The LSTTL / MSI SN54 / 74LS175 is a high speed Quad D Flip-Flop. The
device is useful for general flip-flop requirements where clock and clear inputs
are common. The information on the D inputs is stored during the LOW to
HIGH clock transition. Both true and complemented outputs of each flip-flop
are provided. A Master Reset input resets all flip-flops, independent of the
Clock or D inputs, when LOW.
The LS175 is fabricated with the Schottky barrier diode process for high
speed and is completely compatible with all Motorola TTL families.
SN54/74LS175
QUAD D FLIP-FLOP
LOW POWER SCHOTTKY
•
•
•
•
•
•
Edge-Triggered D-Type Inputs
Buffered-Positive Edge-Triggered Clock
Clock to Output Delays of 30 ns
Asynchronous Common Reset
True and Complement Output
Input Clamp Diodes Limit High Speed Termination Effects
CONNECTION DIAGRAM DIP
(TOP VIEW)
VCC
16
Q3
15
Q3
14
D3
13
D2
12
Q2
11
Q2
10
CP
9
NOTE:
The Flatpak version
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
16
1
J SUFFIX
CERAMIC
CASE 620-09
16
1
N SUFFIX
PLASTIC
CASE 648-08
1
MR
2
Q0
3
Q0
4
D0
5
D1
6
Q1
7
Q1
8
GND
PIN NAMES
LOADING
(Note a)
HIGH
LOW
0.25 U.L.
0.25 U.L.
0.25 U.L.
5 (2.5) U.L.
5 (2.5) U.L.
16
1
D SUFFIX
SOIC
CASE 751B-03
D0 – D3
CP
MR
Q0 – Q3
Q0 – Q3
Data Inputs
Clock (Active HIGH Going Edge) Input
Master Reset (Active LOW) Input
True Outputs (Note b)
Complemented Outputs (Note b)
0.5 U.L.
0.5 U.L.
0.5 U.L.
10 U.L.
10 U.L.
ORDERING INFORMATION
SN54LSXXXJ
SN74LSXXXN
SN74LSXXXD
Ceramic
Plastic
SOIC
NOTES:
a. 1 TTL Unit Load (U.L.) = 40
µA
HIGH/1.6 mA LOW.
b. The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
b.
Temperature Ranges.
LOGIC SYMBOL
4
5
12
13
LOGIC DIAGRAM
MR CP D3
1
9
13
D2
12
D1
5
D0
4
9
CP
D0
D1
D2
D3
D Q
CP Q
CD
14
15
D Q
CP Q
CD
11
10
D Q
CP Q
CD
6
7
D Q
CP Q
CD
3
2
1
MR
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
3
2
6
7
11
10 14
15
VCC = PIN 16
Q3 Q3
GND = PIN 8
= PIN NUMBERS
Q2 Q2
Q1Q1
Q0 Q0
VCC = PIN 16
GND = PIN 8
FAST AND LS TTL DATA
5-327
SN54/74LS175
FUNCTIONAL DESCRIPTION
The LS175 consists of four edge-triggered D flip-flops with
individual D inputs and Q and Q outputs. The Clock and
Master Reset are common. The four flip-flops will store the
state of their individual D inputs on the LOW to HIGH Clock
(CP) transition, causing individual Q and Q outputs to follow. A
LOW input on the Master Reset (MR) will force all Q outputs
LOW and Q outputs HIGH independent of Clock or Data
inputs.
The LS175 is useful for general logic applications where a
common Master Reset and Clock are acceptable.
TRUTH TABLE
Inputs (t = n, MR = H)
D
L
H
Outputs (t = n+1) Note 1
Q
L
H
Q
H
L
Note 1: t = n + 1 indicates conditions after next clock.
GUARANTEED OPERATING RANGES
Symbol
VCC
TA
IOH
IOL
Supply Voltage
Operating Ambient Temperature Range
Output Current — High
Output Current — Low
Parameter
54
74
54
74
54, 74
54
74
Min
4.5
4.75
– 55
0
Typ
5.0
5.0
25
25
Max
5.5
5.25
125
70
– 0.4
4.0
8.0
Unit
V
°C
mA
mA
DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE
(unless otherwise specified)
Limits
Symbol
VIH
VIL
VIK
VOH
Parameter
Input HIGH Voltage
54
Input LOW Voltage
74
Input Clamp Diode Voltage
54
Output HIGH Voltage
74
54, 74
VOL
Output LOW Voltage
74
Input HIGH Current
0.1
Input LOW Current
Short Circuit Current (Note 1)
Power Supply Current
– 20
– 0.4
– 100
18
0.35
0.5
20
IIH
IIL
IOS
ICC
V
µA
mA
mA
mA
mA
2.7
3.5
0.25
0.4
V
V
2.5
– 0.65
3.5
0.8
– 1.5
V
V
Min
2.0
0.7
V
Typ
Max
Unit
V
Test Conditions
Guaranteed Input HIGH Voltage for
All Inputs
Guaranteed Input LOW Voltage for
All Inputs
VCC = MIN, IIN = – 18 mA
VCC = MIN, IOH = MAX, VIN = VIH
or VIL per Truth Table
IOL = 4.0 mA
IOL = 8.0 mA
VCC = VCC MIN,
VIN = VIL or VIH
per Truth Table
VCC = MAX, VIN = 2.7 V
VCC = MAX, VIN = 7.0 V
VCC = MAX, VIN = 0.4 V
VCC = MAX
VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
FAST AND LS TTL DATA
5-328
SN54/74LS175
AC CHARACTERISTICS
(TA = 25°C)
Limits
Symbol
fMAX
tPLH
tPHL
tPLH
tPHL
Parameter
Maximum Input Clock Frequency
Propagation Delay, MR to Output
Propagation Delay, Clock to Output
Min
30
Typ
40
20
20
13
16
30
30
25
25
Max
Unit
MHz
ns
ns
VCC = 5.0 V
CL = 15 pF
Test Conditions
AC SETUP REQUIREMENTS
(TA = 25°C)
Limits
Symbol
tW
ts
th
trec
Parameter
Clock or MR Pulse Width
Data Setup Time
Data Hold Time
Recovery Time
Min
20
20
5.0
25
Typ
Max
Unit
ns
ns
ns
ns
VCC = 5.0 V
Test Conditions
AC WAVEFORMS
1/fmax
tw
CP
1.3 V
ts(H)
ts(L)
th(H)
1.3 V
1.3 V
tPLH
Q
1.3 V
tPHL
Q
1.3 V
1.3 V
MR
1.3 V
tW
1.3 V
trec
1.3 V
CP
Q
tPHL
1.3 V
tPLH
Q
1.3 V
1.3 V
1.3 V
th(L)
1.3 V
tPHL
1.3 V
tPLH
1.3 V
D
*
*The shaded areas indicate when the input is permitted to
*change
for predictable output performance.
