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SL10055N6DL

Description
WOUND CHIP INDUCTOR
File Size451KB,6 Pages
ManufacturerABC [ABC Taiwan Electronics Corp]
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SL10055N6DL Overview

WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SL1005□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS:
A
B
C
:
:
:
:
1.00±0.1
0.50±0.1
0.50±0.1
0.20±0.1
m/m
m/m
m/m
m/m
A
C
D
D
D
B
0.4
0.5
0.4
Ⅱ﹒SCHEMATIC
DIAGRAM:
1.3
PCB Pattern
a
c
Ⅲ﹒MATERIALS:
a﹒Core:Ceramic
b﹒Wire
:Copper
c﹒Terminal:Solder coat over Ni plate (Lead content 100ppm max.)
d﹒Coating:Epoxy resin
e﹒Remark:Products comply with RoHS'
requirements
Peak Temp:260℃ max.
Max time above 230℃
:50sec
max.
Max time above 200℃
:70sec
max.
d
b
Ⅳ﹒GENERAL
SPECIFICATION:
a﹒Temp rise
:15℃
max
b﹒Rated current:Current cause inductance
c﹒Storage temp.:-40℃ ----+125℃
d﹒Operating temp.:-40℃----+105℃
e﹒Resistance to solder heat:260℃.10 secs.
Temperature (
)
250
Temperature
Rising Area
+4.0
/ sec max.
Preheat Area
150 ~ 200
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
/ sec max.
Peak Temperature:
260
0.5
50sec max.
230
drop within 10% max
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
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