EEWORLDEEWORLDEEWORLD

Part Number

Search

3-FIS132-04TG

Description
IC Socket, PGA132, 132 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size146KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

3-FIS132-04TG Overview

IC Socket, PGA132, 132 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

3-FIS132-04TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
ECCN codeEAR99
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.3 inch
subject depth0.12 inch
body length1.3 inch
Contact structure13X13
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA132
Shell materialGLASS FILLED EPOXY
JESD-609 codee0
Manufacturer's serial numberFIS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts132
Maximum operating temperature140 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Question: The power amplifier output waveform has crossover distortion
The high-speed current feedback op amp THS3091 is used as the power output stage. The single-stage THS3091 test is normal and can be amplified 10 times without distortion. However, after cascading, th...
hnlichong Analog electronics
Have questions about embedded systems?
color=#000000][b]I am a very stupid freshman, majoring in embedded system. Now I am very confused and don’t know how to develop. My ideal is to be an embedded system designer. 1. I don’t know much abo...
fuio Embedded System
I would like to ask an expert, the design is to pull up the NAND FLASH selection output signal nFCE and ce together to 1.8v, but after power-on, the CE pin is always at a low level.
I would like to ask an expert, the design is to pull up the NAND FLASH selection output signal nFCE and ce to 1.8v, but after power on, the CE pin is always low, that is, it is always selected. It sho...
woinwow Embedded System
Intelligent car infrared tracking problem
I am a novice. I installed the circuit according to the video, but I did not download and run the program. After turning on the switch for a while, I found that the battery was hot and water was flowi...
baymax334 Training Edition
NAND FLASH Problems
I can see the normal FLASH size information in the storage manager, but I can't see the partition information. After formatting, I can see the partition information and the drive letter, and I can cop...
65687831 Embedded System
How to Design a Voice Storage System Using FPGA
I just started learning VHDL recently. I need to use VHDL language programming to make a digital recording storage system based on FPGA. I use MAX7128 circuit board to make it. Which parts are needed?...
xwing185 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 632  12  2840  1251  2296  13  1  58  26  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号