Figure 1. Clock to Output Delays, Clock Pulse Width,
Frequency, Setup and Hold Times Data to Clock
Figure 2. Master Reset to Output Delay, Master Reset
Pulse Width, and Master Reset Recovery Time
DEFINITIONS OF TERMS
SETUP TIME (ts) — is defined as the minimum time required
for the correct logic level to be present at the logic input prior to
the clock transition from LOW to HIGH in order to be recog-
nized and transferred to the outputs.
HOLD TIME (th) — is defined as the minimum time following
the clock transition from LOW to HIGH that the logic level must
be maintained at the input in order to ensure continued recog-
nition. A negative HOLD TIME indicates that the correct logic
level may be released prior to the clock transition from LOW to
HIGH and still be recognized.
RECOVERY TIME (trec) — is defined as the minimum time
required between the end of the reset pulse and the clock
transition from LOW to HIGH in order to recognize and transfer
HIGH Data to the Q outputs.
FAST AND LS TTL DATA
5-329
-A-
Case 751B-03 D Suffix
16-Pin Plastic
SO-16
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
3.
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4.
MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5.
751B 01 IS OBSOLETE, NEW STANDARD
751B 03.
16
9
-B-
1
8
P
8 PL
0.25 (0.010)
M
B
M
R X 45°
G
-T-
D
16 PL
0.25 (0.010)
M
C
SEATING
PLANE
K
T
B
S
M
F
J
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
3.80
1.35
0.35
0.40
10.00
4.00
1.75
0.49
1.25
INCHES
MIN
MAX
0.386
0.150
0.054
0.014
0.016
0.393
0.157
0.068
0.019
0.049
1.27 BSC
0.19
0.10
0
0.25
0.25
7
0.050 BSC
0.008
0.004
0
0.009
0.009
7
°
°
°
°
5.80
0.25
6.20
0.50
0.229
0.010
0.244
0.019
Case 648-08 N Suffix
16-Pin Plastic
-A-
16
9
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
3.
CONTROLLING DIMENSION: INCH.
DIMENSION L" TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4.
DIMENSION B" DOES NOT INCLUDE MOLD
FLASH.
5.
6.
ROUNDED CORNERS OPTIONAL.
648 01 THRU 07 OBSOLETE, NEW STANDARD
648 08.
B
1
8
F
S
C
-T-
K
SEATING
PLANE
L
H
G
D
16 PL
0.25 (0.010)
M
J
M
T
A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MILLIMETERS
MIN
MAX
18.80
6.35
3.69
0.39
1.02
19.55
6.85
4.44
0.53
1.77
INCHES
MIN
MAX
0.740
0.250
0.145
0.015
0.040
0.770
0.270
0.175
0.021
0.070
2.54 BSC
1.27 BSC
0.21
2.80
7.50
0
0.38
3.30
7.74
10
0.100 BSC
0.050 BSC
0.008
0.110
0.295
0
0.015
0.130
0.305
10
°
°
°
°
0.51
1.01
0.020
0.040
-A-
16
9
Case 620-09 J Suffix
16-Pin Ceramic Dual In-Line
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-B-
1
8
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
C
L
5. 620 01 THRU 08 OBSOLETE, NEW STANDARD
620 09.
-T-
SEATING
PLANE
K
E
F
D
16 PL
0.25 (0.010)
M
N
G
T
A
S
M
J
16 PL
0.25 (0.010)
M
T
B
S
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MILLIMETERS
MIN
MAX
19.05
6.10
19.55
7.36
4.19
0.39
0.53
INCHES
MIN
MAX
0.750
0.240
0.770
0.290
0.165
0.015
0.021
1.27 BSC
1.40
1.77
0.050 BSC
0.055
0.070
2.54 BSC
0.23
0.27
5.08
7.62 BSC
0
0.100 BSC
0.009
0.011
0.200
0.300 BSC
0
°
15
°
°
15
°
0.39
0.88
0.015
0.035
FAST AND LS TTL DATA
5-330
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
Literature Distribution Centers:
USA: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036.
EUROPE: Motorola Ltd.; European Literature Centre; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England.
JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan.
ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.
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