Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-40 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Other features | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; 2 STANDBY MODES |
| Address bus width | 16 |
| bit size | 8 |
| boundary scan | NO |
| CPU series | Z8 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| length | 52.325 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 4 |
| Number of I/O lines | 32 |
| Number of serial I/Os | 1 |
| Number of terminals | 40 |
| Number of timers | 2 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 236 |
| RAM (number of words) | 256 |
| rom(word) | 4096 |
| ROM programmability | MROM |
| Maximum seat height | 4.24 mm |
| speed | 12 MHz |
| Maximum slew rate | 30 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Z86C1112PSC | Z86C1112FSC | Z86C1112FSG | Z86C1112PSG | |
|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40 |
| Is it lead-free? | Contains lead | Contains lead | Lead free | Lead free |
| Parts packaging code | DIP | QFP | QFP | DIP |
| package instruction | PLASTIC, DIP-40 | PLASTIC, QFP-44 | PLASTIC, QFP-44 | PLASTIC, DIP-40 |
| Contacts | 40 | 44 | 44 | 40 |
| Reach Compliance Code | unknown | unknow | compli | compliant |
| Has ADC | NO | NO | NO | NO |
| Other features | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; 2 STANDBY MODES | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; 2 STANDBY MODES; OPTIONAL ROMLESS MODE | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; 2 STANDBY MODES; OPTIONAL ROMLESS MODE | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; 2 STANDBY MODES |
| Address bus width | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 |
| boundary scan | NO | NO | NO | NO |
| maximum clock frequency | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e3 | e3 |
| length | 52.325 mm | 10 mm | 10 mm | 52.325 mm |
| low power mode | YES | YES | YES | YES |
| Number of external interrupt devices | 4 | 4 | 4 | 4 |
| Number of I/O lines | 32 | 32 | 32 | 32 |
| Number of serial I/Os | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 44 | 44 | 40 |
| Number of timers | 2 | 2 | 2 | 2 |
| On-chip data RAM width | 8 | 8 | 8 | 8 |
| On-chip program ROM width | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP | QFP | DIP |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 225 | 260 | 225 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (number of words) | 256 | 256 | 256 | 256 |
| rom(word) | 4096 | 4096 | 4096 | 4096 |
| ROM programmability | MROM | MROM | MROM | MROM |
| Maximum seat height | 4.24 mm | 2.5 mm | 2.5 mm | 4.24 mm |
| speed | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| Maximum slew rate | 30 mA | 30 mA | 30 mA | 30 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | TIN |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 0.8 mm | 0.8 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 40 | 30 |
| width | 15.24 mm | 10 mm | 10 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Is it Rohs certified? | incompatible | incompatible | conform to | - |