards.
Mechanical Characteristics
JEDEC SO-8 package
RoHS/WEEE Compliant
UL 497B listed
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code
Packaging : Tube or Tape and Reel per EIA 481
Applications
T1/E1 Line Cards
T3/E3 and DS3 Interfaces
STS-1 Interfaces
ISDN S/T-Interfaces
ISDN U-Interfaces
10/100 Ethernet
Circuit Diagram
Schematic & PIN Configuration
1
8
Pin 1 and 8
2
7
Pin 2, 3, 6,
and 7
Ground
3
6
4
5
Pin 4 and 5
SO-8 (Top View)
Revision 01/18/2008
1
www.semtech.com
LC03-6
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Two
High-Speed Data Lines
The LC03-6 is designed to protect two high-speed data
lines (one differential pair) from transient over-voltages
which result from lightning and ESD. The device can be
configured to protect in differential (Line-to-Line) and
common (Line-to-Ground) mode. Data line inputs/
outputs are connected at pins 1 to 8, and 4 to 5 as
shown. Pins 2, 3, 6, and 7 are connected to ground.
These pins should be connected directly to a ground
plane on the board for best results. The path length is
kept as short as possible to minimize parasitic induc-
tance. In applications where high common mode
voltages are present, differential protection is achieved
by leaving pins 2, 3, 6, and 7 not connected.
T1/E1 Linecard Protection (Intra-Building)
A typical T1/E1 linecard protection circuit is shown
below. The LC03-6 is connected between Tip and Ring
on the transmit and receive line pairs. It provides
protection to metallic and common mode lightning
surges per Bellcore 1089. This design takes advan-
tage of the isolation of the transformer to suppress
common mode surges. To complete the protection
circuit, the RClamp3304N (or RClamp0504N for 5V
supplies) is employed as the IC side protection ele-
ment. This device helps prevent the transceiver from
latching up by providing fine clamping of transients that
are coupled through the transformer. For further
information, reference Semtech application note
AN97-10.
T3/E3 and STS-1 Protection
The LC03-6 can also be used to protect T3/E3 and
STS-1 interfaces. The data lines from the BNC inter-
face are run through the LC03-6 (i.e. enters at pin 1
and exits at pin 8) with the ground connection made at
the other side of the device (pins 4 and 5). The center
pins (2, 3, 6, and 7) are not connected. In this configu-
ration, the LC03-6 adds less than 12pF of capacitance
to each line and provides surge protection to 100A
(tp=8/20µs).
Connection for Differential (Line-to-Line) and
Common Mode Protection (Line-to-Ground)
Connection for Differential Protection
(Line-to-Line)
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
2008 Semtech Corp.
5
www.semtech.com
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