EEWORLDEEWORLDEEWORLD

Part Number

Search

54111-410-09-2100LF

Description
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle,
CategoryThe connector    The connector   
File Size63KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

54111-410-09-2100LF Overview

Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle,

54111-410-09-2100LF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
body width0.094 inch
subject depth0.827 inch
body length0.9 inch
Body/casing typeRECEPTACLE
Connector typeBOARD CONNECTOR
Contact to complete cooperationSN ON NI
Contact completed and terminatedMatte Tin (Sn) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact styleSQ PIN-SKT
Insulation resistance5000000000 Ω
Insulator colorBLACK
insulator materialTHERMOPLASTIC
JESD-609 codee3
Manufacturer's serial number54111
Plug contact pitch0.1 inch
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number1
Number of rows loaded1
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
PCB contact patternRECTANGULAR
Plating thickness30u inch
Rated current (signal)3 A
GuidelineUL, CSA
reliabilityCOMMERCIAL
Terminal length0.095 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts9
PDM: Rev:E
STATUS:
Released
Printed: Jun 03, 2008
.
Altera SoC Experience Tour + Enpirion Altera SoC Power Supply Timing
The power-on sequence of the Lark Board's seemingly simple evaluation board seems simple, but it actually hides a lot of details. Although the EN pins seem to be connected to 5V, the power-on time is ...
flower_huanghua FPGA/CPLD
Comparison between EVC and VC2005 development
EVC and VC2005 are used to develop programs for smart devices. What are their advantages and disadvantages when compared with each other? Thank you everyone....
fjfzpeggy Embedded System
Instructions for making modules required for the competition
[i=s]This post was last edited by paulhyde on 2014-9-15 03:43[/i] This is what you want!!!...
aolaicecool Electronics Design Contest
Relay application patent
Does anyone know or understand the patent of such a relay? A patent for a relay with two sets of normally open contacts and its application in a three-phase AC system...
elvike Integrated technical exchanges
A DMA problem, experts come to take a look, thanks
There is a development board with an FPGA on it. There is a FIFO in the FPGA. Now DMA is used to transfer the data in the FIFO to the memory. The tool currently used is DS. If the FIFO is 1K in size, ...
sunxinyu Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1425  115  2517  1481  968  29  3  51  30  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号