EEWORLDEEWORLDEEWORLD

Part Number

Search

1210J1K00102JAB

Description
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.001uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size562KB,9 Pages
ManufacturerSyfer
Environmental Compliance  
Download Datasheet Parametric View All

1210J1K00102JAB Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.001uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

1210J1K00102JAB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 1210
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.001 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2 mm
JESD-609 codee3
length3.2 mm
Manufacturer's serial number1210
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance5%
Rated (DC) voltage (URdc)1000 V
GuidelineAEC-Q200
seriesAEC-Q200
size code1210
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width2.5 mm
Surface mount capacitors
1.1 to 1.3
1.1 - Production process flowchart
Ceramic powder
preparation
Electrode ink
material
1.2 - Syfer reliability grades
High reliability
(space quality)
Space
Grade
ESCC 3009
(1)
MIL Grade
(2)
IECQ-CECC
(3)
AEC-Q200
(4)
Standard components
Multilayer build
(wet process)
Fire
Standard
reliability
Rumble
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
Termination
(if specified)
Plating
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
Electrical test
Tandem
FlexiCap
TM
capacitors
(1)
Open Mode
FlexiCap
TM
capacitors
(2)
Standard FlexiCap
TM
capacitors
(3)
Standard MLC capacitor
(4)
High reliability
Test verification
Additional sample
Rel tests
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCap
TM
termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCap
TM
termination. By using
FlexiCap
TM
termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCap
TM
.
Packaging
4
Finished goods store
ADUC7060 UART
/************************************************************************** COMTX //UART transmit register. COMRX //UART receive register. COMDIV0 //UART standard baud rate generator divisor 0. COMIEN...
蓝雨夜 ADI Reference Circuit
The Academic Degrees Committee of the State Council voted to approve the proposal to "establish integrated circuit as a first-level discipline"!
According to industry insiders, the State Council Academic Degrees Committee meeting was held today (30th). The meeting voted to approve the proposal to establish integrated circuits as a first-level ...
eric_wang Talking
【Sensor Tag】"Weekly Plan_1' Sensor Tag Overview (Happy Tumber)
[font=宋体][size=5] [color=black] [b]Follow everyone's footsteps! According to the weekly plan submitted at that time, the first week "[font=微软雅黑]Sensor Tag[/font]" is mainly to understand the Sensor Ta...
风的世界 Wireless Connectivity
Digital Signal Processor (DSP) – Machine Vision Applications
DSPs bring computing performance, real-time processing, and energy efficiency to applications ranging from sensors to servers. What are digital signal processors used for? Check out these solutions fo...
fish001 DSP and ARM Processors
Application of ANSYS in the Design of Automobile Parts
1. Engine body The engine body is subjected to high thermal and mechanical loads at the same time. It is essentially a multi-physics field coupled working body. The multi-physics field analysis functi...
frozenviolet Automotive Electronics
I would like to ask about the Modelsim post-simulation error
[p=20, null, left][color=#222222][backcolor=rgb(238, 238, 238)][font=sans-serif][color=#494949][font=Arial, 宋体][size=12px]The simulation timing and functions before the program are correct[/size][/fon...
godjohsn FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 621  1167  568  641  2010  13  24  12  41  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号