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SMAJ11A

Description
400 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AC
Categorysemiconductor    Discrete semiconductor   
File Size158KB,4 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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SMAJ11A Overview

400 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AC

MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
SMAJ5.0
THRU
SMAJ440CA
400 Watt
Transient Voltage
Suppressors
5.0 to 440 Volts
DO-214AC
(SMA)( LEAD FRAME)
A
Features
For Surface Mount Applications
Unidirectional And Bidirectional
Low Inductance
High Temp Soldering: 260°C for 10 Seconds At Terminals
For Bidirectional Devices Add “C” To The Suffix
of
The Part
Number: i.e.SMAJ5.0CA for 5% Tolerance
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
UL Recognized File # E331408
0HFKDQLFDO'DWD
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL rating 1
Polarity: Indicated by cathode band except bi-directional types
0D[LPXP5DWLQJ
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Typical Thermal Resistance: 25 /W Junction to Ambient
C
B
F
H
Peak Pulse Current on
10/1000
Peak Pulse Power Dissipation
Steady State Power Dissipation
Peak Forward Surge Current
Note:
D
I
PPM
P
PPM
P
M(AV)
I
FSM
See Table 1 Note 2
E
DIMENSIONS
G
Min 400 W
1.0 W
40A
Note 2, 6
Note 2, 5
Note:5
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.157
.098
.006
.030
.188
.078
.055
.002
MAX
.181
.114
.012
.060
.208
.096
.062
.008
MM
MIN
4.00
2.50
0.152
0.76
4.80
2.00
1.40
0.051
MAX
4.60
2.90
0.305
1
..52
5.28
2.44
1.60
0.203
NOTE
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2. Non-repetitive current pulse, per Fig.3 and derated above
T
A
=25 per Fig.2.
3. Mounted on 5.0mm
2
copper pads to each terminal.
4. 8.3ms, single half sine wave duty cycle = 4 pulses per
Minutes maximum.
5. Lead temperature at T
L
= 75 .
6. Peak pulse power waveform is 10/1000 .
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
0.058 ” MI N
0.05
MI N
www.mccsemi.com
1 of 4
Revision:
12
2009/07/12
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